ANALOG DEVICES INC
Analog Devices, Inc.（NASDAQ: ADI)是全球领先的半导体公司，致力于在现实世界与数字世界之间架起桥梁，以实现智能边缘领域的突破性创新。ADI提供结合模拟、数字和软件技术的解决方案，推动数字化工厂、汽车和数字医疗等领域的持续发展，应对气候变化挑战，并建立人与世界万物的可靠互联。ADI公司2022财年收入超过120亿美元，全球员工约2.5万人。
Product Lifecycle: 推荐用于新设计
Package: CHIPS OR DIE,8-Lead SOIC,8-Lead MSOP
# of Amps: 2
GBP (typ): 3.5MHz
BW -3 dB (typ): 6MHz
Slew Rate (typ): 1.5V/us
Vos (typ): 2µV
Vos (max): 60µV
Vos TC (typ): 1µV/°C
VNoise Density (typ): 8nV/rtHz
Current Noise Density (typ): 200fA/rtHz
1 Hz Inoise (typ): 1.6pA/rtHz
1 Hz Vnoise (typ): 13nV/rtHz
0.1 to 10 Hz VNoise (typ): 175nV p-p
Ibias (typ): 300pA
Ibias (max): 1nA
Ios (typ): 100pA
Ios (max): 750pA
Rail to Rail: Output
Iq/Amp (typ): 500µA
更多
Iq/Amp (max): 580µA
Vs span (min): 10V
Vs span (max): 30V
CMRR (min): 128dB
Input Architecture: Bipolar
PSRR DC (min): 125dB
PSRR DC (typ): 145dB
In V+ Headroom (typ): 1.5V
In V+ Headroom (max): 1.5V
In V- Headroom (typ): 1.5V
In V- Headroom (max): 1.5V
Out V+ Headroom (max): 50mV
Out V+ Headroom (typ): 50mV
Out V- Headroom (typ): 50mV
Out V- Headroom (max): 50mV
Aol (typ): 110dB
Min Stable Gain: 1V/V
Shutdown: No
Iout (typ): 25mA
Amp Features: EMI Filter, Over Voltage Protection (OVP)
Over-the-Top: No
Ccm (typ): 8pF
Cdiff (typ): 1pF
Open Loop Rout: 300Ohms
Feedback Type: Voltage
Package Area: 16.48mm² (8-Lead MSOP) (ADA4177-2ARMZ)mm²
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
Reliability Level: DIE
Temp Range: -40 to 125°C
Package Finish Code: E3, NA
Package Height: 1.1mm (8-Lead MSOP) (ADA4177-2ARMZ)mm
Launch Date: 2014-10-14
Terminal Finish: E3, NA
Temp Range Code: NA
EP: No
Design Tools: LTspice
Product Lifecycle: 推荐用于新设计
Package: CHIPS OR DIE,8-Lead SOIC,8-Lead MSOP
# of Amps: 2
GBP (typ): 3.5MHz
BW -3 dB (typ): 6MHz
Slew Rate (typ): 1.5V/us
Vos (typ): 2µV
Vos (max): 60µV
Vos TC (typ): 1µV/°C
VNoise Density (typ): 8nV/rtHz
Current Noise Density (typ): 200fA/rtHz
1 Hz Inoise (typ): 1.6pA/rtHz
1 Hz Vnoise (typ): 13nV/rtHz
0.1 to 10 Hz VNoise (typ): 175nV p-p
Ibias (typ): 300pA
Ibias (max): 1nA
Ios (typ): 100pA
Ios (max): 750pA
Rail to Rail: Output
Iq/Amp (typ): 500µA
更多
Iq/Amp (max): 580µA
Vs span (min): 10V
Vs span (max): 30V
CMRR (min): 128dB
Input Architecture: Bipolar
PSRR DC (min): 125dB
PSRR DC (typ): 145dB
In V+ Headroom (typ): 1.5V
In V+ Headroom (max): 1.5V
In V- Headroom (typ): 1.5V
In V- Headroom (max): 1.5V
Out V+ Headroom (max): 50mV
Out V+ Headroom (typ): 50mV
Out V- Headroom (typ): 50mV
Out V- Headroom (max): 50mV
Aol (typ): 110dB
Min Stable Gain: 1V/V
Shutdown: No
Iout (typ): 25mA
Amp Features: EMI Filter, Over Voltage Protection (OVP)
Over-the-Top: No
Ccm (typ): 8pF
Cdiff (typ): 1pF
Open Loop Rout: 300Ohms
Feedback Type: Voltage
Package Area: 16.48mm² (8-Lead MSOP) (ADA4177-2ARMZ)mm²
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
Reliability Level: DIE
Temp Range: -40 to 125°C
