Interfaces: Quad SPI Operating Temperature max: 125.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Family: HS-T Interface Frequency (SDR/DDR)(MHz): 133 / 66 Interface Bandwidth: 66.0MByte/s Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 512.0MBit Currently planned availability until at least: 2035
Family: HL-T Interface Frequency (SDR/DDR)(MHz): 133 / 66 Interfaces: Quad SPI Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Operating Temperature max: 105.0°C Interface Bandwidth: 66.0MByte/s Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 512.0MBit Currently planned availability until at least: 2035

S25FS256TDAWEC109


分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)

描述: 256Mb SEMPER™ Nano 1.8V QSPI Flash in known good wafer format

Family: FS-T Interface Frequency (SDR/DDR)(MHz): 80 / - Operating Voltage: 1.8V Interface Bandwidth: 40.0MByte/s Interfaces: Quad SPI Operating Temperature max: 70.0°C Qualification: Commercial Density: 256.0MBit Currently planned availability until at least: 2033
Density: 32.0MBit Family: JL-J Initial Access Time: 70.0ns Interface Frequency (SDR/DDR)(MHz): NA Interfaces: Parallel Lead Ball Finish: Sn/Ag/Cu Operating Temperature max: 85.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Qualification: Industrial
Initial Access Time: 70.0ns Interface Frequency (SDR/DDR)(MHz): NA Interfaces: Parallel Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Operating Temperature max: 85.0°C Family: PL-J Page Access Time: 20.0ns Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 32.0MBit
Family: PL-J Initial Access Time: 70.0ns Interface Frequency (SDR/DDR)(MHz): NA Interfaces: Parallel Operating Temperature max: 85.0°C Page Access Time: 20.0ns Peak Reflow Temp: 260.0°C Operating Voltage: 3.0V Qualification: Wireless Lead Ball Finish: Sn/Ag/Cu Density: 64.0MBit
Operating Voltage: 3.0V Family: PL-J Interface Frequency (SDR/DDR)(MHz): NA Interfaces: Parallel Peak Reflow Temp: 260.0°C Operating Temperature max: 85.0°C Page Access Time: 20.0ns Initial Access Time: 70.0ns Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 64.0MBit
Initial Access Time: 70.0ns Family: PL-J Interface Frequency (SDR/DDR)(MHz): NA Interfaces: Parallel Operating Temperature max: 85.0°C Operating Voltage: 3.0V Page Access Time: 20.0ns Peak Reflow Temp: 260.0°C Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 64.0MBit
Family: PL-J Initial Access Time: 60.0ns Interface Frequency (SDR/DDR)(MHz): NA Operating Voltage: 3.0V Page Access Time: 20.0ns Peak Reflow Temp: 260.0°C Interfaces: Parallel Operating Temperature max: 85.0°C Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Density: 64.0MBit
Page Access Time: 20.0ns Initial Access Time: 60.0ns Interface Frequency (SDR/DDR)(MHz): NA Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Family: PL-J Interfaces: Parallel Operating Temperature max: 85.0°C Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Density: 64.0MBit