Family: HS-T Interface Frequency (SDR/DDR)(MHz): 133 / 66 Interfaces: Quad SPI Operating Temperature max: 85.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Interface Bandwidth: 66.0MByte/s Qualification: Industrial Lead Ball Finish: Matte Tin Plating Density: 1.0GBit Currently planned availability until at least: 2035

Interface Frequency (SDR/DDR)(MHz): 133 / 66 Interfaces: Quad SPI Operating Temperature max: 105.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Family: HS-T Interface Bandwidth: 66.0MByte/s Qualification: Industrial Lead Ball Finish: Matte Tin Plating Density: 1.0GBit Currently planned availability until at least: 2035

Family: HS-T Interface Frequency (SDR/DDR)(MHz): 133 / 66 Interfaces: Quad SPI Operating Temperature max: 85.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Interface Bandwidth: 66.0MByte/s Qualification: Automotive Lead Ball Finish: Matte Tin Plating Classification: ISO 26262-compliant Density: 1.0GBit Currently planned availability until at least: 2035

Interfaces: Quad SPI Operating Temperature max: 125.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Family: HS-T Interface Frequency (SDR/DDR)(MHz): 133 / 66 Interface Bandwidth: 66.0MByte/s Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 512.0MBit Currently planned availability until at least: 2035

Family: HL-T Interface Frequency (SDR/DDR)(MHz): 133 / 66 Interfaces: Quad SPI Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Operating Temperature max: 105.0°C Interface Bandwidth: 66.0MByte/s Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 512.0MBit Currently planned availability until at least: 2035

Family: FS-T Interface Frequency (SDR/DDR)(MHz): 80 / - Operating Voltage: 1.8V Interface Bandwidth: 40.0MByte/s Interfaces: Quad SPI Operating Temperature max: 70.0°C Qualification: Commercial Density: 256.0MBit Currently planned availability until at least: 2033

Initial Access Time: 70.0ns Interface Frequency (SDR/DDR)(MHz): NA Interfaces: Parallel Operating Temperature: None°C Operating Voltage: 3.0V Family: AL-J Qualification: Industrial Lead Ball Finish: Sn/Pb Density: 8.0MBit Peak Reflow Temp: 220.0°C

Family: AL-J Initial Access Time: 70.0ns Interface Frequency (SDR/DDR)(MHz): NA Interfaces: Parallel Operating Temperature: None°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 16.0MBit

Initial Access Time: 70.0ns Interface Frequency (SDR/DDR)(MHz): NA Operating Temperature: None°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Family: AL-J Interfaces: Parallel Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 16.0MBit

Family: AL-J Initial Access Time: 70.0ns Interface Frequency (SDR/DDR)(MHz): NA Interfaces: Parallel Operating Temperature: None°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Qualification: Industrial Lead Ball Finish: Matte Tin Plating Density: 8.0MBit