S27KL0642DPBHB023
数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)
描述: 64MBit 3.0 V Automotive (105°C) HyperBus HYPERRAM Gen 2.0 in 24 FBGA
Family: KL-2
Interface Frequency (SDR/DDR)(MHz): - / 166
Lead Ball Finish: N/A
Operating Temperature: None°C
Operating Voltage: 3.0V
Peak Reflow Temp: 260.0°C
Initial Access Time: 36.0ns
Technology: HYPERRAM
Interface Bandwidth: 333.0MByte/s
Interfaces: HYPERBUS
Qualification: Automotive
Density: 64.0MBit
S27KL0642GABHV023
数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)
描述: 64MBit 3.0 V Industrial (105°C) HyperBus HYPERRAM Gen 2.0 in 24 FBGA
Interface Frequency (SDR/DDR)(MHz): - / 200
Lead Ball Finish: N/A
Operating Temperature: None°C
Operating Voltage: 3.0V
Peak Reflow Temp: 260.0°C
Initial Access Time: 35.0ns
Family: KL-2
Technology: HYPERRAM
Interface Bandwidth: 400.0MByte/s
Interfaces: HYPERBUS
Qualification: Industrial
Density: 64.0MBit
S27KS0643GABHI023
数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)
描述: 64MBit 1.8 V Industrial (85°C) xSPI (Octal) HYPERRAM Gen 2.0 in 24 FBGA
Family: KS-3
Interface Frequency (SDR/DDR)(MHz): - / 200
Interfaces: xSPI (Octal)
Lead Ball Finish: N/A
Operating Temperature: None°C
Operating Voltage: 1.8V
Peak Reflow Temp: 260.0°C
Initial Access Time: 35.0ns
Technology: HYPERRAM
Interface Bandwidth: 400.0MByte/s
Qualification: Industrial
Density: 64.0MBit
S70KL1283DPBHB023
数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)
描述: 128MBit 3.0 V Automotive (105°C) xSPI (Octal) HYPERRAM Gen 2.0 in 24 FBGA
Family: KL-3
Interfaces: xSPI (Octal)
Lead Ball Finish: N/A
Operating Temperature: None°C
Operating Voltage: 3.0V
Peak Reflow Temp: 260.0°C
Initial Access Time: 36.0ns
Interface Frequency (SDR/DDR)(MHz): - / 166
Technology: HYPERRAM
Interface Bandwidth: 333.0MByte/s
Qualification: Automotive
Density: 128.0MBit
S70KL1283DPBHI023
数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)
描述: 128MBit 3.0 V Industrial (85°C) xSPI (Octal) HYPERRAM Gen 2.0 in 24 FBGA
Family: KL-3
Initial Access Time: 36.0ns
Interface Frequency (SDR/DDR)(MHz): - / 166
Interfaces: xSPI (Octal)
Lead Ball Finish: N/A
Operating Temperature: None°C
Operating Voltage: 3.0V
Peak Reflow Temp: 260.0°C
Technology: HYPERRAM
Interface Bandwidth: 333.0MByte/s
Qualification: Industrial
Density: 128.0MBit
S80KS2563GABHA020
数据:
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 静态随机存储器(SRAM)
描述: 256MBit 1.8 V Automotive (85°C) xSPI (Octal) HYPERRAM Gen 2.0 in 24 FBGA
Family: KS-3
Initial Access Time: 35.0ns
Interface Frequency (SDR/DDR)(MHz): - / 200
Interfaces: xSPI (Octal)
Lead Ball Finish: Sn/Ag/Cu
Operating Temperature: None°C
Operating Voltage: 1.8V
Peak Reflow Temp: 260.0°C
Technology: HYPERRAM
Interface Bandwidth: 400.0MByte/s
Qualification: Automotive
Density: 256.0MBit
Lead Ball Finish: Sn/Ag/Cu
Operating Temperature: None°C
Operating Voltage(VCCQ): NoneV
Operating Voltage: NoneV
Organization (X x Y): 1M x 16
Peak Reflow Temp: 260.0°C
Speed: 10.0ns
Qualification: Industrial
Interfaces: Parallel
Family: FAST SRAM
Density: 16384.0kBit
Interfaces: Parallel
Operating Temperature: None°C
Operating Voltage(VCCQ): NoneV
Operating Voltage: NoneV
Organization (X x Y): 1Mb x 16
Peak Reflow Temp: 260.0°C
Qualification: Industrial
Speed: 25.0ns
Lead Ball Finish: Pure Sn
Density: 16384.0kBit
Interfaces: Parallel
Lead Ball Finish: Sn/Ag/Cu
Operating Temperature: None°C
Peak Reflow Temp: 260.0°C
Qualification: Industrial
Speed: 30.0ns
Organization (X x Y): 1Mb x 16
Density: 16384.0kBit
Operating Voltage: NoneV
Frequency: 40.0MHz
Interfaces: SPI
Lead Ball Finish: Pure Sn;Ni/Pd/Au
Operating Temperature: None°C
Operating Voltage(VCCQ): NoneV
Operating Voltage: NoneV
Organization (X x Y): 64Kb x 8
Peak Reflow Temp: 260.0°C
Qualification: Industrial
Speed: 0.0ns
Density: 512.0kBit