ANALOG DEVICES INC
Analog Devices, Inc.（NASDAQ: ADI)是全球领先的半导体公司，致力于在现实世界与数字世界之间架起桥梁，以实现智能边缘领域的突破性创新。ADI提供结合模拟、数字和软件技术的解决方案，推动数字化工厂、汽车和数字医疗等领域的持续发展，应对气候变化挑战，并建立人与世界万物的可靠互联。ADI公司2022财年收入超过120亿美元，全球员工约2.5万人。
Product Lifecycle: 推荐用于新设计
Package: 12-Lead MSOP w/ EP,8-Lead SOIC (Narrow 0.15 Inch w/ EP)
# of Amps: 2
GBP (typ): 2.5MHz
Slew Rate (typ): 1.6V/us
Vos (typ): 500nV
Vos (max): 5µV
Vos TC (max): 25nV/°C
VNoise Density (typ): 9nV/rtHz
Current Noise Density (typ): 500fA/rtHz
1 Hz Inoise (typ): 1pA/rtHz
1 Hz Vnoise (typ): 9nV/rtHz
0.1 to 10 Hz VNoise (typ): 200nV p-p
Ibias (typ): 30pA
Ibias (max): 100pA
Ios (typ): 60pA
Ios (max): 200pA
Rail to Rail: In to V-, Output
Iq/Amp (typ): 950µA
Iq/Amp (max): 1.15mA
更多
Vs span (min): 4.75V
Vs span (max): 36V
CMRR (min): 123dB
Input Architecture: Zero Drift
PSRR DC (min): 140dB
PSRR DC (typ): 150dB
In V+ Headroom (typ): 1.5V
In V+ Headroom (max): 1.5V
In V- Headroom (typ): -100mV
In V- Headroom (max): -100mV
Out V+ Headroom (max): 16mV
Out V+ Headroom (typ): 5.5mV
Out V- Headroom (typ): 5mV
Out V- Headroom (max): 15mV
Aol (typ): 150dB
Min Stable Gain: 1V/V
Shutdown: Yes
Iout (typ): 30mA
Amp Features: Rail-to-Rail Output
Over-the-Top: No
Ccm (typ): 20pF
Cdiff (typ): 8pF
Open Loop Rout: 180Ohms
Feedback Type: Voltage
Package Area: 19.7911mm² (12-Lead MSOP w/ EP) (LTC2058HMSE#PBF)mm²
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
Temp Range: -40 to 125°C
Package Finish Code: E3
Package Height: 1.1mm (12-Lead MSOP w/ EP) (LTC2058HMSE#PBF)mm
Launch Date: 2018-07-18
Terminal Finish: E3
Temp Range Code: H,I
EP: No
Design Tools: LTspice
Product Lifecycle: 推荐用于新设计
Package: 8-WLCSP-N/A,Thin Dual Flatpack No Leads, Exposed Pad
# of Amps: 2
GBP (typ): 9kHz
BW -3 dB (typ): 9kHz
Slew Rate (typ): 64mV/us
Vos (max): 1.3mV
Vos TC (max): 88µV/°C
Ibias (max): 200pA
Rail to Rail: Output
Iq/Amp (typ): 400nA
Iq/Amp (max): 650nA
Vs span (min): 1.7V
Vs span (max): 5.5V
Shutdown: No
Amp Features: CMOS Inputs
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
Temp Range: -40 to 125°C
更多
Package Finish Code: E1, E3
Launch Date: 2018-04-05
Terminal Finish: E1, E3
Temp Range Code: A
EP: No
Design Tools: LTspice
Product Lifecycle: 推荐用于新设计
Package: 8-WLCSP-N/A,Thin Dual Flatpack No Leads, Exposed Pad
# of Amps: 2
GBP (typ): 9kHz
BW -3 dB (typ): 9kHz
Slew Rate (typ): 64mV/us
Vos (max): 1.3mV
Vos TC (max): 88µV/°C
Ibias (max): 200pA
Rail to Rail: Output
Iq/Amp (typ): 400nA
Iq/Amp (max): 650nA
Vs span (min): 1.7V
Vs span (max): 5.5V
Shutdown: No
Amp Features: CMOS Inputs
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
Temp Range: -40 to 125°C
更多
Package Finish Code: E1, E3
Launch Date: 2018-04-05
Terminal Finish: E1, E3
Temp Range Code: A
EP: No
Design Tools: LTspice
Product Lifecycle: 推荐用于新设计
Package: 8-WLCSP-N/A,Thin Dual Flatpack No Leads, Exposed Pad
# of Amps: 2
GBP (typ): 9kHz
BW -3 dB (typ): 9kHz
Slew Rate (typ): 64mV/us
Vos (max): 1.3mV
Vos TC (max): 88µV/°C
Ibias (max): 200pA
Rail to Rail: Output
Iq/Amp (typ): 400nA
Iq/Amp (max): 650nA
Vs span (min): 1.7V
Vs span (max): 5.5V
Shutdown: No
Amp Features: CMOS Inputs
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
Temp Range: -40 to 125°C
更多
Package Finish Code: E1, E3
Launch Date: 2018-04-05
Terminal Finish: E1, E3
Temp Range Code: A
