INFINEON

Infineon 英飞凌专注于迎接现代社会的三大科技挑战：高能效、移动性和安全性，为汽车和工业功率器件、芯片卡和安全应用提供半导体和系统解决方案。英飞凌的产品素以高可靠性、卓越质量和创新性著称，并在模拟和混合信号、射频、功率以及嵌入式控制装置领域掌握尖端技术。

CY62136FV30LL-45BVXI

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Lead Ball Finish: Sn/Ag/Cu Operating Temperature max: 85.0°C Peak Reflow Temp: 260.0°C Operating Voltage max: 3.6V Interfaces: Parallel Family: MoBL™ SRAM Organization (X x Y): 128K x 16 Qualification: Industrial Density: 2.0MBit Currently planned availability until at least: 2031

CY62126EV30LL-45ZSXIT

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数据:

Lead Ball Finish: Ni/Pd/Au Operating Temperature max: 85.0°C Operating Voltage(VCCQ) max: 3.6V Operating Voltage max: 3.6V Peak Reflow Temp: 260.0°C Qualification: Industrial Organization (X x Y): 64K x 16 Speed: 45.0ns Interfaces: Parallel Family: MoBL™ SRAM Density: 1.0MBit

CY7C1061GE30-10BV1XI

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数据:

Operating Temperature max: 85.0°C Operating Voltage(VCCQ) max: 3.6V Operating Voltage max: 3.6V Organization (X x Y): 1M x 16 Peak Reflow Temp: 260.0°C Qualification: Industrial Speed: 10.0ns Lead Ball Finish: Sn/Ag/Cu Interfaces: Parallel Family: FAST SRAM Density: 16.0MBit Currently planned availability until at least: 2033

CY62138FV30LL-45ZAXA

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数据:

Operating Temperature max: 85.0°C Operating Voltage(VCCQ) max: 3.6V Operating Voltage max: 3.6V Organization (X x Y): 256K x 8 Peak Reflow Temp: 260.0°C Speed: 45.0ns Lead Ball Finish: Pure Sn Interfaces: Parallel Family: MoBL™ SRAM Qualification: Automotive Density: 2.0MBit Currently planned availability until at least: 2031

CY7C1021DV33-10BVXI

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数据:

Lead Ball Finish: Sn/Ag/Cu Operating Temperature max: 85.0°C Operating Voltage(VCCQ) max: 3.6V Operating Voltage max: 3.6V Organization (X x Y): 64K x 16 Peak Reflow Temp: 260.0°C Speed: 10.0ns Qualification: Industrial Interfaces: Parallel Family: FAST SRAM Density: 1.0MBit

CY62128ELL-45SXAT

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数据:

Lead Ball Finish: Pure Sn;Ni/Pd/Au Operating Voltage(VCCQ) max: 5.5V Operating Voltage max: 5.5V Organization (X x Y): 128K x 8 Peak Reflow Temp: 260.0°C Speed: 45.0ns Operating Temperature max: 85.0°C Interfaces: Parallel Family: MoBL™ SRAM Qualification: Automotive Density: 1.0MBit

CY62128ELL-45SXI

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数据:

Lead Ball Finish: Pure Sn Operating Temperature max: 85.0°C Operating Voltage(VCCQ) max: 5.5V Operating Voltage max: 5.5V Qualification: Industrial Speed: 45.0ns Peak Reflow Temp: 260.0°C Organization (X x Y): 128K x 8 Interfaces: Parallel Family: MoBL™ SRAM Density: 1.0MBit

CY62136FV30LL-55ZSXE

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数据:

Operating Temperature max: 125.0°C Operating Voltage(VCCQ) max: 3.6V Organization (X x Y): 128K x 16 Peak Reflow Temp: 260.0°C Speed: 55.0ns Operating Voltage max: 3.6V Lead Ball Finish: Ni/Pd/Au Interfaces: Parallel Family: MoBL™ SRAM Qualification: Automotive Density: 2.0MBit Currently planned availability until at least: 2031

CY62157EV30LL-55ZSXET

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数据:

Lead Ball Finish: Pure Sn;Ni/Pd/Au Operating Temperature max: 125.0°C Operating Voltage(VCCQ) max: 3.6V Operating Voltage max: 3.6V Organization (X x Y): 512K x 16 Speed: 55.0ns Peak Reflow Temp: 260.0°C Interfaces: Parallel Family: MoBL™ SRAM Qualification: Automotive Density: 8.0MBit

CY62157EV30LL-45BVXI

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简介: High-Density 8 Mbit MoBL™ Parallel SRAM for Industrial Applications

Lead Ball Finish: Sn/Ag/Cu Operating Temperature max: 85.0°C Peak Reflow Temp: 260.0°C Operating Voltage max: 3.6V Interfaces: Parallel Family: MoBL™ SRAM Organization (X x Y): 512K x 16 Qualification: Industrial Density: 8.0MBit Currently planned availability until at least: 2033