Initial Access Time: 70.0ns Interface Frequency (SDR/DDR)(MHz): NA Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Family: PL-J Page Access Time: 20.0ns Interfaces: Parallel Operating Temperature max: 85.0°C Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 32.0MBit

Peak Reflow Temp: 260.0°C Family: PL-J Initial Access Time: 70.0ns Interface Frequency (SDR/DDR)(MHz): NA Interfaces: Parallel Operating Temperature max: 85.0°C Operating Voltage: 3.0V Page Access Time: 20.0ns Qualification: Wireless Lead Ball Finish: Sn/Ag/Cu Density: 64.0MBit

Family: PL-J Initial Access Time: 70.0ns Interfaces: Parallel Operating Temperature max: 85.0°C Page Access Time: 20.0ns Peak Reflow Temp: 260.0°C Operating Voltage: 3.0V Interface Frequency (SDR/DDR)(MHz): NA Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Density: 32.0MBit

Interfaces: Parallel Operating Temperature max: 85.0°C Operating Voltage: 3.0V Page Access Time: 25.0ns Peak Reflow Temp: 260.0°C Family: PL-J Initial Access Time: 65.0ns Interface Frequency (SDR/DDR)(MHz): NA Qualification: Wireless Lead Ball Finish: Sn/Ag/Cu Density: 128.0MBit

Family: PL-J Interface Frequency (SDR/DDR)(MHz): NA Interfaces: Parallel Operating Temperature max: 85.0°C Peak Reflow Temp: 260.0°C Initial Access Time: 60.0ns Page Access Time: 25.0ns Operating Voltage: 3.0V Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 128.0MBit

Family: PL-J Initial Access Time: 55.0ns Interface Frequency (SDR/DDR)(MHz): NA Interfaces: Parallel Operating Temperature max: 85.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Page Access Time: 20.0ns Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 32.0MBit

Density: 32.0MBit Family: JL-J Interfaces: Parallel Operating Temperature max: 85.0°C Operating Voltage: 3.0V Qualification: Industrial Peak Reflow Temp: 260.0°C Lead Ball Finish: Sn/Ag/Cu Initial Access Time: 70.0ns

Density: 32.0MBit Family: JL-J Interfaces: Parallel Operating Temperature max: 85.0°C Operating Voltage: 3.0V Qualification: Industrial Peak Reflow Temp: 260.0°C Lead Ball Finish: Matte Tin Plating Initial Access Time: 70.0ns

Family: PL-J Interface Frequency (SDR/DDR)(MHz): NA Operating Voltage: 3.0V Page Access Time: 20.0ns Peak Reflow Temp: 260.0°C Initial Access Time: 60.0ns Interfaces: Parallel Operating Temperature max: 85.0°C Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 32.0MBit

Initial Access Time: 70.0ns Interface Frequency (SDR/DDR)(MHz): NA Operating Voltage: 3.0V Page Access Time: 20.0ns Peak Reflow Temp: 260.0°C Family: PL-J Interfaces: Parallel Operating Temperature max: 85.0°C Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 32.0MBit