Family: HS-T Interface Frequency (SDR/DDR)(MHz): 200 / 200 Operating Temperature max: 105.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Interface Bandwidth: 400.0MByte/s Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Interfaces: Octal Classification: ISO 26262-compliant Density: 512.0MBit Currently planned availability until at least: 2035

Interface Frequency (SDR/DDR)(MHz): 200 / 200 Operating Temperature max: 105.0°C Peak Reflow Temp: 260.0°C Family: HS-T Operating Voltage: 1.8V Interface Bandwidth: 400.0MByte/s Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Interfaces: Octal Classification: ISO 26262-compliant Density: 512.0MBit Currently planned availability until at least: 2035

Qualification: Industrial Family: HS-T Publish in NPSG: N Publish in PSG: N Interface Bandwidth: 400.0MByte/s Interfaces: HYPERBUS Peak Reflow Temp: 260.0°C Operating Temperature max: 85.0°C Operating Voltage: 1.8V Lead Ball Finish: Sn/Ag/Cu Interface Frequency (SDR/DDR)(MHz): - / 200 Density: 512.0MBit Currently planned availability until at least: 2035

Family: HS-T Interface Frequency (SDR/DDR)(MHz): - / 200 Operating Temperature max: 125.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Interface Bandwidth: 400.0MByte/s Interfaces: HYPERBUS Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 512.0MBit Currently planned availability until at least: 2035

Operating Temperature max: 85.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Interface Frequency (SDR/DDR)(MHz): 200 / 200 Family: HS-T Interface Bandwidth: 400.0MByte/s Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Interfaces: Octal Density: 512.0MBit Currently planned availability until at least: 2035

Qualification: Industrial Family: HS-T Publish in NPSG: N Publish in PSG: N Interface Bandwidth: 400.0MByte/s Interfaces: Octal Peak Reflow Temp: 260.0°C Operating Temperature max: 105.0°C Operating Voltage: 1.8V Lead Ball Finish: Sn/Ag/Cu Interface Frequency (SDR/DDR)(MHz): 166 / 200 Density: 1.0GBit Currently planned availability until at least: 2035

Family: HS-T Interface Frequency (SDR/DDR)(MHz): - / 200 Operating Voltage: 1.8V Operating Temperature max: 85.0°C Peak Reflow Temp: 260.0°C Interface Bandwidth: 400.0MByte/s Interfaces: HYPERBUS Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 512.0MBit Currently planned availability until at least: 2035

Family: HS-T Interface Frequency (SDR/DDR)(MHz): - / 200 Interfaces: HYPERBUS Operating Temperature max: 85.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Interface Bandwidth: 400.0MByte/s Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 1.0GBit Currently planned availability until at least: 2035

Qualification: Industrial Family: HS-T Publish in NPSG: N Publish in PSG: N Interface Bandwidth: 400.0MByte/s Interfaces: Octal Peak Reflow Temp: 260.0°C Operating Temperature max: 105.0°C Operating Voltage: 1.8V Lead Ball Finish: Sn/Ag/Cu Interface Frequency (SDR/DDR)(MHz): 166 / 200 Density: 1.0GBit Currently planned availability until at least: 2035

Family: HS-T Interface Frequency (SDR/DDR)(MHz): - / 200 Operating Temperature max: 105.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Interface Bandwidth: 400.0MByte/s Interfaces: HYPERBUS Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 512.0MBit Currently planned availability until at least: 2035