INFINEON
Infineon 英飞凌专注于迎接现代社会的三大科技挑战： 高能效、 移动性和 安全性，为汽车和工业功率器件、芯片卡和安全应用提供半导体和系统解决方案。英飞凌的产品素以高可靠性、卓越质量和创新性著称，并在模拟和混合信号、射频、功率以及嵌入式控制装置领域掌握尖端技术。
Configuration: 3-level
Dimensions(length): 109.9mm
Dimensions(width): 62.0mm
Features: Phase leg
Features: PressFIT
Housing: EasyPACK™ 3B
| 库存数量: |
Configuration: 3-level
Dimensions(length): 109.9mm
Dimensions(width): 62.0mm
Features: Booster
Features: PressFIT
Housing: EasyPACK™ 3B
| 库存数量: |
Configuration: 3-level
Dimensions(length): 109.9mm
Dimensions(width): 62.0mm
Features: Booster
Features: PressFIT
Housing: EasyPACK™ 3B
| 库存数量: |
FS3L400R10W3S7F_B11
分类:数据:
简介: 950 V 400 A EasyPACK™ module with TRENCHSTOP™ IGBT7 and CoolSiC™ Schottky diode
Configuration: Booster
Dimensions(length): 109.9mm
Dimensions(width): 62.0mm
Features: Booster
Features: PressFIT
Housing: EasyPACK™ 3B
| 库存数量: |
Technology: IGBT4 - T4
V[CE(sat)](Tvj=25°C typ): 1.85V
V[F](Tvj=25°C typ): 1.35V
Configuration: 3-level
Dimensions(width): 33.8mm
Dimensions(length): 48.0mm
| 库存数量: |
Configuration: Sixpack
Dimensions(length): 109.9mm
Housing: EasyPACK™ 3B
I[C(nom)] / I[F(nom)]: 200.0A
I[C] max: 200.0A
Qualification: Industrial
| 库存数量: |
Configuration: 3-level
Dimensions(length): 109.9mm
Dimensions(width): 62.0mm
Features: PressFIT
Housing: EasyPACK™ 3B
I[C(nom)] / I[F(nom)]: 225.0A
| 库存数量: |
Configuration: 3-level
Features: PressFIT
Housing: EasyPACK™ 2B
I[C(nom)] / I[F(nom)]: 150.0A
Qualification: Industrial
Technology: IGBT HighSpeed 3
| 库存数量: |
I[C] max: 300.0A
Housing: EconoPACK™ 4
Features: PressFIT
V[F](Tvj=25°C typ): 1.65V
I[C(nom)] / I[F(nom)]: 300.0A
V[CE(sat)](Tvj=25°C typ): 1.75V
| 库存数量: |
Configuration: 3-level
Dimensions(length): 109.9mm
Dimensions(width): 62.0mm
Features: Phase leg
Features: PressFIT
Housing: EasyPACK™ 3B
| 库存数量: |