NVM / 凌捷掩膜: 528.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: Dual 16-bit Certifications: CC EAL6+ high Certifications: EMVCo RAM: 12.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: Integrity Guard Leading Technologies: Mega Memory Ambient Temperature max: 85.0°C Leading Technologies: SOLID FLASH™ Applications: government identification Delivery Forms: contactless module Delivery Forms: dual-interface module Delivery Forms: sawn wafer Interfaces: ISO 14443 A/B Interfaces: ISO 18092 passive mode Interfaces: ISO 7816 更多

NVM / 凌捷掩膜: 400.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: Dual 16-bit Certifications: CC EAL6+ high Certifications: EMVCo RAM: 8.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Symmetric Cryptography: ECC Symmetric Cryptography: RSA Leading Technologies: Integrity Guard Leading Technologies: NFC optimized Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Applications: NFC Delivery Forms: sawn wafer Interfaces: ACLB Interfaces: ISO 7816 Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1) Product Description: Boosted NFC secure element (SE)

NVM / 凌捷掩膜: 404.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: Dual 16-bit Certifications: CC EAL6+ high Certifications: EMVCo RAM: 8.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: Integrity Guard Leading Technologies: SOLID FLASH™ Leading Technologies: Very High Bit Rates (VHBR) Ambient Temperature max: 85.0°C Applications: government identification Delivery Forms: contactless module Delivery Forms: dual-interface module Delivery Forms: sawn wafer Interfaces: ISO 14443 A/B Interfaces: ISO 18092 passive mode Interfaces: ISO 7816 更多

NVM / 凌捷掩膜: 528.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: Dual 16-bit Certifications: CC EAL6+ high Certifications: EMVCo RAM: 12.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: Integrity Guard Leading Technologies: Mega Memory Leading Technologies: SOLID FLASH™ Leading Technologies: Very High Bit Rates (VHBR) Ambient Temperature max: 85.0°C Applications: government identification Delivery Forms: dual-interface module Delivery Forms: contactless module Delivery Forms: sawn wafer Interfaces: ISO 14443 A/B Interfaces: ISO 18092 passive mode 更多

Ambient Temperature max: 85.0°C Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: 32-bit Certifications: CC EAL5+ high Certifications: EMVCo Leading Technologies: NFC optimized Leading Technologies: SOLID FLASH™ NVM / 凌捷掩膜: 600.0kByte RAM: 32.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Applications: SIM and UICC for mobile communication Delivery Forms: sawn wafer Delivery Forms: SMD Interfaces: ISO 7816 Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1) Interfaces: SWP Product Description: 32-bit SWP SIM card security cryptocontroller

NVM / 凌捷掩膜: 628.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: Dual 16-bit Certifications: CC EAL6+ high Certifications: EMVCo RAM: 12.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: Integrity Guard Leading Technologies: Mega Memory Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Applications: government identification Delivery Forms: contactless module Delivery Forms: dual-interface module Delivery Forms: sawn wafer Interfaces: ISO 14443 A/B Interfaces: ISO 18092 passive mode Interfaces: ISO 7816 更多

NVM / 凌捷掩膜: 628.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: Dual 16-bit Certifications: CC EAL6+ high Certifications: EMVCo Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: Integrity Guard Leading Technologies: Mega Memory Leading Technologies: SOLID FLASH™ Leading Technologies: Very High Bit Rates (VHBR) Ambient Temperature max: 85.0°C Applications: government identification Delivery Forms: contactless module Delivery Forms: dual-interface module Delivery Forms: sawn wafer Interfaces: ISO 14443 A/B Interfaces: ISO 18092 passive mode Interfaces: ISO 7816 更多

NVM / 凌捷掩膜: 312.0kByte CPU: 32-bit RAM: 10.0kByte Ambient Temperature max: 85.0°C Applications: mobile communication Delivery Forms: FCOS™ module S-MFC5.4 (4FF) Delivery Forms: sawn wafer Interfaces: ISO 7816 Package: sawn wafer Product Description: 32-bit SIM card controller Use Cases: SIM and UICC for mobile communication

NVM / 凌捷掩膜: 1.3MByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: 32-bit Certifications: CC EAL5+ high Certifications: EMVCo RAM: 32.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: NFC optimized Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Applications: SIM and UICC for mobile communication Delivery Forms: sawn wafer Delivery Forms: SMD Interfaces: ISO 7816 Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1) Interfaces: SWP Package: VQFN-32 Product Description: 32-bit SWP SIM card security cryptocontroller 更多