Architecture: QDR-II Burst Length(Words): 4 ECC: N Family: QDR-II Frequency: 250.0MHz Lead Ball Finish: Sn/Ag/Cu On-Die Termination: N Operating Temperature: None°C Peak Reflow Temp: 260.0°C Qualification: Commercial Data Width: x 36 Organization (X x Y): 4Mb x 36 Read Latency (Cycles): 1.5 Bank Switching: N Operating Voltage: NoneV Interfaces: Parallel Density: 147456.0kBit Density: 144.0MBit

Architecture: Standard Sync, Pipeline SCD Bank Switching: N Burst Length(Words): 4 Data Width: x 36 Family: Standard Sync Frequency: 167.0MHz On-Die Termination: N Operating Temperature: None°C Qualification: Commercial Read Latency (Cycles): 2.0 Peak Reflow Temp: 260.0°C Lead Ball Finish: Pure Sn ECC: N Organization (X x Y): 512Kb x 36 Operating Voltage: NoneV Interfaces: Parallel Density: 18432.0kBit Density: 18.0MBit

Architecture: Standard Sync, Flow-through Bank Switching: N Data Width: x 36 ECC: N Frequency: 100.0MHz Operating Temperature: None°C Organization (X x Y): 256Kb x 36 Qualification: Automotive(E) Lead Ball Finish: Sn/Ag/Cu Peak Reflow Temp: 260.0°C On-Die Termination: N Operating Voltage: NoneV Interfaces: Parallel Density: 9216.0kBit Density: 9.0MBit

Architecture: Standard Sync, Flow-through Bank Switching: N Burst Length(Words): 4 Data Width: x 36 Family: Standard Sync Frequency: 100.0MHz Lead Ball Finish: Sn/Ag/Cu On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 512Kb x 36 Qualification: Industrial Read Latency (Cycles): 1.0 Peak Reflow Temp: 260.0°C ECC: N Operating Voltage: NoneV Interfaces: Parallel Density: 18432.0kBit Density: 18.0MBit

Bank Switching: N Data Width: x 36 Lead Ball Finish: Ni/Pd/Au On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 256Kb x 36 Peak Reflow Temp: 260.0°C ECC: N Frequency: 100.0MHz Architecture: Standard Sync, Flow-through Operating Voltage: NoneV Interfaces: Parallel Density: 9216.0kBit Density: 9.0MBit Qualification: Automotive

Architecture: QDR-II Data Width: x 36 ECC: N Family: QDR-II Frequency: 300.0MHz Interfaces: Parallel Lead Ball Finish: Sn/Ag/Cu On-Die Termination: N Operating Temperature: None°C Peak Reflow Temp: 260.0°C Qualification: Industrial Read Latency (Cycles): 1.5 Real Time Clock: N RTC Alarm: N Watchdog: N Burst Length(Words): 4 Organization (X x Y): 2Mb x 36 Bank Switching: N Operating Voltage: NoneV Density: 73728.0kBit Density: 72.0MBit

Architecture: NoBL, Flow-through Burst Length(Words): 4 ECC: N Family: NoBL Frequency: 100.0MHz Lead Ball Finish: Pure Sn On-Die Termination: N Operating Temperature: None°C Organization (X x Y): 512Kb x 36 Peak Reflow Temp: 260.0°C Read Latency (Cycles): 1.0 Data Width: x 36 Bank Switching: N Qualification: Industrial Operating Voltage: NoneV Interfaces: Parallel Density: 18432.0kBit Density: 18.0MBit

Family: QDR-II Operating Temperature: None°C Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Lead Ball Finish: Sn/Pb Interfaces: Parallel Frequency: 250.0MHz Organization (X x Y): 1M x 36 Qualification: Industrial Density: 36.0MBit

Family: KL-3 Interface Frequency (SDR/DDR)(MHz): - / 200 Interfaces: xSPI (Octal) Lead Ball Finish: N/A Operating Temperature: None°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Initial Access Time: 35.0ns Technology: HYPERRAM Interface Bandwidth: 400.0MByte/s Qualification: Automotive Density: 64.0MBit

Initial Access Time: 35.0ns Interface Frequency (SDR/DDR)(MHz): - / 200 Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Operating Voltage: 1.8V Family: KS-2 Peak Reflow Temp: 260.0°C Technology: HYPERRAM Interface Bandwidth: 400.0MByte/s Interfaces: HYPERBUS Qualification: Automotive Density: 512.0MBit