INFINEON

Infineon 英飞凌专注于迎接现代社会的三大科技挑战：高能效、移动性和安全性，为汽车和工业功率器件、芯片卡和安全应用提供半导体和系统解决方案。英飞凌的产品素以高可靠性、卓越质量和创新性著称，并在模拟和混合信号、射频、功率以及嵌入式控制装置领域掌握尖端技术。

S29GL256S10DHI023

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数据:

Family: GL-S Interface Frequency (SDR/DDR)(MHz): NA Interfaces: Parallel Operating Temperature max: 85.0°C Operating Voltage: 3.0V Page Access Time: 15.0ns Peak Reflow Temp: 260.0°C Initial Access Time: 100.0ns Qualification: Industrial Lead Ball Finish: Sn/Ag/Cu Density: 256.0MBit

CY62157GE30-45ZXIT

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数据:

Lead Ball Finish: Pure Sn Operating Temperature max: 85.0°C Operating Voltage max: 3.6V Peak Reflow Temp: 260.0°C Interfaces: Parallel Family: MoBL™ SRAM Organization (X x Y): 512K x 16 Qualification: Industrial Density: 8.0MBit

CY62157GE30-45BVXI

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数据:

Operating Voltage max: 3.6V Peak Reflow Temp: 260.0°C Lead Ball Finish: Sn/Ag/Cu Operating Temperature max: 85.0°C Interfaces: Parallel Family: MoBL™ SRAM Organization (X x Y): 512K x 16 Qualification: Industrial Density: 8.0MBit Currently planned availability until at least: 2033

CY62157G30-45BVXI

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数据:

Lead Ball Finish: Sn/Ag/Cu Operating Temperature max: 85.0°C Operating Voltage max: 3.6V Peak Reflow Temp: 260.0°C Interfaces: Parallel Family: MoBL™ SRAM Organization (X x Y): 512K x 16 Qualification: Industrial Density: 8.0MBit Currently planned availability until at least: 2033

CY7C1061G18-15BV1XIT

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数据:

Operating Temperature max: 85.0°C Operating Voltage(VCCQ) max: 2.2V Operating Voltage max: 2.2V Organization (X x Y): 1M x 16 Qualification: Industrial Speed: 15.0ns Peak Reflow Temp: 260.0°C Lead Ball Finish: Sn/Ag/Cu Interfaces: Parallel Family: FAST SRAM Density: 16.0MBit

CY7C1061GE30-10BVXIT

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数据:

Lead Ball Finish: Sn/Ag/Cu Operating Temperature max: 85.0°C Operating Voltage max: 3.6V Organization (X x Y): 1M x 16 Peak Reflow Temp: 260.0°C Qualification: Industrial Speed: 10.0ns Operating Voltage(VCCQ) max: 3.6V Interfaces: Parallel Family: FAST SRAM Density: 16.0MBit

CY62167GE30-45BVXI

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数据:

Lead Ball Finish: Sn/Ag/Cu Operating Voltage max: 3.6V Peak Reflow Temp: 260.0°C Operating Temperature max: 85.0°C Interfaces: Parallel Family: MoBL™ SRAM Organization (X x Y): 1M x 16 Qualification: Industrial Density: 16.0MBit Currently planned availability until at least: 2033

CY7C1041G30-10ZSXET

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数据:

Lead Ball Finish: Ni/Pd/Au Operating Voltage(VCCQ) max: 3.6V Operating Voltage max: 3.6V Peak Reflow Temp: 260.0°C Qualification: Automotive(E) Speed: 10.0ns Operating Temperature max: 125.0°C Organization (X x Y): 256Kb x 16 Interfaces: Parallel Family: FAST SRAM Density: 4.0MBit

CY7C1061G-10BVXI

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数据:

Lead Ball Finish: Sn/Ag/Cu Operating Temperature max: 85.0°C Operating Voltage(VCCQ) max: 5.5V Operating Voltage max: 5.5V Qualification: Industrial Speed: 10.0ns Organization (X x Y): 1M x 16 Peak Reflow Temp: 260.0°C Interfaces: Parallel Family: FAST SRAM Density: 16.0MBit Currently planned availability until at least: 2033

CY7C1069GN30-10BVXI

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数据:

Operating Temperature max: 85.0°C Operating Voltage(VCCQ) max: 3.6V Organization (X x Y): 2M x 8 Peak Reflow Temp: 260.0°C Qualification: Industrial Speed: 10.0ns Lead Ball Finish: Sn/Ag/Cu Operating Voltage max: 3.6V Interfaces: Parallel Family: FAST SRAM Density: 16.0MBit