INFINEON
Infineon 英飞凌专注于迎接现代社会的三大科技挑战： 高能效、 移动性和 安全性，为汽车和工业功率器件、芯片卡和安全应用提供半导体和系统解决方案。英飞凌的产品素以高可靠性、卓越质量和创新性著称，并在模拟和混合信号、射频、功率以及嵌入式控制装置领域掌握尖端技术。
I[C] max: 25.0A
I[Cpuls] max: 75.0A
V[DS] max: 1200.0V
V[GE(th)] max: 6.5V
Package: sawn on foil
Technology: IGBT2
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I[C] max: 50.0A
V[DS] max: 600.0V
V[GE(th)] max: 6.5V
Technology: IGBT3
V[CE(sat)] max: 1.85V
V[CE] max: 600.0V
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I[C] max: 100.0A
V[DS] max: 1200.0V
V[GE(th)] max: 6.4V
Technology: IGBT4 Medium Power
V[CE(sat)] max: 1.97V
V[CE] max: 1200.0V
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I[C] max: 8.0A
V[DS] max: 600.0V
V[GE(th)] max: 5.7V
Technology: IGBT3 RC Drives
V[CE(sat)] max: 2.1V
V[CE] max: 600.0V
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I[C] max: 10.0A
V[DS] max: 600.0V
V[GE(th)] max: 6.5V
Technology: IGBT3
V[CE(sat)] max: 1.9V
V[CE] max: 600.0V
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I[C] max: 15.0A
V[DS] max: 600.0V
V[GE(th)] max: 5.7V
Technology: IGBT3 RC Drives
V[CE(sat)] max: 5.7V
V[CE] max: 600.0V
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I[C] max: 50.0A
V[DS] max: 1200.0V
V[GE(th)] max: 6.3V
Technology: IGBT4 Low Power
V[CE(sat)] max: 2.07V
V[CE] max: 1200.0V
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I[C] max: 150.0A
I[Cpuls] max: 450.0A
V[DS] max: 1200.0V
V[GE(th)] max: 6.5V
Package: sawn on foil
Technology: IGBT2 Low Loss
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FS01MR08A8MA2LBC
分类:数据:
简介: This HybridPACK™ Drive G2 CoolSiC™ G2 module is a highly compact B6-bridge power module (750V/620A) with enhanced package optimized for various inverter power classes.
Housing: HybridPACK™ Drive G2
Technology: CoolSiC™ G2
Configuration: Sixpack
Features: PinFin Base Plate
Features: Long Tabs
Qualification: Automotive
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FS02MR12A8MA2B
分类:数据:
简介: This HybridPACK™ Drive G2 CoolSiC™ G2 module is a highly compact B6-bridge power module (1200V/390A) with enhanced package optimized for various inverter power classes
Housing: HybridPACK™ Drive G2
Technology: CoolSiC™ G2
Configuration: Sixpack
Features: PinFin Baseplate
Features: Short Tabs
Qualification: Automotive
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