INFINEON
Infineon 英飞凌专注于迎接现代社会的三大科技挑战： 高能效、 移动性和 安全性，为汽车和工业功率器件、芯片卡和安全应用提供半导体和系统解决方案。英飞凌的产品素以高可靠性、卓越质量和创新性著称，并在模拟和混合信号、射频、功率以及嵌入式控制装置领域掌握尖端技术。
Interfaces: Quad SPI
Operating Temperature max: 125.0°C
Operating Voltage: 3.0V
Peak Reflow Temp: 260.0°C
Family: HL-T
Interface Frequency (SDR/DDR)(MHz): 133 / 66
Interface Bandwidth: 66.0MByte/s
Qualification: Automotive
Lead Ball Finish: Matte Tin Plating
Classification: ISO 26262-compliant
Density: 512.0MBit
Currently planned availability until at least: 2035
Family: HS-T
Interface Frequency (SDR/DDR)(MHz): 133 / 66
Interfaces: Quad SPI
Operating Voltage: 1.8V
Operating Temperature max: 105.0°C
Peak Reflow Temp: 260.0°C
Interface Bandwidth: 66.0MByte/s
Qualification: Industrial
Lead Ball Finish: Sn/Ag/Cu
Density: 512.0MBit
Currently planned availability until at least: 2035
Publish in NPSG: N
Publish in PSG: N
Operating Temperature max: 105.0°C
Operating Voltage: 3.0V
Peak Reflow Temp: 260.0°C
Qualification: Automotive
Classification: ISO 26262-compliant
Family: HL-T
Interface Bandwidth: 66.0MByte/s
Interface Frequency (SDR/DDR)(MHz): 133 / 66
Interfaces: Quad SPI
Lead Ball Finish: Sn/Ag/Cu
Density: 1.0GBit
Currently planned availability until at least: 2035
Interface Frequency (SDR/DDR)(MHz): 133 / 66
Interfaces: Quad SPI
Operating Temperature max: 125.0°C
Peak Reflow Temp: 260.0°C
Operating Voltage: 3.0V
Family: HL-T
Interface Bandwidth: 66.0MByte/s
Qualification: Automotive
Lead Ball Finish: Matte Tin Plating
Classification: ISO 26262-compliant
Density: 1.0GBit
Currently planned availability until at least: 2035
Family: HS-T
Interface Frequency (SDR/DDR)(MHz): 133 / 66
Interfaces: Quad SPI
Operating Temperature max: 85.0°C
Operating Voltage: 1.8V
Peak Reflow Temp: 260.0°C
Interface Bandwidth: 66.0MByte/s
Qualification: Industrial
Lead Ball Finish: Sn/Ag/Cu
Density: 1.0GBit
Currently planned availability until at least: 2035
Family: HS-T
Interface Frequency (SDR/DDR)(MHz): 133 / 66
Interfaces: Quad SPI
Operating Temperature max: 105.0°C
Operating Voltage: 1.8V
Peak Reflow Temp: 260.0°C
Interface Bandwidth: 66.0MByte/s
Qualification: Automotive
Lead Ball Finish: Sn/Ag/Cu
Classification: ISO 26262-compliant
Density: 2.0GBit
Currently planned availability until at least: 2035
Interface Frequency (SDR/DDR)(MHz): 133 / 66
Interfaces: Quad SPI
Operating Temperature max: 125.0°C
Operating Voltage: 3.0V
Family: HL-T
Peak Reflow Temp: 260.0°C
Interface Bandwidth: 66.0MByte/s
Qualification: Automotive
Lead Ball Finish: Sn/Ag/Cu
Classification: ISO 26262-compliant
Density: 2.0GBit
Currently planned availability until at least: 2035
Family: HS-T
Interface Frequency (SDR/DDR)(MHz): 133 / 66
Interfaces: Quad SPI
Operating Voltage: 1.8V
Operating Temperature max: 105.0°C
Peak Reflow Temp: 260.0°C
Interface Bandwidth: 66.0MByte/s
Qualification: Industrial
Lead Ball Finish: Matte Tin Plating
Density: 512.0MBit
Currently planned availability until at least: 2035
Family: HS-T
Interface Frequency (SDR/DDR)(MHz): 133 / 66
Interfaces: Quad SPI
Operating Temperature max: 125.0°C
Operating Voltage: 1.8V
Peak Reflow Temp: 260.0°C
Interface Bandwidth: 66.0MByte/s
Qualification: Automotive
Lead Ball Finish: Sn/Ag/Cu
Classification: ISO 26262-compliant
Density: 1.0GBit
Currently planned availability until at least: 2035
Interface Frequency (SDR/DDR)(MHz): 133 / 66
Interfaces: Quad SPI
Operating Temperature max: 85.0°C
Peak Reflow Temp: 260.0°C
Family: HL-T
Operating Voltage: 3.0V
Interface Bandwidth: 66.0MByte/s
Qualification: Automotive
Lead Ball Finish: Matte Tin Plating
Classification: ISO 26262-compliant
Density: 1.0GBit
Currently planned availability until at least: 2035