Family: HL-T Interface Frequency (SDR/DDR)(MHz): 133 / 66 Interfaces: Quad SPI Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Operating Temperature max: 85.0°C Interface Bandwidth: 66.0MByte/s Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 512.0MBit Currently planned availability until at least: 2035

Family: HL-T Interface Bandwidth: 66.0MByte/s Interface Frequency (SDR/DDR)(MHz): 133 / 66 Interfaces: Quad SPI Lead Ball Finish: Sn/Ag/Cu Operating Temperature max: 105.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Qualification: Industrial Density: 2.0GBit Currently planned availability until at least: 2035

Family: HL-T Interface Frequency (SDR/DDR)(MHz): 133 / 66 Interfaces: Quad SPI Operating Temperature max: 125.0°C Peak Reflow Temp: 260.0°C Operating Voltage: 3.0V Interface Bandwidth: 66.0MByte/s Qualification: Automotive Lead Ball Finish: Matte Tin Plating Classification: ISO 26262-compliant Density: 1.0GBit Currently planned availability until at least: 2035

Interface Frequency (SDR/DDR)(MHz): 133 / 66 Operating Temperature max: 125.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Family: HS-T Interfaces: Quad SPI Interface Bandwidth: 66.0MByte/s Qualification: Automotive Lead Ball Finish: Matte Tin Plating Classification: ISO 26262-compliant Density: 1.0GBit Currently planned availability until at least: 2035

Interface Frequency (SDR/DDR)(MHz): 133 / 66 Operating Temperature max: 105.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Family: HS-T Interfaces: Quad SPI Interface Bandwidth: 66.0MByte/s Qualification: Industrial Lead Ball Finish: Matte Tin Plating Density: 512.0MBit Currently planned availability until at least: 2035

Family: HS-T Interface Frequency (SDR/DDR)(MHz): 133 / 66 Interfaces: Quad SPI Operating Temperature max: 125.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Interface Bandwidth: 66.0MByte/s Qualification: Automotive Lead Ball Finish: Matte Tin Plating Classification: ISO 26262-compliant Density: 512.0MBit Currently planned availability until at least: 2035

Family: HS-T Interface Frequency (SDR/DDR)(MHz): 133 / 66 Interfaces: Quad SPI Operating Temperature max: 85.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Interface Bandwidth: 66.0MByte/s Qualification: Industrial Lead Ball Finish: Matte Tin Plating Density: 1.0GBit Currently planned availability until at least: 2035

Family: HL-T Interface Frequency (SDR/DDR)(MHz): 133 / 66 Interfaces: Quad SPI Operating Temperature max: 125.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Interface Bandwidth: 66.0MByte/s Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 1.0GBit Currently planned availability until at least: 2035

Family: HL-T Interface Frequency (SDR/DDR)(MHz): 133 / 66 Interfaces: Quad SPI Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Operating Temperature max: 125.0°C Interface Bandwidth: 66.0MByte/s Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 1.0GBit Currently planned availability until at least: 2035

Family: HL-T Interface Frequency (SDR/DDR)(MHz): 133 / 66 Interfaces: Quad SPI Operating Temperature max: 125.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Interface Bandwidth: 66.0MByte/s Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 2.0GBit Currently planned availability until at least: 2035