NVM / 凌捷掩膜: 628.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: Dual 16-bit Certifications: CC EAL6+ high Certifications: EMVCo RAM: 12.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Symmetric Cryptography: ECC Symmetric Cryptography: RSA Leading Technologies: Integrity Guard Leading Technologies: NFC optimized Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C User ROM: 444.0kByte Applications: NFC Delivery Forms: sawn wafer Interfaces: ACLB Interfaces: I2C
Interfaces: ISO 7816 Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1) Product Description: Boosted NFC secure element (SE)

SLE97CUNSIFX1M00PH


分类: 微电路 / 半导体集成电路 / 专用集成电路(ASIC)

描述: The SLE 97 SOLID FLASH™ family is Infineon’s state-of-the-art 32-bit product generation dedicated to USB token applications

NVM / 凌捷掩膜: 500.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: Dual 16-bit Certifications: CC EAL6+ high Certifications: EMVCo RAM: 12.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: Integrity Guard Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Leading Technologies: Mega Memory Applications: government identification Delivery Forms: contact-based module Delivery Forms: sawn wafer Interfaces: ISO 7816 Product Description: security cryptocontroller
NVM / 凌捷掩膜: 500.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: Dual 16-bit Certifications: CC EAL6+ high Certifications: EMVCo RAM: 12.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: Integrity Guard Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Applications: USB token Delivery Forms: sawn wafer Interfaces: ISO 7816 Interfaces: USB 2.0 Product Description: USB-security cryptocontroller for use in chipcard formfactor
NVM / 凌捷掩膜: 500.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: Dual 16-bit Certifications: CC EAL6+ high Certifications: EMVCo RAM: 12.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Symmetric Cryptography: ECC Symmetric Cryptography: RSA User ROM: 182.0kByte Leading Technologies: Integrity Guard Leading Technologies: NFC optimized Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Applications: NFC Delivery Forms: sawn wafer Interfaces: ACLB Interfaces: GPIOs
Interfaces: ISO 7816 Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1) Interfaces: SPI Product Description: Boosted NFC secure element (SE)
NVM / 凌捷掩膜: 300.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: Dual 16-bit Certifications: EMVCo Certifications: CC EAL6+ high RAM: 12.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: Integrity Guard Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Applications: USB token Delivery Forms: sawn wafer Delivery Forms: SMD Delivery Forms: VQFN-32 Interfaces: USB 2.0 Interfaces: ISO 7816 Package: VQFN-32 Product Description: USB-security cryptocontroller
Ambient Temperature max: 105.0°C CPU: 32-bit Certifications: CC EAL5+ high Certifications: EMVCo Leading Technologies: SOLID FLASH™ NVM / 凌捷掩膜: 504.0kByte RAM: 24.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit Applications: USB token Delivery Forms: sawn wafer Delivery Forms: VQFN-32 Interfaces: 4 GPIOs Interfaces: I2C Interfaces: ISO 7816 Interfaces: SPI Interfaces: USB 2.0 Package: VQFN-32 Product Description: multi-interface USB-security cryptocontroller for industrial use
NVM / 凌捷掩膜: 628.0kByte CPU: Dual 16-bit Certifications: CC EAL6+ high Certifications: EMVCo RAM: 12.0kByte Symmetric Cryptography: RSA up to 4096-bit Symmetric Cryptography: ECC up to 521-bit User ROM: 444.0kByte Leading Technologies: Integrity Guard Leading Technologies: Mega Memory Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Applications: government identification Delivery Forms: contactless module Delivery Forms: dual-interface module Delivery Forms: sawn wafer Interfaces: ISO 14443 A/B Interfaces: ISO 18092 passive mode Interfaces: ISO 7816 Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1) Product Description: contactless security cryptocontroller with dual-interface
NVM / 凌捷掩膜: 1.0MByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: 32-bit Certifications: CC EAL5+ high Certifications: EMVCo RAM: 32.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: NFC optimized Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Applications: SIM and UICC for mobile communication Delivery Forms: sawn wafer Delivery Forms: SMD Interfaces: ISO 7816 Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1) Interfaces: SWP Product Description: 32-bit SWP SIM card security cryptocontroller Use Cases: SIM and UICC for mobile communication Use Cases: SWP UICC for NFC

SLC38DUL800A8


数据:
分类: 微电路 / 半导体集成电路 / 专用集成电路(ASIC)

描述: Infineon ID Key S USB - SLC38DU

Applications: FIDO security keys Applications: authentication & access tokens Applications: USB tokens Applications: software protection dongles Applications: cold wallet tokens Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: 32-bit Arm® SecurCore® SC300 Certifications: CC EAL6+ high Delivery Forms: VQFN28 Interfaces: ISO 14443 A/B Interfaces: ISO 18092 passive mode Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1) Interfaces: USB 2.0 Interfaces: ISO 7816 Interfaces: I2C Interfaces: GPIOs Product Description: USB-security cryptocontroller with contactless interface RAM: 24.0kByte Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES Symmetric Cryptography: 3DES NVM / 凌捷掩膜: 800.0kByte Ambient Temperature max: 85.0°C Leading Technologies: SOLID FLASH™ Leading Technologies: USB and NFC optimized Leading Technologies: Mega Memory