EP: No
Design Tools: LTspice
Product Lifecycle: 推荐用于新设计
Package: 8-WLCSP-N/A,Thin Dual Flatpack No Leads, Exposed Pad
# of Amps: 2
GBP (typ): 9kHz
BW -3 dB (typ): 9kHz
Slew Rate (typ): 64mV/us
Vos (max): 1.3mV
Vos TC (max): 88µV/°C
Ibias (max): 200pA
Rail to Rail: Output
Iq/Amp (typ): 400nA
Iq/Amp (max): 650nA
Vs span (min): 1.7V
Vs span (max): 5.5V
Shutdown: No
Amp Features: CMOS Inputs
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
Temp Range: -40 to 125°C
更多
Package Finish Code: E1, E3
Launch Date: 2018-04-05
Terminal Finish: E1, E3
Temp Range Code: A
EP: No
Design Tools: LTspice
Product Lifecycle: 推荐用于新设计
Package: 8-WLCSP-N/A,Micro-MAX, Thin Shrink Small-Outline
# of Amps: 2
GBP (typ): 10MHz
BW -3 dB (typ): 10MHz
Slew Rate (typ): 3V/us
Vos (typ): 30µV
Vos (max): 350µV
Vos TC (typ): 300nV/°C
Vos TC (max): 6µV/°C
VNoise Density (typ): 5.5nV/rtHz
Current Noise Density (typ): 500aA/rtHz
0.1 to 10 Hz VNoise (typ): 1.7µV p-p
Ibias (typ): 300fA
Ibias (max): 260pA
Ios (typ): 100fA
Ios (max): 150pA
Rail to Rail: Output
Iq/Amp (typ): 2.2mA
Iq/Amp (max): 2.9mA
更多
Vs span (min): 2.7V
Vs span (max): 5.5V
CMRR (typ): 120dB
CMRR (min): 90dB
Input Architecture: CMOS
PSRR DC (min): 120dB
PSRR DC (typ): 90dB
In V+ Headroom (max): 1.5V
In V- Headroom (max): -200mV
Out V+ Headroom (max): 10mV
Out V- Headroom (max): 10mV
Aol (typ): 120dB
Min Stable Gain: 1V/V
Shutdown: Yes
Amp Features: CMOS Inputs, Shutdown
Over-the-Top: No
Settling Time 0.1% (typ): 2µs p-p
Feedback Type: Voltage
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
Temp Range: -40 to 125°C
Package Finish Code: E1, E3
Package Height: 1.1mm (Micro-MAX, Thin Shrink Small-Outline) (MAX40077AUA+)mm
Launch Date: 2018-03-19
Terminal Finish: E1, E3
Temp Range Code: A
EP: No
Design Tools: LTspice
Product Lifecycle: 推荐用于新设计
Package: 8-WLCSP-N/A,Micro-MAX, Thin Shrink Small-Outline
# of Amps: 2
GBP (typ): 10MHz
BW -3 dB (typ): 10MHz
Slew Rate (typ): 3V/us
Vos (typ): 30µV
Vos (max): 350µV
Vos TC (typ): 300nV/°C
Vos TC (max): 6µV/°C
VNoise Density (typ): 5.5nV/rtHz
Current Noise Density (typ): 500aA/rtHz
0.1 to 10 Hz VNoise (typ): 1.7µV p-p
Ibias (typ): 300fA
Ibias (max): 260pA
Ios (typ): 100fA
Ios (max): 150pA
Rail to Rail: Output
Iq/Amp (typ): 2.2mA
Iq/Amp (max): 2.9mA
更多
Vs span (min): 2.7V
Vs span (max): 5.5V
CMRR (typ): 120dB
CMRR (min): 90dB
Input Architecture: CMOS
PSRR DC (min): 120dB
PSRR DC (typ): 90dB
In V+ Headroom (max): 1.5V
In V- Headroom (max): -200mV
Out V+ Headroom (max): 10mV
Out V- Headroom (max): 10mV
Aol (typ): 120dB
Min Stable Gain: 1V/V
Shutdown: Yes
Amp Features: CMOS Inputs, Shutdown
Over-the-Top: No
Settling Time 0.1% (typ): 2µs p-p
Feedback Type: Voltage
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
Temp Range: -40 to 125°C
Package Finish Code: E1, E3
Package Height: 1.1mm (Micro-MAX, Thin Shrink Small-Outline) (MAX40077AUA+)mm
Launch Date: 2018-03-19
Terminal Finish: E1, E3
Temp Range Code: A
EP: No
Design Tools: LTspice
Product Lifecycle: 推荐用于新设计
Package: 8-WLCSP-N/A,Micro-MAX, Thin Shrink Small-Outline
# of Amps: 2
GBP (typ): 10MHz
BW -3 dB (typ): 10MHz
Slew Rate (typ): 3V/us
Vos (typ): 30µV
Vos (max): 350µV
Vos TC (typ): 300nV/°C
Vos TC (max): 6µV/°C
VNoise Density (typ): 5.5nV/rtHz
Current Noise Density (typ): 500aA/rtHz
