INFINEON
Infineon 英飞凌专注于迎接现代社会的三大科技挑战: 高能效、 移动性和 安全性,为汽车和工业功率器件、芯片卡和安全应用提供半导体和系统解决方案。英飞凌的产品素以高可靠性、卓越质量和创新性著称,并在模拟和混合信号、射频、功率以及嵌入式控制装置领域掌握尖端技术。
Lead Ball Finish: Ni/Pd/Au
Operating Voltage(VCCQ) max: 3.6V
Operating Voltage max: 3.6V
Qualification: Industrial
Speed: 45.0ns
Organization (X x Y): 256K x 16
Peak Reflow Temp: 260.0°C
Operating Temperature max: 85.0°C
Interfaces: Parallel
Family: MoBL™ SRAM
Density: 4.0MBit
Currently planned availability until at least: 2033
Lead Ball Finish: Pure Sn
Operating Voltage(VCCQ) max: 3.6V
Operating Voltage max: 3.6V
Peak Reflow Temp: 260.0°C
Qualification: Industrial
Speed: 10.0ns
Operating Temperature max: 85.0°C
Organization (X x Y): 2M x 8
Interfaces: Parallel
Family: FAST SRAM
Density: 16.0MBit
Lead Ball Finish: Sn/Ag/Cu
Operating Temperature max: 125.0°C
Operating Voltage(VCCQ) max: 3.6V
Operating Voltage max: 3.6V
Organization (X x Y): 1Mb x 16
Speed: 55.0ns
Qualification: Automotive(E)
Peak Reflow Temp: 260.0°C
Interfaces: Parallel
Family: MoBL™ SRAM
Density: 16.0MBit
Operating Temperature max: 85.0°C
Operating Voltage(VCCQ) max: 3.6V
Organization (X x Y): 512K x 8
Qualification: Industrial
Speed: 10.0ns
Lead Ball Finish: Pure Sn
Peak Reflow Temp: 260.0°C
Operating Voltage max: 3.6V
Interfaces: Parallel
Family: FAST SRAM
Density: 4.0MBit
Lead Ball Finish: Sn/Ag/Cu
Operating Temperature max: 85.0°C
Operating Voltage(VCCQ) max: 2.2V
Operating Voltage max: 2.2V
Organization (X x Y): 1M x 16
Peak Reflow Temp: 260.0°C
Qualification: Industrial
Speed: 15.0ns
Interfaces: Parallel
Family: FAST SRAM
Density: 16.0MBit
Lead Ball Finish: Sn/Ag/Cu
Operating Temperature max: 85.0°C
Operating Voltage(VCCQ) max: 5.5V
Operating Voltage max: 5.5V
Peak Reflow Temp: 260.0°C
Qualification: Industrial
Organization (X x Y): 2M x 8
Speed: 10.0ns
Interfaces: Parallel
Family: FAST SRAM
Density: 16.0MBit
Operating Temperature max: 85.0°C
Operating Voltage(VCCQ) max: 2.2V
Operating Voltage max: 2.2V
Organization (X x Y): 1M x 16
Peak Reflow Temp: 260.0°C
Qualification: Industrial
Speed: 15.0ns
Lead Ball Finish: Sn/Ag/Cu
Interfaces: Parallel
Family: FAST SRAM
Density: 16.0MBit
Operating Voltage max: 3.6V
Peak Reflow Temp: 260.0°C
Lead Ball Finish: Pure Sn
Operating Temperature max: 85.0°C
Interfaces: Parallel
Family: MoBL™ SRAM
Organization (X x Y): 2M x 16
Qualification: Industrial
Density: 32.0MBit
Lead Ball Finish: Pure Sn
Operating Temperature max: 85.0°C
Operating Voltage(VCCQ) max: 5.5V
Organization (X x Y): 256K x 16
Peak Reflow Temp: 260.0°C
Qualification: Industrial
Speed: 45.0ns
Operating Voltage max: 5.5V
Interfaces: Parallel
Family: MoBL™ SRAM
Density: 4.0MBit
Lead Ball Finish: Sn/Ag/Cu
Operating Temperature max: 85.0°C
Operating Voltage(VCCQ) max: 3.6V
Organization (X x Y): 256K x 16
Peak Reflow Temp: 260.0°C
Qualification: Industrial
Speed: 10.0ns
Operating Voltage max: 3.6V
Interfaces: Parallel
Family: FAST SRAM
Density: 4.0MBit