状态: 量产中 Compliance: Pb A H P Density: 4 Mb Organization: 512k x 8 tACC Max (ns): 15 VCC Min (V): 2.3 VCC Max (V): 3.6 I(standby) Max (µA): 50 Iact Max (mA): 6 T Min (°C): -40 T Max (°C): 105 Package Type: SOIC-8 / SOP-8J MSL Type: 3 MSL Temp (°C): 260 ON Target: No 参考价格: $0.5901

LE25S161XBTAG

制造商: ONSEMI
数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)

描述: 串行闪存,16 Mb (2048K x 8)

状态: Lifetime Compliance: Pb A H P Density: 16 Mb Organization: 2048 x 8 tACC Max (ns): 8 VCC Min (V): 1.65 VCC Max (V): 1.95 I(standby) Max (µA): 12 Iact Max (mA): 4.5 T Min (°C): -40 T Max (°C): 90 Package Type: WLCSP8 2.92x1.53x0.525 MSL Type: 1 MSL Temp (°C): 260 ON Target: N Reference Price: $1.8266
Family: HL-T Density: 256.0MBit Interface Frequency (SDR/DDR)(MHz): 166 / 166 Interface Bandwidth: 333.0MByte/s Interfaces: Octal Qualification: Automotive Classification: ISO 26262-compliant Lead Ball Finish: Sn/Ag/Cu Peak Reflow Temp: 260.0°C Operating Temperature max: 125.0°C Operating Voltage: 3.0V Currently planned availability until at least: 2035
Family: HL-T Density: 256.0MBit Interface Frequency (SDR/DDR)(MHz): 166 / 166 Interface Bandwidth: 333.0MByte/s Interfaces: Octal Qualification: Automotive Classification: ISO 26262-compliant Lead Ball Finish: Sn/Ag/Cu Peak Reflow Temp: 260.0°C Operating Temperature max: 125.0°C Operating Voltage: 3.0V Currently planned availability until at least: 2035
Density: 64.0MBit Family: JL-J Interfaces: Parallel Initial Access Time: 70.0ns Lead Ball Finish: Matte Tin Plating Operating Temperature max: 85.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Qualification: Industrial Interface Frequency (SDR/DDR)(MHz): NA
Family: CL-J Initial Access Time: 54.0ns Interface Frequency (SDR/DDR)(MHz): 75 / - Interfaces: Parallel Burst Lead Ball Finish: Matte Tin Plating Operating Temperature max: 85.0°C Peak Reflow Temp: 260.0°C Operating Voltage: 3.0V Density: 32.0MBit
Family: CL-J Interface Frequency (SDR/DDR)(MHz): 75 / - Interfaces: Parallel Burst Lead Ball Finish: N/A Operating Temperature max: 125.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Initial Access Time: 54.0ns Density: 32.0MBit
Family: PL-J Interfaces: Parallel Operating Temperature max: 85.0°C Operating Voltage: 3.0V Page Access Time: 25.0ns Peak Reflow Temp: 260.0°C Initial Access Time: 60.0ns Interface Frequency (SDR/DDR)(MHz): NA Qualification: Industrial Lead Ball Finish: Matte Tin Plating Density: 128.0MBit
Family: CD-J Initial Access Time: 54.0ns Interface Frequency (SDR/DDR)(MHz): 66 / - Interfaces: Parallel Burst Operating Temperature max: 125.0°C Peak Reflow Temp: 260.0°C Operating Voltage: 2.5V Qualification: Automotive Lead Ball Finish: Matte Tin Plating Density: 16.0MBit
Initial Access Time: 54.0ns Interface Frequency (SDR/DDR)(MHz): 66 / - Interfaces: Parallel Burst Operating Temperature max: 125.0°C Operating Voltage: 2.5V Family: CD-J Qualification: Automotive Lead Ball Finish: Sn/Pb Density: 16.0MBit Peak Reflow Temp: 220.0°C