INFINEON
Infineon 英飞凌专注于迎接现代社会的三大科技挑战： 高能效、 移动性和 安全性，为汽车和工业功率器件、芯片卡和安全应用提供半导体和系统解决方案。英飞凌的产品素以高可靠性、卓越质量和创新性著称，并在模拟和混合信号、射频、功率以及嵌入式控制装置领域掌握尖端技术。
S25FS256TDAWEC119
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)简介: 256Mb SEMPER™ Nano 1.8V QSPI Flash in known good wafer format
Interfaces: Quad SPI
Interface Bandwidth: 40.0MByte/s
Operating Voltage: 1.8V
Interface Frequency (SDR/DDR)(MHz): 80 / -
Family: FS-T
Operating Temperature max: 70.0°C
Qualification: Commercial
Density: 256.0MBit
Currently planned availability until at least: 2033
Interface Frequency (SDR/DDR)(MHz): 133 / 66
Interfaces: Quad SPI
Operating Temperature max: 105.0°C
Peak Reflow Temp: 260.0°C
Family: HL-T
Operating Voltage: 3.0V
Interface Bandwidth: 66.0MByte/s
Qualification: Industrial
Lead Ball Finish: Sn/Ag/Cu
Density: 512.0MBit
Currently planned availability until at least: 2035
Family: HS-T
Interface Frequency (SDR/DDR)(MHz): 133 / 66
Interfaces: Quad SPI
Operating Temperature max: 85.0°C
Operating Voltage: 1.8V
Peak Reflow Temp: 260.0°C
Interface Bandwidth: 66.0MByte/s
Qualification: Industrial
Lead Ball Finish: Matte Tin Plating
Density: 1.0GBit
Currently planned availability until at least: 2035
Interface Frequency (SDR/DDR)(MHz): 133 / 66
Interfaces: Quad SPI
Operating Temperature max: 105.0°C
Operating Voltage: 1.8V
Peak Reflow Temp: 260.0°C
Family: HS-T
Interface Bandwidth: 66.0MByte/s
Qualification: Industrial
Lead Ball Finish: Matte Tin Plating
Density: 1.0GBit
Currently planned availability until at least: 2035
Family: HS-T
Interface Frequency (SDR/DDR)(MHz): 133 / 66
Interfaces: Quad SPI
Operating Temperature max: 85.0°C
Operating Voltage: 1.8V
Peak Reflow Temp: 260.0°C
Interface Bandwidth: 66.0MByte/s
Qualification: Automotive
Lead Ball Finish: Matte Tin Plating
Classification: ISO 26262-compliant
Density: 1.0GBit
Currently planned availability until at least: 2035
Interfaces: Quad SPI
Operating Temperature max: 125.0°C
Operating Voltage: 1.8V
Peak Reflow Temp: 260.0°C
Family: HS-T
Interface Frequency (SDR/DDR)(MHz): 133 / 66
Interface Bandwidth: 66.0MByte/s
Qualification: Automotive
Lead Ball Finish: Sn/Ag/Cu
Classification: ISO 26262-compliant
Density: 512.0MBit
Currently planned availability until at least: 2035
Family: HL-T
Interface Frequency (SDR/DDR)(MHz): 133 / 66
Interfaces: Quad SPI
Operating Voltage: 3.0V
Peak Reflow Temp: 260.0°C
Operating Temperature max: 105.0°C
Interface Bandwidth: 66.0MByte/s
Qualification: Automotive
Lead Ball Finish: Sn/Ag/Cu
Classification: ISO 26262-compliant
Density: 512.0MBit
Currently planned availability until at least: 2035
S25FS256TDAWEC109
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)简介: 256Mb SEMPER™ Nano 1.8V QSPI Flash in known good wafer format
Family: FS-T
Interface Frequency (SDR/DDR)(MHz): 80 / -
Operating Voltage: 1.8V
Interface Bandwidth: 40.0MByte/s
Interfaces: Quad SPI
Operating Temperature max: 70.0°C
Qualification: Commercial
Density: 256.0MBit
Currently planned availability until at least: 2033
Interface Frequency (SDR/DDR)(MHz): NA
Interfaces: Parallel
Operating Temperature max: 85.0°C
Operating Voltage: 3.0V
Page Access Time: 15.0ns
Peak Reflow Temp: 260.0°C
Initial Access Time: 70.0ns
Family: GL-S
Qualification: Industrial
Lead Ball Finish: Matte Tin Plating
Density: 64.0MBit
Interface Frequency (SDR/DDR)(MHz): NA
Interfaces: Parallel
Operating Temperature max: 85.0°C
Page Access Time: 15.0ns
Peak Reflow Temp: 260.0°C
Family: GL-S
Operating Voltage: 3.0V
Initial Access Time: 100.0ns
Qualification: Automotive
Lead Ball Finish: Matte Tin Plating
Density: 512.0MBit