Leading Technologies: SOLID FLASH™
Interfaces: ISO 7816
Interfaces: GPIO
Interfaces: SWP
Interfaces: I2C
NVM / 凌捷掩膜: 2000.0kByte
RAM: 48.0kByte
CPU: 32-bit
Asymmetric Cryptography: ECC/RSA
Asymmetric Cryptography: AES/DES
Ambient Temperature max: 105.0°C
Delivery Forms: MFF2
Delivery Forms: sawn wafer
Certifications: CC EAL6+ high
Leading Technologies: SOLID FLASH™
Interfaces: ISO 7816
Interfaces: GPIO
Interfaces: SWP
Interfaces: I2C
NVM / 凌捷掩膜: 1332.0kByte
RAM: 48.0kByte
CPU: 32-bit
Asymmetric Cryptography: ECC/RSA
Asymmetric Cryptography: AES/DES
Ambient Temperature max: 105.0°C
Delivery Forms: MFF2
Delivery Forms: sawn wafer
Certifications: CC EAL6+ high
Leading Technologies: SOLID FLASH™
Interfaces: ISO 7816
Interfaces: GPIO
Interfaces: SWP
Interfaces: I2C
NVM / 凌捷掩膜: 1000.0kByte
RAM: 48.0kByte
CPU: 32-bit
Asymmetric Cryptography: ECC/RSA
Asymmetric Cryptography: AES/DES
Ambient Temperature max: 105.0°C
Delivery Forms: MFF2
Delivery Forms: sawn wafer
Certifications: CC EAL6+ high
Ambient Temperature max: 105.0°C
CPU: 32-bit
Certifications: CC EAL5+ high
Delivery Forms: sawn wafer
Delivery Forms: USON-8-5
Delivery Forms: USON-10-2
Delivery Forms: XFWLB-6-3
Interfaces: ISO 7816
Leading Technologies: SOLID FLASH™
NVM / 凌捷掩膜: 240.0kByte
Package: sawn wafer
Package: USON-8-5
Package: USON-10-2
Package: XFWLB-6-3
RAM: 12.0kByte
Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
Leading Technologies: SOLID FLASH™
Interfaces: ISO 7816
Interfaces: GPIO
Interfaces: SPI
Interfaces: SWP
Interfaces: I2C
NVM / 凌捷掩膜: 2000.0kByte
RAM: 48.0kByte
CPU: 32-bit
Asymmetric Cryptography: ECC/RSA
Asymmetric Cryptography: AES/DES
Ambient Temperature max: 105.0°C
Delivery Forms: MFF2
Delivery Forms: sawn wafer
Certifications: CC EAL6+ high
Ambient Temperature max: 105.0°C
CPU: 32-bit
Certifications: CC EAL5+ high
Delivery Forms: MFF2
Delivery Forms: sawn wafer
Delivery Forms: USON-8-6
Delivery Forms: USON-6-2
Delivery Forms: USON-10-2
Delivery Forms: XFWLB-6-2
Interfaces: ISO 7816
Interfaces: GPIO
Leading Technologies: SOLID FLASH™
NVM / 凌捷掩膜: 800.0kByte
Package: MFF2
Package: sawn wafer
Package: USON-8-6
Package: USON-6-2
Package: USON-10-2
Package: XFWLB-6-2
RAM: 20.0kByte
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Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
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描述: High-end performance for eSIM applications, simplifying the deployment of new M2M solutions