Package Finish Code: E3, NA
Package Height: 1.1mm (8-Lead MSOP) (ADA4177-2ARMZ)mm
Launch Date: 2014-10-14
Terminal Finish: E3, NA
Temp Range Code: NA
EP: No
Design Tools: LTspice
Product Lifecycle: 推荐用于新设计
Package: CHIPS OR DIE,8-Lead SOIC,8-Lead MSOP
# of Amps: 2
GBP (typ): 3.5MHz
BW -3 dB (typ): 6MHz
Slew Rate (typ): 1.5V/us
Vos (typ): 2µV
Vos (max): 60µV
Vos TC (typ): 1µV/°C
VNoise Density (typ): 8nV/rtHz
Current Noise Density (typ): 200fA/rtHz
1 Hz Inoise (typ): 1.6pA/rtHz
1 Hz Vnoise (typ): 13nV/rtHz
0.1 to 10 Hz VNoise (typ): 175nV p-p
Ibias (typ): 300pA
Ibias (max): 1nA
Ios (typ): 100pA
Ios (max): 750pA
Rail to Rail: Output
Iq/Amp (typ): 500µA
更多
Iq/Amp (max): 580µA
Vs span (min): 10V
Vs span (max): 30V
CMRR (min): 128dB
Input Architecture: Bipolar
PSRR DC (min): 125dB
PSRR DC (typ): 145dB
In V+ Headroom (typ): 1.5V
In V+ Headroom (max): 1.5V
In V- Headroom (typ): 1.5V
In V- Headroom (max): 1.5V
Out V+ Headroom (max): 50mV
Out V+ Headroom (typ): 50mV
Out V- Headroom (typ): 50mV
Out V- Headroom (max): 50mV
Aol (typ): 110dB
Min Stable Gain: 1V/V
Shutdown: No
Iout (typ): 25mA
Amp Features: EMI Filter, Over Voltage Protection (OVP)
Over-the-Top: No
Ccm (typ): 8pF
Cdiff (typ): 1pF
Open Loop Rout: 300Ohms
Feedback Type: Voltage
Package Area: 16.48mm² (8-Lead MSOP) (ADA4177-2ARMZ)mm²
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
Reliability Level: DIE
Temp Range: -40 to 125°C
Package Finish Code: E3, NA
Package Height: 1.1mm (8-Lead MSOP) (ADA4177-2ARMZ)mm
Launch Date: 2014-10-14
Terminal Finish: E3, NA
Temp Range Code: NA
EP: No
Design Tools: LTspice
Product Lifecycle: 推荐用于新设计
Package: CHIPS OR DIE,8-Lead SOIC,8-Lead MSOP
# of Amps: 2
GBP (typ): 3.5MHz
BW -3 dB (typ): 6MHz
Slew Rate (typ): 1.5V/us
Vos (typ): 2µV
Vos (max): 60µV
Vos TC (typ): 1µV/°C
VNoise Density (typ): 8nV/rtHz
Current Noise Density (typ): 200fA/rtHz
1 Hz Inoise (typ): 1.6pA/rtHz
1 Hz Vnoise (typ): 13nV/rtHz
0.1 to 10 Hz VNoise (typ): 175nV p-p
Ibias (typ): 300pA
Ibias (max): 1nA
Ios (typ): 100pA
Ios (max): 750pA
Rail to Rail: Output
Iq/Amp (typ): 500µA
更多
Iq/Amp (max): 580µA
Vs span (min): 10V
Vs span (max): 30V
CMRR (min): 128dB
Input Architecture: Bipolar
PSRR DC (min): 125dB
PSRR DC (typ): 145dB
In V+ Headroom (typ): 1.5V
In V+ Headroom (max): 1.5V
In V- Headroom (typ): 1.5V
In V- Headroom (max): 1.5V
Out V+ Headroom (max): 50mV
Out V+ Headroom (typ): 50mV
Out V- Headroom (typ): 50mV
Out V- Headroom (max): 50mV
Aol (typ): 110dB
Min Stable Gain: 1V/V
Shutdown: No
Iout (typ): 25mA
Amp Features: EMI Filter, Over Voltage Protection (OVP)
Over-the-Top: No
Ccm (typ): 8pF
Cdiff (typ): 1pF
Open Loop Rout: 300Ohms
Feedback Type: Voltage
Package Area: 16.48mm² (8-Lead MSOP) (ADA4177-2ARMZ)mm²
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
Reliability Level: DIE
Temp Range: -40 to 125°C
Package Finish Code: E3, NA
