Channels: 2.0 Configuration: High-side and low-side VS: NoneV Supply Voltage: NoneV tf: 17.0ns toff: 100.0ns ton: 120.0ns tr: 25.0ns OverClocking: Delay Matching 20 (ns) TID: NoneKrad(Si) Bias Supply Voltage: NoneV SEE: 81.9MeV∙cm2/mg Package: Die in waffle pack Output Voltage: NoneV Voltage Class: 100.0V Language: SPICE Product Category: HiRel Power ICs

Channels: 2.0 Configuration: High-side and low-side VS: NoneV Supply Voltage: NoneV tf: 17.0ns toff: 100.0ns ton: 120.0ns tr: 25.0ns OverClocking: Delay Matching 20 (ns) TID: NoneKrad(Si) Bias Supply Voltage: NoneV Package: MO-036AB SEE: 81.9MeV∙cm2/mg Output Voltage: NoneV Voltage Class: 100.0V Language: SPICE Product Category: HiRel Power ICs

Output Voltage: 10.0V Configuration: HI & LO MOS Drivers VS: NoneV Package: 18-pin LCC Supply Voltage: 20.0V

Output Voltage: 10.0V Configuration: HI & LO MOS Drivers VS: NoneV Package: MO-036AB Supply Voltage: 20.0V

Output Voltage: 10.0V Configuration: HI & LO MOS Drivers VS: NoneV Package: 18-pin LCC Supply Voltage: 20.0V

Output Voltage: 10.0V Configuration: HI & LO MOS Drivers VS: NoneV Package: MO-036AB Supply Voltage: 20.0V

Output Voltage: 10.0V Configuration: HI & LO MOS Drivers VS: NoneV Package: MO-036AB Supply Voltage: 20.0V

Output Voltage: 10.0V Configuration: HI & LO MOS Drivers VS: NoneV Package: 18-pin LCC Supply Voltage: 20.0V

Output Voltage: 10.0V Configuration: HI & LO MOS Drivers VS: NoneV Package: MO-036AB Supply Voltage: 20.0V

Output Voltage: 10.0V Configuration: HI & LO MOS Drivers VS: NoneV Package: 18-pin LCC Supply Voltage: 20.0V