Qualification: Automotive Family: HL-T Publish in NPSG: N Publish in PSG: N Interface Bandwidth: 266.0MByte/s Interfaces: HYPERBUS Peak Reflow Temp: 260.0°C Operating Temperature max: 105.0°C Operating Voltage: 1.8V Lead Ball Finish: Sn/Ag/Cu Interface Frequency (SDR/DDR)(MHz): - / 133 Classification: ISO 26262-compliant Density: 2.0GBit Currently planned availability until at least: 2035

Family: HS-T Operating Temperature max: 125.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Interfaces: Quad SPI Interface Frequency (SDR/DDR)(MHz): 166 / 102 Interface Bandwidth: 102.0MByte/s Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 1.0GBit Currently planned availability until at least: 2035

Family: HL-T Interface Frequency (SDR/DDR)(MHz): - / 166 Operating Temperature max: 125.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Interface Bandwidth: 333.0MByte/s Interfaces: HYPERBUS Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 512.0MBit Currently planned availability until at least: 2035

Family: HL-T Interface Frequency (SDR/DDR)(MHz): 166 / 102 Interfaces: Quad SPI Operating Temperature max: 125.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Interface Bandwidth: 102.0MByte/s Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 512.0MBit Currently planned availability until at least: 2035

Family: HL-T Interface Frequency (SDR/DDR)(MHz): - / 166 Operating Temperature max: 105.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Interface Bandwidth: 333.0MByte/s Interfaces: HYPERBUS Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 512.0MBit Currently planned availability until at least: 2035

Family: HS-T Interface Frequency (SDR/DDR)(MHz): 166 / 102 Interfaces: Quad SPI Operating Temperature max: 105.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Interface Bandwidth: 102.0MByte/s Qualification: Industrial Lead Ball Finish: Matte Tin Plating Density: 512.0MBit Currently planned availability until at least: 2035

Qualification: Industrial Family: HS-T Publish in NPSG: N Publish in PSG: N Interface Bandwidth: 102.0MByte/s Interfaces: Quad SPI Peak Reflow Temp: 260.0°C Operating Temperature max: 85.0°C Operating Voltage: 1.8V Lead Ball Finish: Matte Tin Plating Interface Frequency (SDR/DDR)(MHz): 166 / 102 Density: 512.0MBit Currently planned availability until at least: 2035

Family: HS-T Interface Frequency (SDR/DDR)(MHz): 166 / 102 Interfaces: Quad SPI Operating Temperature max: 105.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Interface Bandwidth: 102.0MByte/s Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 512.0MBit Currently planned availability until at least: 2035

Interface Frequency (SDR/DDR)(MHz): 166 / 102 Interfaces: Quad SPI Operating Voltage: 3.0V Operating Temperature max: 105.0°C Family: HL-T Peak Reflow Temp: 260.0°C Interface Bandwidth: 102.0MByte/s Qualification: Industrial Lead Ball Finish: Matte Tin Plating Density: 512.0MBit Currently planned availability until at least: 2035

Interfaces: Quad SPI Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Family: HL-T Operating Temperature max: 125.0°C Interface Frequency (SDR/DDR)(MHz): 166 / 102 Interface Bandwidth: 102.0MByte/s Qualification: Automotive Lead Ball Finish: Matte Tin Plating Classification: ISO 26262-compliant Density: 1.0GBit Currently planned availability until at least: 2035