NVM / 凌捷掩膜: 800.0kByte
Asymmetric Cryptography: ECC up to 521-bit
Asymmetric Cryptography: RSA up to 4096-bit
CPU: 32-bit
Certifications: CC EAL5+ high
Certifications: EMVCo
RAM: 32.0kByte
Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
Leading Technologies: NFC optimized
Leading Technologies: SOLID FLASH™
Ambient Temperature max: 85.0°C
Applications: SIM and UICC for mobile communication
Delivery Forms: sawn wafer
Delivery Forms: SMD
Interfaces: ISO 7816
Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1)
Interfaces: SWP
Package: VQFN-8
Product Description: 32-bit SWP SIM card security cryptocontroller
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Use Cases: NFC embedded Secure Element
Use Cases: SIM and UICC for mobile communication
Use Cases: SWP UICC for NFC
NVM / 凌捷掩膜: 800.0kByte
Asymmetric Cryptography: ECC up to 521-bit
Asymmetric Cryptography: RSA up to 4096-bit
CPU: 32-bit
Certifications: CC EAL5+ high
Certifications: EMVCo
RAM: 32.0kByte
Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
Leading Technologies: SOLID FLASH™
Ambient Temperature max: 85.0°C
Delivery Forms: sawn wafer
Interfaces: ISO 7816
Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1)
Interfaces: SWP
Interfaces: USB
Product Description: 32-bit USB and SWP SIM card security cryptocontroller
Use Cases: SIM and UICC for mobile communication
Applications: SIM and UICC for mobile communication
Delivery Forms: SMD
NVM / 凌捷掩膜: 1.0MByte
Asymmetric Cryptography: ECC up to 521-bit
Asymmetric Cryptography: RSA up to 4096-bit
CPU: 32-bit
Certifications: CC EAL5+ high
Certifications: EMVCo
RAM: 32.0kByte
Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
Leading Technologies: SOLID FLASH™
Ambient Temperature max: 85.0°C
Applications: SIM and UICC for mobile communication
Delivery Forms: sawn wafer
Delivery Forms: SMD
Interfaces: ISO 7816
Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1)
Interfaces: SWP
Interfaces: USB
Product Description: 32-bit USB and SWP SIM card security cryptocontroller
Use Cases: SIM and UICC for mobile communication
NVM / 凌捷掩膜: 1.3MByte
Asymmetric Cryptography: ECC up to 521-bit
Asymmetric Cryptography: RSA up to 4096-bit
CPU: 32-bit
Certifications: CC EAL5+ high
Certifications: EMVCo
RAM: 32.0kByte
Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
Leading Technologies: SOLID FLASH™
Ambient Temperature max: 85.0°C
Applications: SIM and UICC for mobile communication
Delivery Forms: sawn wafer
Interfaces: ISO 7816
Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1)
Interfaces: SWP
Interfaces: USB
Product Description: 32-bit USB and SWP SIM card security cryptocontroller
Use Cases: SIM and UICC for mobile communication
Delivery Forms: SMD
NVM / 凌捷掩膜: 1.5MByte
Asymmetric Cryptography: ECC up to 521-bit
Asymmetric Cryptography: RSA up to 4096-bit
CPU: 32-bit
Certifications: CC EAL5+ high
Certifications: EMVCo
RAM: 32.0kByte
Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
Leading Technologies: SOLID FLASH™
Ambient Temperature max: 85.0°C
Applications: SIM and UICC for mobile communication
Delivery Forms: sawn wafer
Interfaces: ISO 7816
Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1)
Interfaces: SWP
Interfaces: USB
Product Description: 32-bit USB and SWP SIM card security cryptocontroller
Use Cases: SIM and UICC for mobile communication
Delivery Forms: SMD
NVM / 凌捷掩膜: 500.0kByte
Asymmetric Cryptography: ECC up to 521-bit
