Interface Frequency (SDR/DDR)(MHz): 108 / - Interfaces: Quad SPI Operating Temperature max: 105.0°C Operating Voltage: 3.0V Family: FL-S Peak Reflow Temp: 260.0°C Interface Bandwidth: 54.0MByte/s Qualification: Automotive Lead Ball Finish: Matte Tin Plating Density: 128.0MBit Classification: ISO 26262-ready

Family: FL-S Interface Frequency (SDR/DDR)(MHz): 108 / - Interfaces: Quad SPI Operating Temperature max: 105.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Interface Bandwidth: 54.0MByte/s Qualification: Industrial Lead Ball Finish: Matte Tin Plating Density: 128.0MBit

Interfaces: Quad SPI Operating Temperature max: 105.0°C Peak Reflow Temp: 260.0°C Family: FL-L Operating Voltage: 3.0V Interface Bandwidth: 54.0MByte/s Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 64.0MBit Interface Frequency (SDR/DDR)(MHz): 108 / 54

Family: FL-P Interface Frequency (SDR/DDR)(MHz): 104 / - Interfaces: Quad SPI Lead Ball Finish: Matte Tin Plating Operating Temperature max: 85.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Interface Bandwidth: 40.0MByte/s Density: 32.0MBit Qualification: Automotive

Family: FL-P Interface Frequency (SDR/DDR)(MHz): 104 / - Interfaces: Quad SPI Operating Temperature max: 85.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Lead Ball Finish: Matte Tin Plating Interface Bandwidth: 40.0MByte/s Density: 32.0MBit

Family: FL-P Interface Frequency (SDR/DDR)(MHz): 104 / - Interfaces: Quad SPI Operating Temperature max: 85.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Interface Bandwidth: 40.0MByte/s Qualification: Automotive Lead Ball Finish: Matte Tin Plating Density: 64.0MBit

Family: FL-P Interface Frequency (SDR/DDR)(MHz): 104 / - Interfaces: Quad SPI Lead Ball Finish: Matte Tin Plating Peak Reflow Temp: 260.0°C Operating Temperature max: 105.0°C Operating Voltage: 3.0V Interface Bandwidth: 40.0MByte/s Density: 32.0MBit

Interface Frequency (SDR/DDR)(MHz): 104 / - Interfaces: Quad SPI Operating Temperature max: 105.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Family: FL-P Interface Bandwidth: 40.0MByte/s Qualification: Automotive Lead Ball Finish: Matte Tin Plating Density: 64.0MBit

Applications: laundry automation Counter: anti-tearing support Counter: up to 65,536 units Data Rate: 26.48kbit/s Delivery Forms: MCC2 Delivery Forms: MCC8 Delivery Forms: NiAu-bump Delivery Forms: sawn wafer Distance (read/write): typically up to 1.5m EEPROM(admin): 64.0Byte EEPROM(user): 232.0Byte Endurance: 100000 Interfaces: ISO/IEC 18000-3 mode 1 Package: MCC2 Package: MCC8 Product Description: my-d™ vicinity Product Description: 97pF high capacitance Retention Time min: 10.0year Security Features: individual page locking Security Features: unique serial number 更多