Product Description: Block chain solution on Java Card platform Leading Technologies: Integrity Guard SOLID FLASH™ Symmetric Cryptography: AES up to 256-bit Use Cases: Logistics Use Cases: Energy Use Cases: Asset & Contract management Use Cases: Automotive & Mobility Use Cases: Consumer Use Cases: Crypto Currencies Asymmetric Cryptography: ECC [secp256k1 curve] Interfaces: ISO 14443 CL, ISO 7816 CB [dual interface]

Applications: government identification Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 2048-bit Certifications: eMRTD CC EAL5+ high targeted EEPROM: 80.0kByte Interfaces: ISO 14443 A/B Interfaces: ISO 14443 VHBR Interfaces: ISO 7816 Leading Technologies: Integrity Guard Leading Technologies: SOLID FLASH™ Leading Technologies: VHBR OS Provider: SECORA™ ID S Version 1.0 Supported Standards: GP 2.3.1 Supported Standards: JC 3.0.5 Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: 3DES Use Cases: Nationel eID Use Cases: ePassport Use Cases: eHealth card Use Cases: eDrivers License 更多

Applications: government identification Asymmetric Cryptography: ECC up to xxx-bit Asymmetric Cryptography: RSA up to xxxx-bit Certifications: eMRTD CC EAL5+ high targeted Interfaces: ISO 14443 A/B Interfaces: ISO 14443 VHBR Interfaces: ISO 7816 Leading Technologies: Integrity Guard Leading Technologies: SOLID FLASH™ Leading Technologies: VHBR OS Provider: SECORA™ ID S Version 1.0 Supported Standards: GP 2.3.1 Supported Standards: JC 3.0.5 Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: 3DES Use Cases: National eID Use Cases: ePassport Use Cases: eHealth card Use Cases: eDrivers License Use Cases: eSignature Use Cases: ISO7816-4 Data structure for customization

Interfaces: SWI EEPROM: 2.0kBit CPU: n/a Symmetric Cryptography: 80BIT_MAC Asymmetric Cryptography: 163bits ICC Ambient Temperature max: 85.0°C Certifications: n/a Delivery Forms: TSPN6-16 Use Cases: Mobile device battery authentication Applications: Mobile devices Applications: Small electronic devices

Applications: Government Identification Ambient Temperature max: 85.0°C Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit Certifications: EMVCo Certifications: CC EAL6+ high Delivery Forms: contactless module Delivery Forms: dual-interface module Delivery Forms: sawn wafer Interfaces: ISO 14443 A/B Interfaces: Very High Bit Rates (VHBR) Interfaces: ISO 7816 NVM / 凌捷掩膜: 360.0kByte RAM: 20.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES Symmetric Cryptography: 3DES Product Description: SLC26GDA360 CPU: TEGRION™ 32-bit Arm® v8-M

Ambient Temperature max: 85.0°C Applications: Payment Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit Certifications: EMVco Certifications: CC EAL6+ Delivery Forms: Wafer 150 µm Delivery Forms: CoM 6 PIN Interfaces: ISO 7816 Interfaces: ISO 14443 A/B Interfaces: Optimized for small antenna sizes Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1) NVM / 凌捷掩膜: 360.0kByte RAM: 20.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES CPU: TEGRION™ 32-bit Arm® v8-M

Ambient Temperature max: 85.0°C Applications: Payment Certifications: EMVco NVM / 凌捷掩膜: 360.0kByte RAM: 20.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit Delivery Forms: Wafer 150 µm Delivery Forms: CoM 6 PIN Interfaces: ISO 7816 Interfaces: optimized for small antenna sizes Interfaces: NRG™ (ISO/IEC 14443-3 type A with CRYPTO1) Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Interfaces: ISO 14443 A CPU: TEGRION™ 32-bit Arm® v8-M

Ambient Temperature max: 85.0°C Applications: Payment Certifications: EMVco NVM / 凌捷掩膜: 360.0kByte RAM: 20.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit Delivery Forms: Wafer 150 µm Delivery Forms: CoM 6 PIN Interfaces: ISO 7816 Interfaces: ISO 14443 A Interfaces: optimized for small antenna sizes Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES CPU: TEGRION™ 32-bit Arm® v8-M

NVM / 凌捷掩膜: 348.0kByte Asymmetric Cryptography: ECC up to 521-bit Asymmetric Cryptography: RSA up to 4096-bit CPU: 16-bit Certifications: CC EAL6+ high Certifications: EMVCo RAM: 10.0kByte Symmetric Cryptography: AES up to 256-bit Symmetric Cryptography: DES, 3DES Leading Technologies: Coil on Module Leading Technologies: SOLID FLASH™ Ambient Temperature max: 85.0°C Certifications: CUP Applications: payment Delivery Forms: Coil on Module Delivery Forms: contactless module Delivery Forms: dual-interface module Delivery Forms: sawn wafer Interfaces: ISO 18092 passive mode Interfaces: ISO 7816 更多