Asymmetric Cryptography: RSA up to 4096-bit
CPU: Dual 16-bit
Certifications: CC EAL6+ high
Certifications: EMVCo
RAM: 8.0kByte
Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
Symmetric Cryptography: ECC
Symmetric Cryptography: RSA
User ROM: 182.0kByte
Leading Technologies: Integrity Guard
Leading Technologies: NFC optimized
Leading Technologies: SOLID FLASH™
Ambient Temperature max: 85.0°C
Applications: NFC
Delivery Forms: sawn wafer
Interfaces: ACLB
Interfaces: GPIOs
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Interfaces: ISO 7816
Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1)
Interfaces: SPI
Product Description: Boosted NFC secure element (SE)
NVM / 凌捷掩膜: 500.0kByte
Asymmetric Cryptography: ECC up to 521-bit
Asymmetric Cryptography: RSA up to 4096-bit
CPU: Dual 16-bit
Certifications: CC EAL6+ high
Certifications: EMVCo
RAM: 18.0kByte
Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
Symmetric Cryptography: ECC
Symmetric Cryptography: RSA
User ROM: 182.0kByte
Leading Technologies: Integrity Guard
Leading Technologies: NFC optimized
Leading Technologies: SOLID FLASH™
Ambient Temperature max: 85.0°C
Applications: NFC
Delivery Forms: sawn wafer
Interfaces: ACLB
Interfaces: GPIOs
更多
Interfaces: ISO 7816
Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1)
Interfaces: SPI
Product Description: Boosted NFC secure element (SE)
NVM / 凌捷掩膜: 500.0kByte
Asymmetric Cryptography: ECC up to 521-bit
Asymmetric Cryptography: RSA up to 4096-bit
CPU: Dual 16-bit
Certifications: CC EAL6+ high
Certifications: EMVCo
RAM: 18.0kByte
Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
Symmetric Cryptography: ECC
Symmetric Cryptography: RSA
Leading Technologies: Integrity Guard
Leading Technologies: NFC optimized
Leading Technologies: SOLID FLASH™
Ambient Temperature max: 85.0°C
Applications: NFC
Delivery Forms: sawn wafer
Interfaces: ACLB
Interfaces: GPIOs
Interfaces: ISO 7816
更多
Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1)
Interfaces: SPI
Product Description: Boosted NFC secure element (SE)
NVM / 凌捷掩膜: 500.0kByte
Asymmetric Cryptography: ECC up to 521-bit
Asymmetric Cryptography: RSA up to 4096-bit
CPU: Dual 16-bit
Certifications: CC EAL6+ high
Certifications: EMVCo
RAM: 8.0kByte
Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
Symmetric Cryptography: ECC
Symmetric Cryptography: RSA
Leading Technologies: Integrity Guard
Leading Technologies: NFC optimized
Leading Technologies: SOLID FLASH™
Ambient Temperature max: 85.0°C
Applications: NFC
Delivery Forms: sawn wafer
Interfaces: ACLB
Interfaces: GPIOs
Interfaces: ISO 7816
更多
Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1)
Interfaces: SPI
Product Description: Boosted NFC secure element (SE)
NVM / 凌捷掩膜: 628.0kByte
Asymmetric Cryptography: ECC up to 521-bit
Asymmetric Cryptography: RSA up to 4096-bit
CPU: Dual 16-bit
Certifications: CC EAL6+ high
Certifications: EMVCo
RAM: 12.0kByte
Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
Symmetric Cryptography: ECC
Symmetric Cryptography: RSA
Leading Technologies: Integrity Guard
Leading Technologies: NFC optimized
Leading Technologies: SOLID FLASH™
Ambient Temperature max: 85.0°C
User ROM: 444.0kByte
Applications: NFC
Delivery Forms: sawn wafer
Interfaces: ACLB
Interfaces: I2C
更多
Interfaces: ISO 7816
Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1)
Product Description: Boosted NFC secure element (SE)