ANALOG DEVICES INC
Analog Devices, Inc.(NASDAQ: ADI)是全球领先的半导体公司,致力于在现实世界与数字世界之间架起桥梁,以实现智能边缘领域的突破性创新。ADI提供结合模拟、数字和软件技术的解决方案,推动数字化工厂、汽车和数字医疗等领域的持续发展,应对气候变化挑战,并建立人与世界万物的可靠互联。ADI公司2022财年收入超过120亿美元,全球员工约2.5万人。
Product Lifecycle: 量产
Package: 5-SOT_23-N/A,Micro-MAX, Thin Shrink Small-Outline
# of Amps: 1
BW -3 dB (typ): 1MHz
Slew Rate (typ): 700mV/us
Vos (max): 7.5µV
VNoise Density (typ): 50nV/rtHz
Current Noise Density (typ): 100fA/rtHz
Ibias (max): 300pA
Rail to Rail: Output
Iq/Amp (typ): 100µA
Iq/Amp (max): 160µA
Vs span (min): 2.7V
Vs span (max): 36V
Shutdown: No
Amp Features: CMOS Inputs
Package Area: 9mm² (5-SOT_23-N/A) (MAX44244AUK+)mm²
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
更多
Temp Range: -40 to 125°C
Package Finish Code: E3
Package Height: 1.1mm (Micro-MAX, Thin Shrink Small-Outline) (MAX44244AUA+)mm
Launch Date: 2012-09-14
Terminal Finish: E3
Temp Range Code: A
EP: No
Design Tools: LTspice
Product Lifecycle: 量产
Package: 5-SOT_23-N/A,Micro-MAX, Thin Shrink Small-Outline
# of Amps: 1
BW -3 dB (typ): 1MHz
Slew Rate (typ): 700mV/us
Vos (max): 7.5µV
VNoise Density (typ): 50nV/rtHz
Current Noise Density (typ): 100fA/rtHz
Ibias (max): 300pA
Rail to Rail: Output
Iq/Amp (typ): 100µA
Iq/Amp (max): 160µA
Vs span (min): 2.7V
Vs span (max): 36V
Shutdown: No
Amp Features: CMOS Inputs
Package Area: 9mm² (5-SOT_23-N/A) (MAX44244AUK+)mm²
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
更多
Temp Range: -40 to 125°C
Package Finish Code: E3
Package Height: 1.1mm (Micro-MAX, Thin Shrink Small-Outline) (MAX44244AUA+)mm
Launch Date: 2012-09-14
Terminal Finish: E3
Temp Range Code: A
EP: No
Design Tools: LTspice
Product Lifecycle: 推荐用于新设计
Package: 14-SOIC_N-150_MIL,Thin Shrink Small-Outline Package
# of Amps: 4
BW -3 dB (typ): 1MHz
Slew Rate (typ): 700mV/us
Vos (max): 7.5µV
VNoise Density (typ): 50nV/rtHz
Current Noise Density (typ): 100fA/rtHz
Ibias (max): 300pA
Rail to Rail: Output
Iq/Amp (typ): 90µA
Iq/Amp (max): 130µA
Vs span (min): 2.7V
Vs span (max): 36V
Shutdown: No
Amp Features: CMOS Inputs
Package Area: 33.405mm² (Thin Shrink Small-Outline Package) (MAX44245AUD+)mm²
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
更多
Temp Range: -40 to 125°C
Package Finish Code: E3
Package Height: 1.1mm (Thin Shrink Small-Outline Package) (MAX44245AUD+)mm
Launch Date: 2012-09-14
Terminal Finish: E3
Temp Range Code: A
EP: No
Design Tools: LTspice
Product Lifecycle: 推荐用于新设计
Package: 14-SOIC_N-150_MIL,Thin Shrink Small-Outline Package
# of Amps: 4
BW -3 dB (typ): 1MHz
Slew Rate (typ): 700mV/us
Vos (max): 7.5µV
VNoise Density (typ): 50nV/rtHz
Current Noise Density (typ): 100fA/rtHz
Ibias (max): 300pA
Rail to Rail: Output
Iq/Amp (typ): 90µA
Iq/Amp (max): 130µA
Vs span (min): 2.7V
Vs span (max): 36V
Shutdown: No
Amp Features: CMOS Inputs
Package Area: 33.405mm² (Thin Shrink Small-Outline Package) (MAX44245AUD+)mm²
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
更多
Temp Range: -40 to 125°C
Package Finish Code: E3
Package Height: 1.1mm (Thin Shrink Small-Outline Package) (MAX44245AUD+)mm
Launch Date: 2012-09-14
Terminal Finish: E3
Temp Range Code: A
EP: No
Design Tools: LTspice
Product Lifecycle: 推荐用于新设计
Package: 14-SOIC_N-150_MIL,Thin Shrink Small-Outline Package
# of Amps: 4
BW -3 dB (typ): 1MHz
Slew Rate (typ): 700mV/us
Vos (max): 7.5µV
VNoise Density (typ): 50nV/rtHz
Current Noise Density (typ): 100fA/rtHz
Ibias (max): 300pA
Rail to Rail: Output
Iq/Amp (typ): 90µA
Iq/Amp (max): 130µA
Vs span (min): 2.7V
Vs span (max): 36V
Shutdown: No
