Interfaces: Quad SPI
Operating Temperature max: 125.0°C
Operating Voltage: 1.8V
Peak Reflow Temp: 260.0°C
Family: HS-T
Interface Frequency (SDR/DDR)(MHz): 133 / 66
Interface Bandwidth: 66.0MByte/s
Qualification: Automotive
Lead Ball Finish: Sn/Ag/Cu
Classification: ISO 26262-compliant
Density: 512.0MBit
Currently planned availability until at least: 2035
Family: HL-T
Interface Frequency (SDR/DDR)(MHz): 133 / 66
Interfaces: Quad SPI
Operating Voltage: 3.0V
Peak Reflow Temp: 260.0°C
Operating Temperature max: 105.0°C
Interface Bandwidth: 66.0MByte/s
Qualification: Automotive
Lead Ball Finish: Sn/Ag/Cu
Classification: ISO 26262-compliant
Density: 512.0MBit
Currently planned availability until at least: 2035
S25FS256TDAWEC109
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)
描述: 256Mb SEMPER™ Nano 1.8V QSPI Flash in known good wafer format
Family: FS-T
Interface Frequency (SDR/DDR)(MHz): 80 / -
Operating Voltage: 1.8V
Interface Bandwidth: 40.0MByte/s
Interfaces: Quad SPI
Operating Temperature max: 70.0°C
Qualification: Commercial
Density: 256.0MBit
Currently planned availability until at least: 2033
Density: 32.0MBit
Family: JL-J
Initial Access Time: 70.0ns
Interface Frequency (SDR/DDR)(MHz): NA
Interfaces: Parallel
Lead Ball Finish: Sn/Ag/Cu
Operating Temperature max: 85.0°C
Operating Voltage: 3.0V
Peak Reflow Temp: 260.0°C
Qualification: Industrial
Initial Access Time: 70.0ns
Interface Frequency (SDR/DDR)(MHz): NA
Interfaces: Parallel
Operating Voltage: 3.0V
Peak Reflow Temp: 260.0°C
Operating Temperature max: 85.0°C
Family: PL-J
Page Access Time: 20.0ns
Qualification: Industrial
Lead Ball Finish: Sn/Ag/Cu
Density: 32.0MBit
Family: PL-J
Initial Access Time: 70.0ns
Interface Frequency (SDR/DDR)(MHz): NA
Interfaces: Parallel
Operating Temperature max: 85.0°C
Page Access Time: 20.0ns
Peak Reflow Temp: 260.0°C
Operating Voltage: 3.0V
Qualification: Wireless
Lead Ball Finish: Sn/Ag/Cu
Density: 64.0MBit
Operating Voltage: 3.0V
Family: PL-J
Interface Frequency (SDR/DDR)(MHz): NA
Interfaces: Parallel
Peak Reflow Temp: 260.0°C
Operating Temperature max: 85.0°C
Page Access Time: 20.0ns
Initial Access Time: 70.0ns
Qualification: Industrial
Lead Ball Finish: Sn/Ag/Cu
Density: 64.0MBit
Initial Access Time: 70.0ns
Family: PL-J
Interface Frequency (SDR/DDR)(MHz): NA
Interfaces: Parallel
Operating Temperature max: 85.0°C
Operating Voltage: 3.0V
Page Access Time: 20.0ns
Peak Reflow Temp: 260.0°C
Qualification: Industrial
Lead Ball Finish: Sn/Ag/Cu
Density: 64.0MBit
Family: PL-J
Initial Access Time: 60.0ns
Interface Frequency (SDR/DDR)(MHz): NA
Operating Voltage: 3.0V
Page Access Time: 20.0ns
Peak Reflow Temp: 260.0°C
Interfaces: Parallel
Operating Temperature max: 85.0°C
Qualification: Automotive
Lead Ball Finish: Sn/Ag/Cu
Density: 64.0MBit
Page Access Time: 20.0ns
Initial Access Time: 60.0ns
Interface Frequency (SDR/DDR)(MHz): NA
Operating Voltage: 3.0V
Peak Reflow Temp: 260.0°C
Family: PL-J
Interfaces: Parallel
Operating Temperature max: 85.0°C
Qualification: Automotive
Lead Ball Finish: Sn/Ag/Cu
Density: 64.0MBit