Package Height: 1.1mm (8-Lead MSOP) (ADA4177-2ARMZ)mm
Launch Date: 2014-10-14
Terminal Finish: E3, NA
Temp Range Code: NA
EP: No
Design Tools: LTspice
Product Lifecycle: 推荐用于新设计
Package: CHIPS OR DIE,8-Lead SOIC,8-Lead MSOP
# of Amps: 2
GBP (typ): 3.5MHz
BW -3 dB (typ): 6MHz
Slew Rate (typ): 1.5V/us
Vos (typ): 2µV
Vos (max): 60µV
Vos TC (typ): 1µV/°C
VNoise Density (typ): 8nV/rtHz
Current Noise Density (typ): 200fA/rtHz
1 Hz Inoise (typ): 1.6pA/rtHz
1 Hz Vnoise (typ): 13nV/rtHz
0.1 to 10 Hz VNoise (typ): 175nV p-p
Ibias (typ): 300pA
Ibias (max): 1nA
Ios (typ): 100pA
Ios (max): 750pA
Rail to Rail: Output
Iq/Amp (typ): 500µA
更多
Iq/Amp (max): 580µA
Vs span (min): 10V
Vs span (max): 30V
CMRR (min): 128dB
Input Architecture: Bipolar
PSRR DC (min): 125dB
PSRR DC (typ): 145dB
In V+ Headroom (typ): 1.5V
In V+ Headroom (max): 1.5V
In V- Headroom (typ): 1.5V
In V- Headroom (max): 1.5V
Out V+ Headroom (max): 50mV
Out V+ Headroom (typ): 50mV
Out V- Headroom (typ): 50mV
Out V- Headroom (max): 50mV
Aol (typ): 110dB
Min Stable Gain: 1V/V
Shutdown: No
Iout (typ): 25mA
Amp Features: EMI Filter, Over Voltage Protection (OVP)
Over-the-Top: No
Ccm (typ): 8pF
Cdiff (typ): 1pF
Open Loop Rout: 300Ohms
Feedback Type: Voltage
Package Area: 16.48mm² (8-Lead MSOP) (ADA4177-2ARMZ)mm²
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
Reliability Level: DIE
Temp Range: -40 to 125°C
Package Finish Code: E3, NA
Package Height: 1.1mm (8-Lead MSOP) (ADA4177-2ARMZ)mm
Launch Date: 2014-10-14
Terminal Finish: E3, NA
Temp Range Code: NA
EP: No
Design Tools: LTspice
Product Lifecycle: 推荐用于新设计
Package: 8-Lead MSOP w/ EP,10-Lead DFN (3mm x 3mm w/ EP),CHIPS OR DIE
# of Amps: 2
GBP (typ): 500MHz
BW -3 dB (typ): 350MHz
Slew Rate (typ): 400V/us
Vos (typ): 200µV
Vos (max): 700µV
Vos TC (typ): 4µV/°C
VNoise Density (typ): 4.3nV/rtHz
Current Noise Density (typ): 5.5fA/rtHz
1 Hz Vnoise (typ): 42µV/rtHz
0.1 to 10 Hz VNoise (typ): 13µV p-p
Ibias (typ): 3fA
Ibias (max): 20fA
Ios (typ): 6fA
Ios (max): 40fA
Rail to Rail: In to V-, Output
Iq/Amp (typ): 16.5mA
Iq/Amp (max): 18mA
更多
Vs span (min): 3.1V
Vs span (max): 5.25V
CMRR (typ): 90dB
CMRR (min): 72dB
Input Architecture: CMOS
PSRR DC (min): 78dB
PSRR DC (typ): 95dB
In V+ Headroom (typ): 500mV
Out V+ Headroom (max): 140mV
Out V+ Headroom (typ): 70mV
Out V- Headroom (typ): 80mV
Out V- Headroom (max): 140mV
Aol (typ): 108dB
Min Stable Gain: 1V/V
Shutdown: Yes
Iout (typ): 90mA
Amp Features: Shutdown
Over-the-Top: No
Ccm (typ): 450fF
Cdiff (typ): 100fF
Open Loop Rout: 50Ohms
Settling Time 0.1% (typ): 17ns p-p
Feedback Type: Voltage
Package Area: 9mm² (10-Lead DFN (3mm x 3mm w/ EP)) (LTC6269HDD#PBF)mm²
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
Reliability Level: DIE
Temp Range: -40 to 125°C
Package Finish Code: E3, NA
Package Height: 0.75mm (10-Lead DFN (3mm x 3mm w/ EP)) (LTC6269HDD#PBF)mm
