Lead Ball Finish: Pure Sn
Operating Temperature: None°C
Operating Voltage: NoneV
Peak Reflow Temp: 260.0°C
Interfaces: Parallel
Family: MoBL™ SRAM
Organization (X x Y): 512K x 16
Qualification: Industrial
Density: 8.0MBit
Operating Voltage: NoneV
Peak Reflow Temp: 260.0°C
Lead Ball Finish: Sn/Ag/Cu
Operating Temperature: None°C
Interfaces: Parallel
Family: MoBL™ SRAM
Organization (X x Y): 512K x 16
Qualification: Industrial
Density: 8.0MBit
Lead Ball Finish: Sn/Ag/Cu
Operating Temperature: None°C
Operating Voltage: NoneV
Peak Reflow Temp: 260.0°C
Interfaces: Parallel
Family: MoBL™ SRAM
Organization (X x Y): 512K x 16
Qualification: Industrial
Density: 8.0MBit
Operating Temperature: None°C
Operating Voltage(VCCQ): NoneV
Operating Voltage: NoneV
Organization (X x Y): 1M x 16
Qualification: Industrial
Speed: 15.0ns
Peak Reflow Temp: 260.0°C
Lead Ball Finish: Sn/Ag/Cu
Interfaces: Parallel
Family: FAST SRAM
Density: 16384.0kBit
Lead Ball Finish: Sn/Ag/Cu
Operating Temperature: None°C
Operating Voltage: NoneV
Organization (X x Y): 1M x 16
Peak Reflow Temp: 260.0°C
Qualification: Industrial
Speed: 10.0ns
Operating Voltage(VCCQ): NoneV
Interfaces: Parallel
Family: FAST SRAM
Density: 16384.0kBit
Lead Ball Finish: Sn/Ag/Cu
Operating Voltage: NoneV
Peak Reflow Temp: 260.0°C
Operating Temperature: None°C
Interfaces: Parallel
Family: MoBL™ SRAM
Organization (X x Y): 1M x 16
Qualification: Industrial
Density: 16.0MBit
Lead Ball Finish: Ni/Pd/Au
Operating Voltage(VCCQ): NoneV
Operating Voltage: NoneV
Peak Reflow Temp: 260.0°C
Qualification: Automotive(E)
Speed: 10.0ns
Operating Temperature: None°C
Organization (X x Y): 256Kb x 16
Interfaces: Parallel
Family: FAST SRAM
Density: 4096.0kBit
Lead Ball Finish: Sn/Ag/Cu
Operating Temperature: None°C
Operating Voltage(VCCQ): NoneV
Operating Voltage: NoneV
Qualification: Industrial
Speed: 10.0ns
Organization (X x Y): 1M x 16
Peak Reflow Temp: 260.0°C
Interfaces: Parallel
Family: FAST SRAM
Density: 16384.0kBit
Operating Temperature: None°C
Operating Voltage(VCCQ): NoneV
Organization (X x Y): 2M x 8
Peak Reflow Temp: 260.0°C
Qualification: Industrial
Speed: 10.0ns
Lead Ball Finish: Sn/Ag/Cu
Operating Voltage: NoneV
Interfaces: Parallel
Family: FAST SRAM
Density: 16384.0kBit
Lead Ball Finish: Sn/Ag/Cu
Operating Temperature: None°C
Operating Voltage(VCCQ): NoneV
Operating Voltage: NoneV
Organization (X x Y): 1Mb x 16
Peak Reflow Temp: 260.0°C
Qualification: Automotive(E)
Speed: 55.0ns
Interfaces: Parallel
Family: MoBL™ SRAM
Density: 16384.0kBit