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CY62157GE30-45ZXIT


数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)
Lead Ball Finish: Pure Sn Operating Temperature: None°C Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Interfaces: Parallel Family: MoBL™ SRAM Organization (X x Y): 512K x 16 Qualification: Industrial Density: 8.0MBit

CY62157GE30-45BVXI


数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)
Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Interfaces: Parallel Family: MoBL™ SRAM Organization (X x Y): 512K x 16 Qualification: Industrial Density: 8.0MBit

CY62157G30-45BVXI


数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)
Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Interfaces: Parallel Family: MoBL™ SRAM Organization (X x Y): 512K x 16 Qualification: Industrial Density: 8.0MBit

CY7C1061G18-15BV1XIT


数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)
Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Organization (X x Y): 1M x 16 Qualification: Industrial Speed: 15.0ns Peak Reflow Temp: 260.0°C Lead Ball Finish: Sn/Ag/Cu Interfaces: Parallel Family: FAST SRAM Density: 16384.0kBit

CY7C1061GE30-10BVXIT


数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)
Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Operating Voltage: NoneV Organization (X x Y): 1M x 16 Peak Reflow Temp: 260.0°C Qualification: Industrial Speed: 10.0ns Operating Voltage(VCCQ): NoneV Interfaces: Parallel Family: FAST SRAM Density: 16384.0kBit

CY62167GE30-45BVXI


数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)
Lead Ball Finish: Sn/Ag/Cu Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Operating Temperature: None°C Interfaces: Parallel Family: MoBL™ SRAM Organization (X x Y): 1M x 16 Qualification: Industrial Density: 16.0MBit

CY7C1041G30-10ZSXET


数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)
Lead Ball Finish: Ni/Pd/Au Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Qualification: Automotive(E) Speed: 10.0ns Operating Temperature: None°C Organization (X x Y): 256Kb x 16 Interfaces: Parallel Family: FAST SRAM Density: 4096.0kBit

CY7C1061G-10BVXI


数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)
Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Qualification: Industrial Speed: 10.0ns Organization (X x Y): 1M x 16 Peak Reflow Temp: 260.0°C Interfaces: Parallel Family: FAST SRAM Density: 16384.0kBit

CY7C1069GN30-10BVXI


数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)
Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Organization (X x Y): 2M x 8 Peak Reflow Temp: 260.0°C Qualification: Industrial Speed: 10.0ns Lead Ball Finish: Sn/Ag/Cu Operating Voltage: NoneV Interfaces: Parallel Family: FAST SRAM Density: 16384.0kBit

CY62167G30-55BVXET


数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)
Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Organization (X x Y): 1Mb x 16 Peak Reflow Temp: 260.0°C Qualification: Automotive(E) Speed: 55.0ns Interfaces: Parallel Family: MoBL™ SRAM Density: 16384.0kBit