Amp Features: CMOS Inputs
Package Area: 33.405mm² (Thin Shrink Small-Outline Package) (MAX44245AUD+)mm²
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
更多
Temp Range: -40 to 125°C
Package Finish Code: E3
Package Height: 1.1mm (Thin Shrink Small-Outline Package) (MAX44245AUD+)mm
Launch Date: 2012-09-14
Terminal Finish: E3
Temp Range Code: A
EP: No
Design Tools: LTspice
Product Lifecycle: 推荐用于新设计
Package: 14-SOIC_N-150_MIL,Thin Shrink Small-Outline Package
# of Amps: 4
BW -3 dB (typ): 1MHz
Slew Rate (typ): 700mV/us
Vos (max): 7.5µV
VNoise Density (typ): 50nV/rtHz
Current Noise Density (typ): 100fA/rtHz
Ibias (max): 300pA
Rail to Rail: Output
Iq/Amp (typ): 90µA
Iq/Amp (max): 130µA
Vs span (min): 2.7V
Vs span (max): 36V
Shutdown: No
Amp Features: CMOS Inputs
Package Area: 33.405mm² (Thin Shrink Small-Outline Package) (MAX44245AUD+)mm²
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
更多
Temp Range: -40 to 125°C
Package Finish Code: E3
Package Height: 1.1mm (Thin Shrink Small-Outline Package) (MAX44245AUD+)mm
Launch Date: 2012-09-14
Terminal Finish: E3
Temp Range Code: A
EP: No
Design Tools: LTspice
Product Lifecycle: 量产
# of Amps: 2
GBP (typ): 5MHz
BW -3 dB (typ): 5MHz
Slew Rate (typ): 3.8V/us
Vos (max): 5µV
VNoise Density (typ): 9nV/rtHz
Ibias (max): 600pA
Rail to Rail: Output
Iq/Amp (typ): 420µA
Iq/Amp (max): 550µA
Vs span (min): 2.7V
Vs span (max): 36V
Shutdown: No
Amp Features: CMOS Inputs
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
Temp Range: -40 to 125°C
Package Finish Code: E3, NA
更多
Package Height: 1.1mm (Micro-MAX, Thin Shrink Small-Outline) (MAX44246AUA+)mm
Launch Date: 2012-09-14
Terminal Finish: E3, NA
Temp Range Code: A,E
EP: No
Design Tools: LTspice
Product Lifecycle: 量产
# of Amps: 2
GBP (typ): 5MHz
BW -3 dB (typ): 5MHz
Slew Rate (typ): 3.8V/us
Vos (max): 5µV
VNoise Density (typ): 9nV/rtHz
Ibias (max): 600pA
Rail to Rail: Output
Iq/Amp (typ): 420µA
Iq/Amp (max): 550µA
Vs span (min): 2.7V
Vs span (max): 36V
Shutdown: No
Amp Features: CMOS Inputs
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
Temp Range: -40 to 125°C
Package Finish Code: E3, NA
更多
Package Height: 1.1mm (Micro-MAX, Thin Shrink Small-Outline) (MAX44246AUA+)mm
Launch Date: 2012-09-14
Terminal Finish: E3, NA
Temp Range Code: A,E
EP: No
Design Tools: LTspice
Product Lifecycle: 量产
# of Amps: 2
GBP (typ): 5MHz
BW -3 dB (typ): 5MHz
Slew Rate (typ): 3.8V/us
Vos (max): 5µV
VNoise Density (typ): 9nV/rtHz
Ibias (max): 600pA
Rail to Rail: Output
Iq/Amp (typ): 420µA
Iq/Amp (max): 550µA
Vs span (min): 2.7V
Vs span (max): 36V
Shutdown: No
Amp Features: CMOS Inputs
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
Temp Range: -40 to 125°C
Package Finish Code: E3, NA
更多
Package Height: 1.1mm (Micro-MAX, Thin Shrink Small-Outline) (MAX44246AUA+)mm
Launch Date: 2012-09-14
Terminal Finish: E3, NA
Temp Range Code: A,E
EP: No
Design Tools: LTspice
Product Lifecycle: 量产
# of Amps: 2
GBP (typ): 5MHz
BW -3 dB (typ): 5MHz
Slew Rate (typ): 3.8V/us
Vos (max): 5µV
VNoise Density (typ): 9nV/rtHz
Ibias (max): 600pA
Rail to Rail: Output
Iq/Amp (typ): 420µA
Iq/Amp (max): 550µA
Vs span (min): 2.7V
Vs span (max): 36V
Shutdown: No
Amp Features: CMOS Inputs
Eval / Ref Circuit: Evaluation board
Export Classification: EAR99
Automotive: No
Temp Range: -40 to 125°C
Package Finish Code: E3, NA
更多
Package Height: 1.1mm (Micro-MAX, Thin Shrink Small-Outline) (MAX44246AUA+)mm
Launch Date: 2012-09-14
Terminal Finish: E3, NA
Temp Range Code: A,E
EP: No
Design Tools: LTspice