INFINEON

Infineon 英飞凌专注于迎接现代社会的三大科技挑战：高能效、移动性和安全性，为汽车和工业功率器件、芯片卡和安全应用提供半导体和系统解决方案。英飞凌的产品素以高可靠性、卓越质量和创新性著称，并在模拟和混合信号、射频、功率以及嵌入式控制装置领域掌握尖端技术。

S25HL512TFANHM013

分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)
数据:

Qualification: Automotive Family: HL-T Publish in NPSG: N Publish in PSG: N Interface Bandwidth: 102.0MByte/s Interfaces: Quad SPI Peak Reflow Temp: 260.0°C Operating Temperature max: 125.0°C Operating Voltage: 3.0V Lead Ball Finish: Matte Tin Plating Interface Frequency (SDR/DDR)(MHz): 166 / 102 Classification: ISO 26262-compliant Density: 512.0MBit Currently planned availability until at least: 2035

S25HS512TFABHI010

分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)
数据:

Family: HS-T Interface Frequency (SDR/DDR)(MHz): 166 / 102 Operating Temperature max: 85.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Interfaces: Quad SPI Interface Bandwidth: 100.0MByte/s Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 512.0MBit Currently planned availability until at least: 2035

S25HL512TFABHI010

分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)
数据:

Family: HL-T Interface Frequency (SDR/DDR)(MHz): 166 / 102 Interfaces: Quad SPI Operating Temperature max: 85.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Interface Bandwidth: 100.0MByte/s Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 512.0MBit Currently planned availability until at least: 2035

S25HS512TDSBHV010

分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)
数据:

Family: HS-T Interface Frequency (SDR/DDR)(MHz): 166 / 83 Interfaces: Quad SPI Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Operating Temperature max: 105.0°C Interface Bandwidth: 83.0MByte/s Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 512.0MBit Currently planned availability until at least: 2035

S25HS512TDSBHV013

分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)
数据:

Interface Frequency (SDR/DDR)(MHz): 166 / 83 Interfaces: Quad SPI Operating Temperature max: 105.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Family: HS-T Interface Bandwidth: 83.0MByte/s Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 512.0MBit Currently planned availability until at least: 2035

S25HS512TDSMHV013

分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)
数据:

Family: HS-T Interface Frequency (SDR/DDR)(MHz): 166 / 83 Interfaces: Quad SPI Operating Temperature max: 105.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Interface Bandwidth: 83.0MByte/s Qualification: Industrial Lead Ball Finish: Matte Tin Plating Density: 512.0MBit Currently planned availability until at least: 2035

S25HS02GTDZBHB050

分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)
数据:

Family: HS-T Interface Frequency (SDR/DDR)(MHz): 133 / 80 Interfaces: Quad SPI Operating Temperature max: 105.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Interface Bandwidth: 80.0MByte/s Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 2.0GBit Currently planned availability until at least: 2035

S25HS02GTDZBHB053

分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)
数据:

Interfaces: Quad SPI Operating Temperature max: 105.0°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Family: HS-T Interface Frequency (SDR/DDR)(MHz): 133 / 80 Interface Bandwidth: 80.0MByte/s Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 2.0GBit Currently planned availability until at least: 2035

S25HS01GTFAMHV010

分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)
数据:

Interface Frequency (SDR/DDR)(MHz): 166 / 102 Interfaces: Quad SPI Operating Temperature max: 105.0°C Operating Voltage: 1.8V Family: HS-T Peak Reflow Temp: 260.0°C Interface Bandwidth: 102.0MByte/s Qualification: Industrial Lead Ball Finish: Matte Tin Plating Density: 1.0GBit Currently planned availability until at least: 2035

S25HL02GTDZBHB050

分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)
数据:

Family: HL-T Interface Frequency (SDR/DDR)(MHz): 133 / 80 Interfaces: Quad SPI Operating Temperature max: 105.0°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Interface Bandwidth: 80.0MByte/s Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Classification: ISO 26262-compliant Density: 2.0GBit Currently planned availability until at least: 2035