Applications: supply chain management Applications: library management Counter: anti-tearing support Counter: up to 65,536 units Data Rate: 26.48kbit/s Delivery Forms: MCC2 Delivery Forms: MCC8 Delivery Forms: NiAu-bump Delivery Forms: sawn wafer Distance (read/write): typically up to 1.5m EEPROM(admin): 64.0Byte EEPROM(user): 224.0Byte Endurance: 100000 Interfaces: ISO/IEC 18000-3 mode 1 Package: MCC2 Package: MCC8 Product Description: my-d™ vicinity secure Retention Time min: 10.0year Tools: evaluation kit contactless Memory: fully configurable 更多

Applications: supply chain management Applications: library management Counter: anti-tearing support Counter: up to 65,536 units Data Rate: 26.48kbit/s Delivery Forms: MCC2 Delivery Forms: MCC8 Delivery Forms: NiAu-bump Delivery Forms: sawn wafer Distance (read/write): typically up to 1.5m EEPROM(admin): 64.0Byte EEPROM(user): 224.0Byte Endurance: 100000 Interfaces: ISO/IEC 18000-3 mode 1 Package: MCC2 Package: MCC8 Product Description: my-d™ vicinity secure Retention Time min: 10.0year Tools: evaluation kit contactless Memory: fully configurable 更多

Applications: inventory control Applications: library management Counter: anti-tearing support Counter: up to 65,536 units Data Rate: 26.48kbit/s Delivery Forms: MCC2 Delivery Forms: MCC8 Delivery Forms: NiAu-bump Delivery Forms: sawn wafer Distance (read/write): typically up to 1.5m EEPROM(admin): 256.0Byte EEPROM(user): 992.0Byte Endurance: 100000 Interfaces: ISO/IEC 18000-3 mode 1 Package: MCC2 Package: MCC8 Product Description: my-d™ vicinity secure Product Description: 97pF high capacitance Retention Time min: 10.0year Tools: evaluation kit contactless 更多

状态: 已停产 Compliance: Pb A H P Type: CMOS Density: 2 kb Organization: 256 x 8 Data Transmission Standard: I2C fcycle Max (kHz): 400 tACC Max ns: 900 VCC Min (V): 2.7 VCC Max (V): 5.5 Vio Ref (V): VCC Istandby Max (µA): 60 Iact Max (mA): 3 T Min (°C): -40 T Max (°C): 85 Endurance (Write cycles): - Specific Features: - Package Type: TSSOP-8 MSL Type: 1 MSL Temp (°C): 260 更多

状态: 已停产 Compliance: Pb A H P Type: CMOS Density: 2 kb Organization: 256 x 8 Data Transmission Standard: I2C fcycle Max (kHz): 400 tACC Max ns: 900 VCC Min (V): 2.7 VCC Max (V): 5.5 Vio Ref (V): VCC Istandby Max (µA): 60 Iact Max (mA): 3 T Min (°C): -40 T Max (°C): 85 Endurance (Write cycles): - Specific Features: - Package Type: TSSOP-8 MSL Type: 1 MSL Temp (°C): 260 更多

状态: 已停产 Compliance: Pb A H P Type: CMOS Density: 2 kb Organization: 256 x 8 Data Transmission Standard: I2C fcycle Max (kHz): 400 tACC Max ns: 900 VCC Min (V): 2.7 VCC Max (V): 5.5 Vio Ref (V): VCC Istandby Max (µA): 60 Iact Max (mA): 3 T Min (°C): -40 T Max (°C): 85 Endurance (Write cycles): - Specific Features: - Package Type: SOIC-8 MSL Type: 1 MSL Temp (°C): 260 更多

状态: 已停产 Compliance: Pb A H P Type: CMOS Density: 2 kb Organization: 256 x 8 Data Transmission Standard: I2C fcycle Max (kHz): 400 tACC Max ns: 900 VCC Min (V): 2.7 VCC Max (V): 5.5 Vio Ref (V): VCC Istandby Max (µA): 60 Iact Max (mA): 3 T Min (°C): -40 T Max (°C): 85 Endurance (Write cycles): - Specific Features: - Package Type: SOIC-8 MSL Type: 1 MSL Temp (°C): 260 更多

状态: 已停产 Compliance: Pb A H P Type: CMOS Density: 2 kb Organization: 256 x 8 Data Transmission Standard: I2C fcycle Max (kHz): 400 tACC Max ns: 900 VCC Min (V): 2.7 VCC Max (V): 5.5 Vio Ref (V): VCC Istandby Max (µA): 60 Iact Max (mA): 3 T Min (°C): -40 T Max (°C): 85 Endurance (Write cycles): - Specific Features: - Package Type: TSSOP-8 MSL Type: 1 MSL Temp (°C): 260 更多