Family: HS-T Interface Frequency (SDR/DDR)(MHz): - / 166 Operating Temperature max: 105.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Interface Bandwidth: 333.0MByte/s Interfaces: HYPERBUS Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 1.0GBit Currently planned availability until at least: 2035

Family: HL-T Interface Frequency (SDR/DDR)(MHz): - / 166 Peak Reflow Temp: 260.0°C Operating Temperature max: 125.0°C Operating Voltage: 3.0V Interface Bandwidth: 333.0MByte/s Interfaces: HYPERBUS Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 512.0MBit Currently planned availability until at least: 2035

Family: HS-T Operating Temperature max: 85.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Interface Frequency (SDR/DDR)(MHz): - / 200 Interface Bandwidth: 333.0MByte/s Interfaces: HYPERBUS Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 1.0GBit Currently planned availability until at least: 2035

Family: HL-T Operating Temperature max: 105.0°C Peak Reflow Temp: 260.0°C Operating Voltage: 3.0V Interface Frequency (SDR/DDR)(MHz): - / 166 Interface Bandwidth: 333.0MByte/s Interfaces: HYPERBUS Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 512.0MBit Currently planned availability until at least: 2035

Interfaces: HYPERBUS Operating Temperature max: 85.0°C Operating Voltage: 1.8V Family: HS-T Peak Reflow Temp: 260.0°C Interface Frequency (SDR/DDR)(MHz): - / 200 Interface Bandwidth: 400.0MByte/s Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 1.0GBit Currently planned availability until at least: 2035

Family: HL-T Interface Frequency (SDR/DDR)(MHz): - / 166 Interfaces: Octal Operating Temperature max: 85.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Interface Bandwidth: 333.0MByte/s Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 512.0MBit Currently planned availability until at least: 2035

Family: HS-T Interface Frequency (SDR/DDR)(MHz): - / 200 Operating Temperature max: 105.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Interface Bandwidth: 333.0MByte/s Interfaces: HYPERBUS Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 1.0GBit Currently planned availability until at least: 2035

Family: HS-T Interface Frequency (SDR/DDR)(MHz): - / 166 Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Operating Temperature max: 85.0°C Interfaces: Octal Interface Bandwidth: 333.0MByte/s Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 1.0GBit Currently planned availability until at least: 2035

Classification: ISO 26262-compliant Family: HS-T Interface Bandwidth: 333.0MByte/s Interface Frequency (SDR/DDR)(MHz): 166 / 166 Interfaces: Octal Lead Ball Finish: Sn/Ag/Cu Operating Temperature max: 105.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Qualification: Automotive Density: 2.0GBit Currently planned availability until at least: 2035

Family: HS-T Interface Frequency (SDR/DDR)(MHz): 166 / 166 Operating Temperature max: 105.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Interface Bandwidth: 333.0MByte/s Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Interfaces: Octal Density: 1.0GBit Currently planned availability until at least: 2035