Clamping force [kn] max: 8.0 Diameter [mm]: 58.0 Height [mm]: 26.0 Creeping distance [mm] min: 23.0 Suitable for: Disc type devices Housing: T58/26 Features: Housing diameter: 58 mm Features: Height: 26 mm Features: Easy mounting for single sided cooling Features: Clamping force: 8.0 kN Features: Min. creeping distance: 23 mm
Features: Wave length: 905 nm Features: Operating temp.: -40 .. +85°C Features: Storage temp.: -40 .. +100°C Suitable for: Light Triggered Thyristors (LTT) Housing: T76.35L Housing: T150.40L Housing: T172.40L

1544356-1

制造商: TE CONNECTIVITY AMP CONNECTORS
分类: 半导体分立器件和附件 / 半导体分立器件附件

描述: SIL 触头 通孔 锡

夹子样式: SIL 夹子类型: - 夹子长度: 0.065(1.65mm) 引脚长度: 0.776(19.70mm) 端接: 通孔 框架厚度: 0.010(0.25mm) 框架宽度: 1.102(28.00mm) 间距: 0.098(2.50mm) 触头材料: - 触头表面处理: 锡 板厚度: - 特性: -

1544118-1

制造商: TE CONNECTIVITY AMP CONNECTORS
分类: 半导体分立器件和附件 / 半导体分立器件附件

描述: SIL 触头 Y1 通孔 锡

夹子样式: SIL 夹子类型: Y1 夹子长度: 0.071(1.80mm) 引脚长度: 0.776(19.70mm) 端接: 通孔 框架厚度: 0.010(0.25mm) 框架宽度: 1.102(28.00mm) 间距: 0.098(2.50mm) 触头材料: 磷青铜 触头表面处理: 锡 板厚度: 0.025(0.64mm) 特性: -