NVM / 凌捷掩膜: 100.0kByte CPU: 16-bit Certifications: CC EAL5+ high RAM: 4.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Applications: transport ticketing Delivery Forms: MCC8 Delivery Forms: NiAu-bump Delivery Forms: sawn wafer Interfaces: ISO 14443 A/B Interfaces: ISO 18092 passive mode Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1) Package: MCC8 Product Description: contactless security controller

NVM / 凌捷掩膜: 240.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: Dual 16-bit Certifications: CC EAL6+ high Certifications: EMVCo RAM: 8.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: Integrity Guard Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Applications: government identification Delivery Forms: contact-based module Delivery Forms: sawn wafer Interfaces: ISO 7816 Product Description: security cryptocontroller

NVM / 凌捷掩膜: 628.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: Dual 16-bit Certifications: CC EAL6+ high Certifications: EMVCo RAM: 12.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Symmetric Cryptography: ECC Symmetric Cryptography: RSA Leading Technologies: Integrity Guard Leading Technologies: NFC optimized Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Applications: NFC Delivery Forms: sawn wafer Interfaces: ACLB Interfaces: I2C Interfaces: ISO 7816 更多

NVM / 凌捷掩膜: 300.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: Dual 16-bit Certifications: CC EAL6+ high Certifications: EMVCo RAM: 8.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: Integrity Guard Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Applications: government identification Delivery Forms: contact-based module Delivery Forms: sawn wafer Interfaces: ISO 7816 Product Description: security cryptocontroller

NVM / 凌捷掩膜: 404.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: Dual 16-bit Certifications: CC EAL6+ high Certifications: EMVCo RAM: 8.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: Integrity Guard Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Applications: government identification Delivery Forms: contact-based module Delivery Forms: sawn wafer Interfaces: ISO 7816 Product Description: security cryptocontroller

Ambient Temperature max: 85.0°C Applications: SIM and UICC for mobile communication Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: 32-bit Certifications: CC EAL6+ high Certifications: EMVCo Delivery Forms: sawn wafer Delivery Forms: CSP Delivery Forms: SMD Interfaces: GPIOs Interfaces: ISO 7816 Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1) Interfaces: SPI Interfaces: SWP Interfaces: I2C Interfaces: USB Leading Technologies: SOLID FLASH™ NVM / 凌捷掩膜 max: 2.0MByte Product Description: 32-bit USB and SWP SIM card security cryptocontroller 更多

NVM / 凌捷掩膜: 628.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: Dual 16-bit Certifications: CC EAL6+ high Certifications: EMVCo RAM: 12.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES User ROM: 444.0kByte Leading Technologies: Integrity Guard Leading Technologies: Mega Memory Leading Technologies: SOLID FLASH™ Leading Technologies: Very High Bit Rates (VHBR) Ambient Temperature max: 85.0°C Applications: government identification Delivery Forms: contactless module Delivery Forms: dual-interface module Delivery Forms: sawn wafer Interfaces: ISO 14443 A/B 更多

NVM / 凌捷掩膜: 300.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: Dual 16-bit Certifications: CC EAL6+ high Certifications: EMVCo RAM: 8.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: Integrity Guard Ambient Temperature max: 85.0°C Leading Technologies: SOLID FLASH™ Applications: government identification Delivery Forms: contactless module Delivery Forms: dual-interface module Delivery Forms: sawn wafer Interfaces: ISO 14443 A/B Interfaces: ISO 18092 passive mode Interfaces: ISO 7816 Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1) Product Description: contactless security cryptocontroller with dual-interface

NVM / 凌捷掩膜: 300.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: Dual 16-bit Certifications: CC EAL6+ high Certifications: EMVCo RAM: 8.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: Integrity Guard Leading Technologies: SOLID FLASH™ Leading Technologies: Very High Bit Rates (VHBR) Ambient Temperature max: 85.0°C Applications: government identification Delivery Forms: contactless module Delivery Forms: dual-interface module Delivery Forms: sawn wafer Interfaces: ISO 14443 A/B Interfaces: ISO 18092 passive mode Interfaces: ISO 7816 更多

NVM / 凌捷掩膜: 404.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: Dual 16-bit Certifications: CC EAL6+ high Certifications: EMVCo RAM: 8.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: Integrity Guard Leading Technologies: NFC optimized Ambient Temperature max: 85.0°C Leading Technologies: SOLID FLASH™ Applications: government identification Delivery Forms: contactless module Delivery Forms: dual-interface module Delivery Forms: sawn wafer Interfaces: ISO 14443 A/B Interfaces: ISO 18092 passive mode Interfaces: ISO 7816 更多