Qualification: Industrial Family: HS-T Publish in NPSG: N Publish in PSG: N Interface Bandwidth: 333.0MByte/s Interfaces: Octal Peak Reflow Temp: 260.0°C Operating Temperature max: 105.0°C Operating Voltage: 1.8V Lead Ball Finish: Sn/Ag/Cu Interface Frequency (SDR/DDR)(MHz): - / 166 Density: 2.0GBit Currently planned availability until at least: 2035

Interface Frequency (SDR/DDR)(MHz): - / 200 Operating Temperature max: 105.0°C Family: HS-T Peak Reflow Temp: 260.0°C Operating Voltage: 1.8V Interface Bandwidth: 400.0MByte/s Interfaces: HYPERBUS Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 512.0MBit Currently planned availability until at least: 2035

Interface Frequency (SDR/DDR)(MHz): 166 / 166 Operating Temperature max: 125.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Interfaces: Octal Family: HL-T Interface Bandwidth: 333.0MByte/s Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 512.0MBit Currently planned availability until at least: 2035

Family: HS-T Interface Frequency (SDR/DDR)(MHz): - / 200 Operating Temperature max: 85.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Interface Bandwidth: 333.0MByte/s Interfaces: HYPERBUS Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 1.0GBit Currently planned availability until at least: 2035

Interface Frequency (SDR/DDR)(MHz): - / 166 Operating Temperature max: 105.0°C Operating Voltage: 3.0V Family: HL-T Peak Reflow Temp: 260.0°C Interface Bandwidth: 333.0MByte/s Interfaces: HYPERBUS Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 512.0MBit Currently planned availability until at least: 2035

Family: HS-T Interface Frequency (SDR/DDR)(MHz): - / 166 Interfaces: Octal Operating Temperature max: 125.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Interface Bandwidth: 333.0MByte/s Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 2.0GBit Currently planned availability until at least: 2035

Family: HL-T Interface Frequency (SDR/DDR)(MHz): - / 166 Operating Temperature max: 105.0°C Peak Reflow Temp: 260.0°C Operating Voltage: 3.0V Interface Bandwidth: 333.0MByte/s Interfaces: HYPERBUS Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 1.0GBit Currently planned availability until at least: 2035

Family: HS-T Interface Frequency (SDR/DDR)(MHz): - / 166 Operating Temperature max: 105.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Interface Bandwidth: 333.0MByte/s Interfaces: HYPERBUS Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 1.0GBit Currently planned availability until at least: 2035

Family: HS-T Interface Frequency (SDR/DDR)(MHz): - / 200 Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Operating Temperature max: 85.0°C Interface Bandwidth: 333.0MByte/s Interfaces: HYPERBUS Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 1.0GBit Currently planned availability until at least: 2035

Family: HL-T Interface Frequency (SDR/DDR)(MHz): 166 / 166 Operating Temperature max: 125.0°C Peak Reflow Temp: 260.0°C Operating Voltage: 3.0V Interface Bandwidth: 333.0MByte/s Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Interfaces: Octal Classification: ISO 26262-compliant Density: 1.0GBit Currently planned availability until at least: 2035