INFINEON

Infineon 英飞凌专注于迎接现代社会的三大科技挑战: 高能效、 移动性和 安全性,为汽车和工业功率器件、芯片卡和安全应用提供半导体和系统解决方案。英飞凌的产品素以高可靠性、卓越质量和创新性著称,并在模拟和混合信号、射频、功率以及嵌入式控制装置领域掌握尖端技术。

CY621472GN30-45ZSXI

分类:
数据:
Lead Ball Finish: Pure Sn Operating Temperature max: 85.0°C Operating Voltage(VCCQ) max: 3.6V Operating Voltage max: 3.6V Organization (X x Y): 256K x 16 Peak Reflow Temp: 260.0°C Qualification: Industrial Speed: 45.0ns Interfaces: Parallel Family: MoBL™ SRAM Density: 4.0MBit

CY62167G18-55ZXI

分类:
数据:
Lead Ball Finish: Pure Sn Operating Temperature max: 85.0°C Operating Voltage max: 2.2V Peak Reflow Temp: 260.0°C Interfaces: Parallel Family: MoBL™ SRAM Organization (X x Y): 1M x 16 Qualification: Industrial Density: 16.0MBit

CY62167G30-45ZXI

分类:
数据:
Lead Ball Finish: Pure Sn Operating Temperature max: 85.0°C Operating Voltage max: 3.6V Peak Reflow Temp: 260.0°C Interfaces: Parallel Family: MoBL™ SRAM Organization (X x Y): 1M x 16 Qualification: Industrial Density: 16.0MBit Currently planned availability until at least: 2033
Lead Ball Finish: Ni/Pd/Au Operating Temperature max: 125.0°C Operating Voltage(VCCQ) max: 3.6V Operating Voltage max: 3.6V Organization (X x Y): 64K x 16 Peak Reflow Temp: 260.0°C Speed: 55.0ns Interfaces: Parallel Family: MoBL™ SRAM Qualification: Automotive Density: 1.0MBit
Operating Temperature max: 85.0°C Operating Voltage(VCCQ) max: 3.6V Operating Voltage max: 3.6V Organization (X x Y): 128K x 16 Qualification: Industrial Speed: 10.0ns Lead Ball Finish: Pure Sn Peak Reflow Temp: 260.0°C Interfaces: Parallel Family: FAST SRAM Density: 2.0MBit

CY7C1020DV33-10ZSXI

分类:
数据:
Lead Ball Finish: Ni/Pd/Au Operating Temperature max: 85.0°C Operating Voltage(VCCQ) max: 3.6V Operating Voltage max: 3.6V Qualification: Industrial Speed: 10.0ns Organization (X x Y): 32K x 16 Peak Reflow Temp: 260.0°C Interfaces: Parallel Family: FAST SRAM Density: 512.0kBit

CY7C1061GE-10BVXI

分类:
数据:
Lead Ball Finish: Sn/Ag/Cu Operating Temperature max: 85.0°C Operating Voltage(VCCQ) max: 5.5V Organization (X x Y): 1M x 16 Qualification: Industrial Speed: 10.0ns Operating Voltage max: 5.5V Peak Reflow Temp: 260.0°C Interfaces: Parallel Family: FAST SRAM Density: 16.0MBit Currently planned availability until at least: 2033
Lead Ball Finish: Pure Sn Operating Temperature max: 85.0°C Operating Voltage(VCCQ) max: 2.2V Operating Voltage max: 2.2V Organization (X x Y): 1M x 16 Qualification: Industrial Speed: 15.0ns Peak Reflow Temp: 260.0°C Interfaces: Parallel Family: FAST SRAM Density: 16.0MBit

CY62147GN30-45B2XIT

分类:
数据:
Lead Ball Finish: Sn/Ag/Cu Operating Voltage max: 3.6V Peak Reflow Temp: 260.0°C Operating Temperature max: 85.0°C Interfaces: Parallel Family: MoBL™ SRAM Organization (X x Y): 256K x 16 Qualification: Industrial Density: 4.0MBit
Lead Ball Finish: None Operating Temperature max: 85.0°C Operating Voltage(VCCQ) max: 5.5V Operating Voltage max: 5.5V Organization (X x Y): x8 / x16 Qualification: Industrial Interfaces: Parallel Density: 4.0MBit Family: MoBL™ SRAM