Ambient Temperature max: 85.0°C Applications: wearables payment Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: 32-bit Arm® SecurCore® SC300 Certifications: CC EAL6+ high targeted Certifications: CUP (targeted) Certifications: EMVCo (targeted) Delivery Forms: Coil on Module Delivery Forms: sawn wafer Delivery Forms: 6/8 pin dual-interface modules and contactless modules Interfaces: ISO 7816 Interfaces: ISO 14443 A/B Interfaces: ISO 18092 passive mode, optimized for small antenna sizes Interfaces: optional NRG™ (ISO/IEC 14443-3 type A with CRYPTO1) Leading Technologies: SOLID FLASH™ Leading Technologies: Coil on Module NVM / 凌捷掩膜 max: 512.0kByte Applications: multiapplication RAM: 14.0kByte 更多

NVM / 凌捷掩膜: 800.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: 32-bit Certifications: CC EAL5+ high Certifications: EMVCo RAM: 32.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: NFC optimized Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Applications: SIM and UICC for mobile communication Delivery Forms: sawn wafer Delivery Forms: SMD Interfaces: ISO 7816 Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1) Interfaces: SWP Package: VQFN-8 Product Description: 32-bit SWP SIM card security cryptocontroller 更多

NVM / 凌捷掩膜: 800.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: 32-bit Certifications: CC EAL5+ high Certifications: EMVCo RAM: 32.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Delivery Forms: sawn wafer Interfaces: ISO 7816 Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1) Interfaces: SWP Interfaces: USB Product Description: 32-bit USB and SWP SIM card security cryptocontroller Use Cases: SIM and UICC for mobile communication Applications: SIM and UICC for mobile communication Delivery Forms: SMD

NVM / 凌捷掩膜: 1.0MByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: 32-bit Certifications: CC EAL5+ high Certifications: EMVCo RAM: 32.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Applications: SIM and UICC for mobile communication Delivery Forms: sawn wafer Delivery Forms: SMD Interfaces: ISO 7816 Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1) Interfaces: SWP Interfaces: USB Product Description: 32-bit USB and SWP SIM card security cryptocontroller Use Cases: SIM and UICC for mobile communication

NVM / 凌捷掩膜: 1.3MByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: 32-bit Certifications: CC EAL5+ high Certifications: EMVCo RAM: 32.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Applications: SIM and UICC for mobile communication Delivery Forms: sawn wafer Interfaces: ISO 7816 Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1) Interfaces: SWP Interfaces: USB Product Description: 32-bit USB and SWP SIM card security cryptocontroller Use Cases: SIM and UICC for mobile communication Delivery Forms: SMD

NVM / 凌捷掩膜: 1.5MByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: 32-bit Certifications: CC EAL5+ high Certifications: EMVCo RAM: 32.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Applications: SIM and UICC for mobile communication Delivery Forms: sawn wafer Interfaces: ISO 7816 Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1) Interfaces: SWP Interfaces: USB Product Description: 32-bit USB and SWP SIM card security cryptocontroller Use Cases: SIM and UICC for mobile communication Delivery Forms: SMD

NVM / 凌捷掩膜: 500.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: Dual 16-bit Certifications: CC EAL6+ high Certifications: EMVCo RAM: 8.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Symmetric Cryptography: ECC Symmetric Cryptography: RSA User ROM: 182.0kByte Leading Technologies: Integrity Guard Leading Technologies: NFC optimized Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Applications: NFC Delivery Forms: sawn wafer Interfaces: ACLB Interfaces: GPIOs 更多

NVM / 凌捷掩膜: 500.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: Dual 16-bit Certifications: CC EAL6+ high Certifications: EMVCo RAM: 18.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Symmetric Cryptography: ECC Symmetric Cryptography: RSA User ROM: 182.0kByte Leading Technologies: Integrity Guard Leading Technologies: NFC optimized Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Applications: NFC Delivery Forms: sawn wafer Interfaces: ACLB Interfaces: GPIOs 更多

NVM / 凌捷掩膜: 500.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: Dual 16-bit Certifications: CC EAL6+ high Certifications: EMVCo RAM: 18.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Symmetric Cryptography: ECC Symmetric Cryptography: RSA Leading Technologies: Integrity Guard Leading Technologies: NFC optimized Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Applications: NFC Delivery Forms: sawn wafer Interfaces: ACLB Interfaces: GPIOs Interfaces: ISO 7816 更多

NVM / 凌捷掩膜: 500.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: Dual 16-bit Certifications: CC EAL6+ high Certifications: EMVCo RAM: 8.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Symmetric Cryptography: ECC Symmetric Cryptography: RSA Leading Technologies: Integrity Guard Leading Technologies: NFC optimized Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Applications: NFC Delivery Forms: sawn wafer Interfaces: ACLB Interfaces: GPIOs Interfaces: ISO 7816 更多