Launch Date: 2014-09-24
Terminal Finish: E3, NA
Temp Range Code: H,I,NA
EP: No
Design Tools: LTspice
Product Lifecycle: 推荐用于新设计
Package: 8-Lead MSOP w/ EP,10-Lead DFN (3mm x 3mm w/ EP),CHIPS OR DIE
# of Amps: 2
GBP (typ): 500MHz
BW -3 dB (typ): 350MHz
Slew Rate (typ): 400V/us
Vos (typ): 200µV
Vos (max): 700µV
Vos TC (typ): 4µV/°C
VNoise Density (typ): 4.3nV/rtHz
Current Noise Density (typ): 5.5fA/rtHz
1 Hz Vnoise (typ): 42µV/rtHz
0.1 to 10 Hz VNoise (typ): 13µV p-p
Ibias (typ): 3fA
Ibias (max): 20fA
Ios (typ): 6fA
Ios (max): 40fA
Rail to Rail: In to V-, Output
Iq/Amp (typ): 16.5mA
Iq/Amp (max): 18mA
更多
Vs span (min): 3.1V
Vs span (max): 5.25V
CMRR (typ): 90dB
CMRR (min): 72dB
Input Architecture: CMOS
PSRR DC (min): 78dB
PSRR DC (typ): 95dB
In V+ Headroom (typ): 500mV
Out V+ Headroom (max): 140mV
Out V+ Headroom (typ): 70mV
Out V- Headroom (typ): 80mV
Out V- Headroom (max): 140mV
Aol (typ): 108dB
Min Stable Gain: 1V/V
Shutdown: Yes
Iout (typ): 90mA
Amp Features: Shutdown
Over-the-Top: No
Ccm (typ): 450fF
Cdiff (typ): 100fF
Open Loop Rout: 50Ohms
Settling Time 0.1% (typ): 17ns p-p
Feedback Type: Voltage
Package Area: 9mm² (10-Lead DFN (3mm x 3mm w/ EP)) (LTC6269HDD#PBF)mm²
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
Reliability Level: DIE
Temp Range: -40 to 125°C
Package Finish Code: E3, NA
Package Height: 0.75mm (10-Lead DFN (3mm x 3mm w/ EP)) (LTC6269HDD#PBF)mm
Launch Date: 2014-09-24
Terminal Finish: E3, NA
Temp Range Code: H,I,NA
EP: No
Design Tools: LTspice
Product Lifecycle: 推荐用于新设计
Package: 8-Lead MSOP w/ EP,10-Lead DFN (3mm x 3mm w/ EP),CHIPS OR DIE
# of Amps: 2
GBP (typ): 500MHz
BW -3 dB (typ): 350MHz
Slew Rate (typ): 400V/us
Vos (typ): 200µV
Vos (max): 700µV
Vos TC (typ): 4µV/°C
VNoise Density (typ): 4.3nV/rtHz
Current Noise Density (typ): 5.5fA/rtHz
1 Hz Vnoise (typ): 42µV/rtHz
0.1 to 10 Hz VNoise (typ): 13µV p-p
Ibias (typ): 3fA
Ibias (max): 20fA
Ios (typ): 6fA
Ios (max): 40fA
Rail to Rail: In to V-, Output
Iq/Amp (typ): 16.5mA
Iq/Amp (max): 18mA
更多
Vs span (min): 3.1V
Vs span (max): 5.25V
CMRR (typ): 90dB
CMRR (min): 72dB
Input Architecture: CMOS
PSRR DC (min): 78dB
PSRR DC (typ): 95dB
In V+ Headroom (typ): 500mV
Out V+ Headroom (max): 140mV
Out V+ Headroom (typ): 70mV
Out V- Headroom (typ): 80mV
Out V- Headroom (max): 140mV
Aol (typ): 108dB
Min Stable Gain: 1V/V
Shutdown: Yes
Iout (typ): 90mA
Amp Features: Shutdown
Over-the-Top: No
Ccm (typ): 450fF
Cdiff (typ): 100fF
Open Loop Rout: 50Ohms
Settling Time 0.1% (typ): 17ns p-p
Feedback Type: Voltage
Package Area: 9mm² (10-Lead DFN (3mm x 3mm w/ EP)) (LTC6269HDD#PBF)mm²
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
Reliability Level: DIE
Temp Range: -40 to 125°C
Package Finish Code: E3, NA
Package Height: 0.75mm (10-Lead DFN (3mm x 3mm w/ EP)) (LTC6269HDD#PBF)mm
Launch Date: 2014-09-24
Terminal Finish: E3, NA
