INFINEON
Infineon 英飞凌专注于迎接现代社会的三大科技挑战： 高能效、 移动性和 安全性，为汽车和工业功率器件、芯片卡和安全应用提供半导体和系统解决方案。英飞凌的产品素以高可靠性、卓越质量和创新性著称，并在模拟和混合信号、射频、功率以及嵌入式控制装置领域掌握尖端技术。
V[F](Tvj=25°C typ): 1.55V
I[C(nom)] / I[F(nom)]: 75.0A
V[CES] / V[RRM]: 600.0V
V[CE(sat)](Tvj=25°C typ): 1.45V
I[C] max: 75.0A
Housing: EconoPACK™ 2
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Configuration: 3-level
Dimensions(width): 48.0mm
Dimensions(length): 62.8mm
Features: AlN
Features: PressFIT
Housing: EasyPACK™ 2B
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Housing: EasyPACK™ 2B
Features: PressFIT
Features: SiC Schottky diode
I[C] max: 50.0A
V[F](Tvj=25°C typ): 1.6V
I[C(nom)] / I[F(nom)]: 50.0A
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Configuration: Booster
Features: PressFIT
Housing: EasyPACK™ 2B
I[C(nom)] / I[F(nom)]: 200.0A
I[C] max: 200.0A
Qualification: Industrial
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Configuration: Booster
Qualification: Industrial
Technology: IGBT5 - H5
V[F](Tvj=25°C typ): 1.6V
Housing: EasyPACK™ 1B
Features: SiC Schottky diode
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I[C] max: 200.0A
V[F](Tvj=25°C typ): 1.55V
I[C(nom)] / I[F(nom)]: 200.0A
V[CES] / V[RRM]: 650.0V
V[CE(sat)](Tvj=25°C typ): 1.55V
Configuration: 3-level
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Configuration: 3-level
Dimensions(length): 109.9mm
Dimensions(width): 62.0mm
Features: Phase leg
Features: PressFIT
Housing: EasyPACK™ 3B
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Configuration: 3-level
Dimensions(length): 56.7mm
Dimensions(width): 48.0mm
Housing: EasyPACK™ 2B
I[C(nom)] / I[F(nom)]: 50.0A
I[C] max: 50.0A
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Configuration: Booster
Qualification: Industrial
Technology: IGBT5 - H5
V[F](Tvj=25°C typ): 1.6V
Features: PressFIT
Housing: EasyPACK™ 1B
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Configuration: Booster
Features: PressFIT
Housing: EasyPACK™ 2B
I[C(nom)] / I[F(nom)]: 300.0A
I[C] max: 300.0A
Qualification: Industrial
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