Interfaces: Parallel Operating Temperature max: 85.0°C Operating Voltage: 3.0V Family: PL-J Peak Reflow Temp: 260.0°C Initial Access Time: 80.0ns Interface Frequency (SDR/DDR)(MHz): NA Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 128.0MBit

Family: PL-J Initial Access Time: 70.0ns Interface Frequency (SDR/DDR)(MHz): - Interfaces: Parallel Operating Voltage: 3.0V Operating Temperature max: 85.0°C Peak Reflow Temp: 260.0°C Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 128.0MBit

Interface Frequency (SDR/DDR)(MHz): NA Interfaces: Parallel Operating Temperature max: 85.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Family: JL-J Initial Access Time: 60.0ns Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Density: 64.0MBit

Family: PL-J Initial Access Time: 60.0ns Operating Voltage: 3.0V Page Access Time: 20.0ns Peak Reflow Temp: 260.0°C Interface Frequency (SDR/DDR)(MHz): NA Interfaces: Parallel Operating Temperature max: 85.0°C Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 64.0MBit

Family: PL-J Initial Access Time: 60.0ns Interfaces: Parallel Operating Temperature max: 85.0°C Operating Voltage: 3.0V Page Access Time: 25.0ns Peak Reflow Temp: 260.0°C Interface Frequency (SDR/DDR)(MHz): NA Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Density: 128.0MBit

Family: PL-J Initial Access Time: 60.0ns Interface Frequency (SDR/DDR)(MHz): NA Interfaces: Parallel Operating Voltage: 3.0V Page Access Time: 20.0ns Peak Reflow Temp: 260.0°C Operating Temperature max: 85.0°C Qualification: Wireless Lead Ball Finish: Sn/Ag/Cu Density: 64.0MBit

Family: JL-J Initial Access Time: 70.0ns Interface Frequency (SDR/DDR)(MHz): NA Interfaces: Parallel Operating Temperature max: 85.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Qualification: Industrial Lead Ball Finish: Matte Tin Plating Density: 32.0MBit

Family: PL-J Initial Access Time: 70.0ns Interfaces: Parallel Operating Temperature max: 85.0°C Operating Voltage: 3.0V Page Access Time: 20.0ns Peak Reflow Temp: 260.0°C Interface Frequency (SDR/DDR)(MHz): NA Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Density: 32.0MBit

最小包装: 1000pcs 包装: Bulk packing 封装/外壳: Housings 长x宽/尺寸: 7.50 x 10.50mm