0.1 to 10 Hz VNoise (typ): 1.7µV p-p
Ibias (typ): 300fA
Ibias (max): 260pA
Ios (typ): 100fA
Ios (max): 150pA
Rail to Rail: Output
Iq/Amp (typ): 2.2mA
Iq/Amp (max): 2.9mA
更多
Vs span (min): 2.7V
Vs span (max): 5.5V
CMRR (typ): 120dB
CMRR (min): 90dB
Input Architecture: CMOS
PSRR DC (min): 120dB
PSRR DC (typ): 90dB
In V+ Headroom (max): 1.5V
In V- Headroom (max): -200mV
Out V+ Headroom (max): 10mV
Out V- Headroom (max): 10mV
Aol (typ): 120dB
Min Stable Gain: 1V/V
Shutdown: Yes
Amp Features: CMOS Inputs, Shutdown
Over-the-Top: No
Settling Time 0.1% (typ): 2µs p-p
Feedback Type: Voltage
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
Temp Range: -40 to 125°C
Package Finish Code: E1, E3
Package Height: 1.1mm (Micro-MAX, Thin Shrink Small-Outline) (MAX40077AUA+)mm
Launch Date: 2018-03-19
Terminal Finish: E1, E3
Temp Range Code: A
EP: No
Design Tools: LTspice
Product Lifecycle: 推荐用于新设计
Package: 8-WLCSP-N/A,Micro-MAX, Thin Shrink Small-Outline
# of Amps: 2
GBP (typ): 10MHz
BW -3 dB (typ): 10MHz
Slew Rate (typ): 3V/us
Vos (typ): 30µV
Vos (max): 350µV
Vos TC (typ): 300nV/°C
Vos TC (max): 6µV/°C
VNoise Density (typ): 5.5nV/rtHz
Current Noise Density (typ): 500aA/rtHz
0.1 to 10 Hz VNoise (typ): 1.7µV p-p
Ibias (typ): 300fA
Ibias (max): 260pA
Ios (typ): 100fA
Ios (max): 150pA
Rail to Rail: Output
Iq/Amp (typ): 2.2mA
Iq/Amp (max): 2.9mA
更多
Vs span (min): 2.7V
Vs span (max): 5.5V
CMRR (typ): 120dB
CMRR (min): 90dB
Input Architecture: CMOS
PSRR DC (min): 120dB
PSRR DC (typ): 90dB
In V+ Headroom (max): 1.5V
In V- Headroom (max): -200mV
Out V+ Headroom (max): 10mV
Out V- Headroom (max): 10mV
Aol (typ): 120dB
Min Stable Gain: 1V/V
Shutdown: Yes
Amp Features: CMOS Inputs, Shutdown
Over-the-Top: No
Settling Time 0.1% (typ): 2µs p-p
Feedback Type: Voltage
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
Temp Range: -40 to 125°C
Package Finish Code: E1, E3
Package Height: 1.1mm (Micro-MAX, Thin Shrink Small-Outline) (MAX40077AUA+)mm
Launch Date: 2018-03-19
Terminal Finish: E1, E3
Temp Range Code: A
EP: No
Design Tools: LTspice
Product Lifecycle: 推荐用于新设计
Package: Thin Shrink Small-Outline Package
# of Amps: 4
GBP (typ): 10MHz
BW -3 dB (typ): 10MHz
Slew Rate (typ): 3V/us
Vos (typ): 30µV
Vos (max): 350µV
Vos TC (typ): 300nV/°C
Vos TC (max): 6µV/°C
VNoise Density (typ): 5.5nV/rtHz
Current Noise Density (typ): 500aA/rtHz
0.1 to 10 Hz VNoise (typ): 1.7µV p-p
Ibias (typ): 300fA
Ibias (max): 260pA
Ios (typ): 100fA
Ios (max): 150pA
Rail to Rail: Output
Iq/Amp (typ): 2.2mA
Iq/Amp (max): 2.9mA
更多
Vs span (min): 2.7V
Vs span (max): 5.5V
CMRR (typ): 120dB
CMRR (min): 90dB
PSRR DC (min): 120dB
PSRR DC (typ): 90dB
In V+ Headroom (max): 1.5V
In V- Headroom (max): -200mV
Out V+ Headroom (max): 10mV
Out V- Headroom (max): 10mV
Aol (typ): 120dB
Min Stable Gain: 1V/V
Shutdown: Yes
Amp Features: CMOS Inputs, Shutdown
Over-the-Top: No
Settling Time 0.1% (typ): 2µs p-p
Feedback Type: Voltage
Package Area: 33.405mm² (Thin Shrink Small-Outline Package) (MAX40078AUD+)mm²
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
Temp Range: -40 to 125°C
Package Finish Code: E3
Package Height: 1.1mm (Thin Shrink Small-Outline Package) (MAX40078AUD+)mm
Launch Date: 2018-03-19
Terminal Finish: E3
Temp Range Code: A
EP: No
Design Tools: LTspice