Family: HL-T Density: 256.0MBit Interface Frequency (SDR/DDR)(MHz): 166 / 166 Interface Bandwidth: 333.0MByte/s Interfaces: Octal Qualification: Automotive Classification: ISO 26262-compliant Lead Ball Finish: Sn/Ag/Cu Peak Reflow Temp: 260.0°C Operating Temperature max: 125.0°C Operating Voltage: 3.0V Currently planned availability until at least: 2035

Density: 64.0MBit Family: JL-J Interfaces: Parallel Initial Access Time: 70.0ns Lead Ball Finish: Matte Tin Plating Operating Temperature max: 85.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Qualification: Industrial Interface Frequency (SDR/DDR)(MHz): NA

Family: CL-J Initial Access Time: 54.0ns Interface Frequency (SDR/DDR)(MHz): 75 / - Interfaces: Parallel Burst Lead Ball Finish: Matte Tin Plating Operating Temperature max: 85.0°C Peak Reflow Temp: 260.0°C Operating Voltage: 3.0V Density: 32.0MBit

Family: CL-J Interface Frequency (SDR/DDR)(MHz): 75 / - Interfaces: Parallel Burst Lead Ball Finish: N/A Operating Temperature max: 125.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Initial Access Time: 54.0ns Density: 32.0MBit

Family: PL-J Interfaces: Parallel Operating Temperature max: 85.0°C Operating Voltage: 3.0V Page Access Time: 25.0ns Peak Reflow Temp: 260.0°C Initial Access Time: 60.0ns Interface Frequency (SDR/DDR)(MHz): NA Qualification: Industrial Lead Ball Finish: Matte Tin Plating Density: 128.0MBit

Family: CD-J Initial Access Time: 54.0ns Interface Frequency (SDR/DDR)(MHz): 66 / - Interfaces: Parallel Burst Operating Temperature max: 125.0°C Peak Reflow Temp: 260.0°C Operating Voltage: 2.5V Qualification: Automotive Lead Ball Finish: Matte Tin Plating Density: 16.0MBit

Initial Access Time: 54.0ns Interface Frequency (SDR/DDR)(MHz): 66 / - Interfaces: Parallel Burst Operating Temperature max: 125.0°C Operating Voltage: 2.5V Family: CD-J Qualification: Automotive Lead Ball Finish: Sn/Pb Density: 16.0MBit Peak Reflow Temp: 220.0°C

Interface Frequency (SDR/DDR)(MHz): 166 / 166 Operating Voltage: 3.0V Family: HL-T Interface Bandwidth: 333.0MByte/s Interfaces: xSPI (Octal) Density: 1024.0MBit Classification: ISO 26262-compliant

Qualification: Automotive Family: FL-L Publish in NPSG: N Publish in PSG: N Interface Bandwidth: 66.0MByte/s Interfaces: Quad SPI Lead Ball Finish: N/A Peak Reflow Temp: 260.0°C Operating Temperature max: 105.0°C Operating Voltage: 3.0V Interface Frequency (SDR/DDR)(MHz): 133 / - Density: 256.0MBit

Interface Frequency (SDR/DDR)(MHz): 133 / - Interfaces: Quad SPI Operating Temperature max: 85.0°C Operating Voltage: 3.0V Family: FL-L Peak Reflow Temp: 260.0°C Interface Bandwidth: 66.0MByte/s Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 128.0MBit