Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Peak Reflow Temp: 260.0°C Qualification: Industrial Speed: 10.0ns Organization (X x Y): 1M x 16 Operating Voltage: NoneV Interfaces: Parallel Family: FAST SRAM Density: 16384.0kBit

Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Organization (X x Y): 256K x 16 Peak Reflow Temp: 260.0°C Speed: 15.0ns Qualification: Industrial Operating Voltage: NoneV Interfaces: Parallel Family: FAST SRAM Density: 4096.0kBit

Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Organization (X x Y): 256Kb x 16 Peak Reflow Temp: 260.0°C Speed: 45.0ns Qualification: Automotive(A) Lead Ball Finish: Ni/Pd/Au Interfaces: Parallel Family: MoBL™ SRAM Density: 4096.0kBit

Lead Ball Finish: Pure Sn Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Organization (X x Y): 512K x 8 Peak Reflow Temp: 260.0°C Speed: 10.0ns Qualification: Industrial Interfaces: Parallel Family: FAST SRAM Density: 4096.0kBit

Lead Ball Finish: Ni/Pd/Au Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Qualification: Industrial Organization (X x Y): 256K x 16 Peak Reflow Temp: 260.0°C Speed: 45.0ns Interfaces: Parallel Family: MoBL™ SRAM Density: 4096.0kBit

Lead Ball Finish: Pure Sn Operating Temperature: None°C Operating Voltage(VCCQ): NoneV Operating Voltage: NoneV Peak Reflow Temp: 260.0°C Qualification: Industrial Speed: 10.0ns Organization (X x Y): 128K x 16 Interfaces: Parallel Family: FAST SRAM Density: 2048.0kBit

Operating Temperature: None°C Organization (X x Y): 256K x 16 Peak Reflow Temp: 260.0°C Qualification: Industrial Speed: 45.0ns Lead Ball Finish: Pure Sn Operating Voltage: NoneV Operating Voltage(VCCQ): NoneV Interfaces: Parallel Family: MoBL™ SRAM Density: 4096.0kBit

Qualification: Industrial Density: 8.0MBit Interfaces: Parallel Operating Voltage: NoneV Family: FAST SRAM Operating Temperature: None°C Lead Ball Finish: Ni/Pd/Au Organization (X x Y): 1M x 8 Peak Reflow Temp: 260.0°C

Lead Ball Finish: Sn/Ag/Cu Operating Temperature: None°C Peak Reflow Temp: 260.0°C Operating Voltage: NoneV Interfaces: Parallel Family: MoBL™ SRAM Organization (X x Y): 128K x 16 Qualification: Industrial Density: 2.0MBit

Density: 4.0MBit Interfaces: Parallel Lead Ball Finish: Pure Sn Operating Temperature: None°C Operating Voltage: NoneV Organization (X x Y): 512Kb x 8 Peak Reflow Temp: 260.0°C Publish in NPSG: Y Publish in PSG: Y Qualification: Industrial Speed: 45.0ns