NVM / 凌捷掩膜: 628.0kByte
Asymmetric Cryptography: ECC up to 521-bit
Asymmetric Cryptography: RSA up to 4096-bit
CPU: Dual 16-bit
Certifications: CC EAL6+ high
Certifications: EMVCo
RAM: 12.0kByte
Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
Symmetric Cryptography: ECC
Symmetric Cryptography: RSA
Leading Technologies: Integrity Guard
Leading Technologies: NFC optimized
Leading Technologies: SOLID FLASH™
Ambient Temperature max: 85.0°C
User ROM: 444.0kByte
Applications: NFC
Delivery Forms: sawn wafer
Interfaces: ACLB
Interfaces: I2C
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Interfaces: ISO 7816
Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1)
Product Description: Boosted NFC secure element (SE)
SLE97CUNSIFX1M00PH
分类: 微电路 / 半导体集成电路 / 专用集成电路(ASIC)
描述: The SLE 97 SOLID FLASH™ family is Infineon’s state-of-the-art 32-bit product generation dedicated to USB token applications
NVM / 凌捷掩膜: 500.0kByte
Asymmetric Cryptography: ECC up to 521-bit
Asymmetric Cryptography: RSA up to 4096-bit
CPU: Dual 16-bit
Certifications: CC EAL6+ high
Certifications: EMVCo
RAM: 12.0kByte
Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
Leading Technologies: Integrity Guard
Leading Technologies: SOLID FLASH™
Ambient Temperature max: 85.0°C
Leading Technologies: Mega Memory
Applications: government identification
Delivery Forms: contact-based module
Delivery Forms: sawn wafer
Interfaces: ISO 7816
Product Description: security cryptocontroller
NVM / 凌捷掩膜: 500.0kByte
Asymmetric Cryptography: ECC up to 521-bit
Asymmetric Cryptography: RSA up to 4096-bit
CPU: Dual 16-bit
Certifications: CC EAL6+ high
Certifications: EMVCo
RAM: 12.0kByte
Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
Leading Technologies: Integrity Guard
Leading Technologies: SOLID FLASH™
Ambient Temperature max: 85.0°C
Applications: USB token
Delivery Forms: sawn wafer
Interfaces: ISO 7816
Interfaces: USB 2.0
Product Description: USB-security cryptocontroller for use in chipcard formfactor
NVM / 凌捷掩膜: 500.0kByte
Asymmetric Cryptography: ECC up to 521-bit
Asymmetric Cryptography: RSA up to 4096-bit
CPU: Dual 16-bit
Certifications: CC EAL6+ high
Certifications: EMVCo
RAM: 12.0kByte
Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
Symmetric Cryptography: ECC
Symmetric Cryptography: RSA
User ROM: 182.0kByte
Leading Technologies: Integrity Guard
Leading Technologies: NFC optimized
Leading Technologies: SOLID FLASH™
Ambient Temperature max: 85.0°C
Applications: NFC
Delivery Forms: sawn wafer
Interfaces: ACLB
Interfaces: GPIOs
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Interfaces: ISO 7816
Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1)
Interfaces: SPI
Product Description: Boosted NFC secure element (SE)
NVM / 凌捷掩膜: 300.0kByte
Asymmetric Cryptography: ECC up to 521-bit
Asymmetric Cryptography: RSA up to 4096-bit
CPU: Dual 16-bit
Certifications: EMVCo
Certifications: CC EAL6+ high
RAM: 12.0kByte
Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
Leading Technologies: Integrity Guard
Leading Technologies: SOLID FLASH™
Ambient Temperature max: 85.0°C
Applications: USB token
Delivery Forms: sawn wafer
Delivery Forms: SMD
Delivery Forms: VQFN-32
Interfaces: USB 2.0
Interfaces: ISO 7816
Package: VQFN-32
Product Description: USB-security cryptocontroller
Ambient Temperature max: 105.0°C
CPU: 32-bit
Certifications: CC EAL5+ high
Certifications: EMVCo
Leading Technologies: SOLID FLASH™
NVM / 凌捷掩膜: 504.0kByte
RAM: 24.0kByte
Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
Asymmetric Cryptography: ECC up to 521-bit
Asymmetric Cryptography: RSA up to 4096-bit
Applications: USB token
Delivery Forms: sawn wafer
Delivery Forms: VQFN-32
Interfaces: 4 GPIOs
Interfaces: I2C
Interfaces: ISO 7816
Interfaces: SPI
Interfaces: USB 2.0
Package: VQFN-32
Product Description: multi-interface USB-security cryptocontroller for industrial use
NVM / 凌捷掩膜: 628.0kByte
CPU: Dual 16-bit
Certifications: CC EAL6+ high
Certifications: EMVCo
RAM: 12.0kByte
Symmetric Cryptography: RSA up to 4096-bit
Symmetric Cryptography: ECC up to 521-bit
User ROM: 444.0kByte
Leading Technologies: Integrity Guard
Leading Technologies: Mega Memory
Leading Technologies: SOLID FLASH™
Ambient Temperature max: 85.0°C
Applications: government identification
Delivery Forms: contactless module
Delivery Forms: dual-interface module
Delivery Forms: sawn wafer
Interfaces: ISO 14443 A/B
Interfaces: ISO 18092 passive mode
Interfaces: ISO 7816
Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1)
Product Description: contactless security cryptocontroller with dual-interface
NVM / 凌捷掩膜: 1.0MByte
Asymmetric Cryptography: ECC up to 521-bit
Asymmetric Cryptography: RSA up to 4096-bit
CPU: 32-bit
Certifications: CC EAL5+ high
Certifications: EMVCo
RAM: 32.0kByte
Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
Leading Technologies: NFC optimized
Leading Technologies: SOLID FLASH™
Ambient Temperature max: 85.0°C
Applications: SIM and UICC for mobile communication
Delivery Forms: sawn wafer
Delivery Forms: SMD
Interfaces: ISO 7816
Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1)
Interfaces: SWP
Product Description: 32-bit SWP SIM card security cryptocontroller
Use Cases: SIM and UICC for mobile communication
Use Cases: SWP UICC for NFC
Applications: FIDO security keys
Applications: authentication & access tokens
Applications: USB tokens
Applications: software protection dongles
Applications: cold wallet tokens
Asymmetric Cryptography: ECC up to 521-bit
Asymmetric Cryptography: RSA up to 4096-bit
CPU: 32-bit Arm® SecurCore® SC300
Certifications: CC EAL6+ high
Delivery Forms: VQFN28
Interfaces: ISO 14443 A/B
Interfaces: ISO 18092 passive mode
Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1)
Interfaces: USB 2.0
Interfaces: ISO 7816
Interfaces: I2C
Interfaces: GPIOs
Product Description: USB-security cryptocontroller with contactless interface
RAM: 24.0kByte
Symmetric Cryptography: AES up to 256-bit
更多
Symmetric Cryptography: DES
Symmetric Cryptography: 3DES
NVM / 凌捷掩膜: 800.0kByte
Ambient Temperature max: 85.0°C
Leading Technologies: SOLID FLASH™
Leading Technologies: USB and NFC optimized
Leading Technologies: Mega Memory