INFINEON
Infineon 英飞凌专注于迎接现代社会的三大科技挑战: 高能效、 移动性和 安全性,为汽车和工业功率器件、芯片卡和安全应用提供半导体和系统解决方案。英飞凌的产品素以高可靠性、卓越质量和创新性著称,并在模拟和混合信号、射频、功率以及嵌入式控制装置领域掌握尖端技术。
Family: GL-T
Initial Access Time: 100.0ns
Interfaces: Parallel
Operating Temperature max: 85.0°C
Operating Voltage: 3.0V
Peak Reflow Temp: 260.0°C
Page Access Time: 15.0ns
Interface Frequency (SDR/DDR)(MHz): NA
Qualification: Industrial
Lead Ball Finish: Matte Tin Plating
Density: 1.0GBit
Initial Access Time: 110.0ns
Interfaces: Parallel
Operating Temperature max: 85.0°C
Operating Voltage: 3.0V
Peak Reflow Temp: 260.0°C
Family: GL-T
Page Access Time: 25.0ns
Interface Frequency (SDR/DDR)(MHz): NA
Qualification: Industrial
Lead Ball Finish: Matte Tin Plating
Density: 512.0MBit
Family: GL-S
Initial Access Time: 110.0ns
Interfaces: Parallel
Operating Temperature max: 85.0°C
Operating Voltage: 3.0V
Page Access Time: 15.0ns
Peak Reflow Temp: 260.0°C
Interface Frequency (SDR/DDR)(MHz): NA
Qualification: Industrial
Lead Ball Finish: Sn/Ag/Cu
Density: 1.0GBit
Family: GL-S
Interface Frequency (SDR/DDR)(MHz): NA
Interfaces: Parallel
Operating Temperature max: 105.0°C
Operating Voltage: 3.0V
Page Access Time: 15.0ns
Peak Reflow Temp: 260.0°C
Initial Access Time: 110.0ns
Qualification: Automotive
Lead Ball Finish: Sn/Ag/Cu
Density: 512.0MBit
Initial Access Time: 120.0ns
Interface Frequency (SDR/DDR)(MHz): NA
Operating Temperature max: 105.0°C
Operating Voltage: 3.0V
Page Access Time: 15.0ns
Peak Reflow Temp: 260.0°C
Family: GL-T
Interfaces: Parallel
Qualification: Industrial
Lead Ball Finish: Matte Tin Plating
Density: 1.0GBit
Family: GL-S
Interface Frequency (SDR/DDR)(MHz): NA
Interfaces: Parallel
Operating Temperature max: 85.0°C
Operating Voltage: 3.0V
Page Access Time: 15.0ns
Peak Reflow Temp: 260.0°C
Initial Access Time: 100.0ns
Qualification: Industrial
Lead Ball Finish: Matte Tin Plating
Density: 512.0MBit
Family: GL-T
Initial Access Time: 110.0ns
Interfaces: Parallel
Operating Temperature max: 85.0°C
Operating Voltage: 3.0V
Page Access Time: 20.0ns
Peak Reflow Temp: 260.0°C
Interface Frequency (SDR/DDR)(MHz): -
Qualification: Industrial
Lead Ball Finish: Sn/Ag/Cu
Density: 2.0GBit
Family: GL-T
Initial Access Time: 130.0ns
Interface Frequency (SDR/DDR)(MHz): NA
Interfaces: Parallel
Operating Temperature max: 125.0°C
Operating Voltage: 3.0V
Page Access Time: 15.0ns
Peak Reflow Temp: 260.0°C
Qualification: Industrial
Lead Ball Finish: Matte Tin Plating
Density: 512.0MBit
Interface Frequency (SDR/DDR)(MHz): NA
Interfaces: Parallel
Operating Temperature max: 85.0°C
Operating Voltage: 3.0V
Page Access Time: 15.0ns
Family: GL-S
Initial Access Time: 110.0ns
Qualification: Industrial
Lead Ball Finish: Sn/Pb
Peak Reflow Temp: 220.0°C
Density: 512.0MBit
Initial Access Time: 100.0ns
Interface Frequency (SDR/DDR)(MHz): NA
Interfaces: Parallel
Operating Temperature max: 85.0°C
Operating Voltage: 3.0V
Family: GL-S
Peak Reflow Temp: 260.0°C
Qualification: Industrial
Lead Ball Finish: Sn/Ag/Cu
Density: 512.0MBit