Temp Range Code: H,I,NA
EP: No
Design Tools: LTspice
Product Lifecycle: 推荐用于新设计
Package: 8-Lead MSOP w/ EP,10-Lead DFN (3mm x 3mm w/ EP),CHIPS OR DIE
# of Amps: 2
GBP (typ): 500MHz
BW -3 dB (typ): 350MHz
Slew Rate (typ): 400V/us
Vos (typ): 200µV
Vos (max): 700µV
Vos TC (typ): 4µV/°C
VNoise Density (typ): 4.3nV/rtHz
Current Noise Density (typ): 5.5fA/rtHz
1 Hz Vnoise (typ): 42µV/rtHz
0.1 to 10 Hz VNoise (typ): 13µV p-p
Ibias (typ): 3fA
Ibias (max): 20fA
Ios (typ): 6fA
Ios (max): 40fA
Rail to Rail: In to V-, Output
Iq/Amp (typ): 16.5mA
Iq/Amp (max): 18mA
更多
Vs span (min): 3.1V
Vs span (max): 5.25V
CMRR (typ): 90dB
CMRR (min): 72dB
Input Architecture: CMOS
PSRR DC (min): 78dB
PSRR DC (typ): 95dB
In V+ Headroom (typ): 500mV
Out V+ Headroom (max): 140mV
Out V+ Headroom (typ): 70mV
Out V- Headroom (typ): 80mV
Out V- Headroom (max): 140mV
Aol (typ): 108dB
Min Stable Gain: 1V/V
Shutdown: Yes
Iout (typ): 90mA
Amp Features: Shutdown
Over-the-Top: No
Ccm (typ): 450fF
Cdiff (typ): 100fF
Open Loop Rout: 50Ohms
Settling Time 0.1% (typ): 17ns p-p
Feedback Type: Voltage
Package Area: 9mm² (10-Lead DFN (3mm x 3mm w/ EP)) (LTC6269HDD#PBF)mm²
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
Reliability Level: DIE
Temp Range: -40 to 125°C
Package Finish Code: E3, NA
Package Height: 0.75mm (10-Lead DFN (3mm x 3mm w/ EP)) (LTC6269HDD#PBF)mm
Launch Date: 2014-09-24
Terminal Finish: E3, NA
Temp Range Code: H,I,NA
EP: No
Design Tools: LTspice
Product Lifecycle: 推荐用于新设计
Package: 8-Lead MSOP w/ EP,10-Lead DFN (3mm x 3mm w/ EP),CHIPS OR DIE
# of Amps: 2
GBP (typ): 500MHz
BW -3 dB (typ): 350MHz
Slew Rate (typ): 400V/us
Vos (typ): 200µV
Vos (max): 700µV
Vos TC (typ): 4µV/°C
VNoise Density (typ): 4.3nV/rtHz
Current Noise Density (typ): 5.5fA/rtHz
1 Hz Vnoise (typ): 42µV/rtHz
0.1 to 10 Hz VNoise (typ): 13µV p-p
Ibias (typ): 3fA
Ibias (max): 20fA
Ios (typ): 6fA
Ios (max): 40fA
Rail to Rail: In to V-, Output
Iq/Amp (typ): 16.5mA
Iq/Amp (max): 18mA
更多
Vs span (min): 3.1V
Vs span (max): 5.25V
CMRR (typ): 90dB
CMRR (min): 72dB
Input Architecture: CMOS
PSRR DC (min): 78dB
PSRR DC (typ): 95dB
In V+ Headroom (typ): 500mV
Out V+ Headroom (max): 140mV
Out V+ Headroom (typ): 70mV
Out V- Headroom (typ): 80mV
Out V- Headroom (max): 140mV
Aol (typ): 108dB
Min Stable Gain: 1V/V
Shutdown: Yes
Iout (typ): 90mA
Amp Features: Shutdown
Over-the-Top: No
Ccm (typ): 450fF
Cdiff (typ): 100fF
Open Loop Rout: 50Ohms
Settling Time 0.1% (typ): 17ns p-p
Feedback Type: Voltage
Package Area: 9mm² (10-Lead DFN (3mm x 3mm w/ EP)) (LTC6269HDD#PBF)mm²
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
Reliability Level: DIE
Temp Range: -40 to 125°C
Package Finish Code: E3, NA
Package Height: 0.75mm (10-Lead DFN (3mm x 3mm w/ EP)) (LTC6269HDD#PBF)mm
Launch Date: 2014-09-24
Terminal Finish: E3, NA
Temp Range Code: H,I,NA
EP: No
Design Tools: LTspice