状态: 量产中
Compliance: Pb A H P
Density: 4 Mb
Organization: 512k x 8
tACC Max (ns): 15
VCC Min (V): 2.3
VCC Max (V): 3.6
I(standby) Max (µA): 50
Iact Max (mA): 6
T Min (°C): -40
T Max (°C): 105
Package Type: SOIC-8 / SOP-8J
MSL Type: 3
MSL Temp (°C): 260
ON Target: No
参考价格: $0.5901
LE25S161XBTAG
制造商: ONSEMI数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)
描述: 串行闪存,16 Mb (2048K x 8)
状态: Lifetime
Compliance: Pb A H P
Density: 16 Mb
Organization: 2048 x 8
tACC Max (ns): 8
VCC Min (V): 1.65
VCC Max (V): 1.95
I(standby) Max (µA): 12
Iact Max (mA): 4.5
T Min (°C): -40
T Max (°C): 90
Package Type: WLCSP8 2.92x1.53x0.525
MSL Type: 1
MSL Temp (°C): 260
ON Target: N
Reference Price: $1.8266
Family: HL-T
Density: 256.0MBit
Interface Frequency (SDR/DDR)(MHz): 166 / 166
Interface Bandwidth: 333.0MByte/s
Interfaces: Octal
Qualification: Automotive
Classification: ISO 26262-compliant
Lead Ball Finish: Sn/Ag/Cu
Peak Reflow Temp: 260.0°C
Operating Temperature max: 125.0°C
Operating Voltage: 3.0V
Currently planned availability until at least: 2035
Family: HL-T
Density: 256.0MBit
Interface Frequency (SDR/DDR)(MHz): 166 / 166
Interface Bandwidth: 333.0MByte/s
Interfaces: Octal
Qualification: Automotive
Classification: ISO 26262-compliant
Lead Ball Finish: Sn/Ag/Cu
Peak Reflow Temp: 260.0°C
Operating Temperature max: 125.0°C
Operating Voltage: 3.0V
Currently planned availability until at least: 2035
Density: 64.0MBit
Family: JL-J
Interfaces: Parallel
Initial Access Time: 70.0ns
Lead Ball Finish: Matte Tin Plating
Operating Temperature max: 85.0°C
Operating Voltage: 3.0V
Peak Reflow Temp: 260.0°C
Qualification: Industrial
Interface Frequency (SDR/DDR)(MHz): NA
Family: CL-J
Initial Access Time: 54.0ns
Interface Frequency (SDR/DDR)(MHz): 75 / -
Interfaces: Parallel Burst
Lead Ball Finish: Matte Tin Plating
Operating Temperature max: 85.0°C
Peak Reflow Temp: 260.0°C
Operating Voltage: 3.0V
Density: 32.0MBit
Family: CL-J
Interface Frequency (SDR/DDR)(MHz): 75 / -
Interfaces: Parallel Burst
Lead Ball Finish: N/A
Operating Temperature max: 125.0°C
Operating Voltage: 3.0V
Peak Reflow Temp: 260.0°C
Initial Access Time: 54.0ns
Density: 32.0MBit
Family: PL-J
Interfaces: Parallel
Operating Temperature max: 85.0°C
Operating Voltage: 3.0V
Page Access Time: 25.0ns
Peak Reflow Temp: 260.0°C
Initial Access Time: 60.0ns
Interface Frequency (SDR/DDR)(MHz): NA
Qualification: Industrial
Lead Ball Finish: Matte Tin Plating
Density: 128.0MBit
Family: CD-J
Initial Access Time: 54.0ns
Interface Frequency (SDR/DDR)(MHz): 66 / -
Interfaces: Parallel Burst
Operating Temperature max: 125.0°C
Peak Reflow Temp: 260.0°C
Operating Voltage: 2.5V
Qualification: Automotive
Lead Ball Finish: Matte Tin Plating
Density: 16.0MBit
Initial Access Time: 54.0ns
Interface Frequency (SDR/DDR)(MHz): 66 / -
Interfaces: Parallel Burst
Operating Temperature max: 125.0°C
Operating Voltage: 2.5V
Family: CD-J
Qualification: Automotive
Lead Ball Finish: Sn/Pb
Density: 16.0MBit
Peak Reflow Temp: 220.0°C