SLC26PDA360N9
分类: 微电路 / 半导体集成电路 / 专用集成电路(ASIC)
描述: TEGRION™ 28nm security controllers for payment applications
Ambient Temperature max: 85.0°C
Applications: Payment
NVM / 凌捷掩膜: 360.0kByte
RAM: 20.0kByte
Asymmetric Cryptography: ECC up to 521-bit
Asymmetric Cryptography: RSA up to 4096-bit
Certifications: EMVco
Certifications: CC EAL6+
Delivery Forms: Wafer 150 µm
Delivery Forms: CoM 6 PIN
Interfaces: ISO 7816
Interfaces: optimized for small antenna sizes
Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
Interfaces: ISO 14443 A/B
CPU: TEGRION™ 32-bit Arm® v8-M
NVM / 凌捷掩膜: 348.0kByte
Asymmetric Cryptography: ECC up to 521-bit
Asymmetric Cryptography: RSA up to 4096-bit
CPU: 16-bit
Certifications: CUP
Certifications: EMVCo
RAM: 10.0kByte
Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
Leading Technologies: Coil on Module
Leading Technologies: SOLID FLASH™
Ambient Temperature max: 85.0°C
Certifications: CC EAL6+ high
Applications: payment
Delivery Forms: Coil on Module
Delivery Forms: contactless module
Delivery Forms: dual-interface module
Delivery Forms: sawn wafer
Interfaces: optimized for small antenna sizes
Interfaces: ISO 18092 passive mode
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Interfaces: ISO 7816
Interfaces: ISO 14443 A/B
Interfaces: optional NRG™ (ISO/IEC 14443-3 type A with CRYPTO1)
Package: MCC8
Product Description: dual-interface and contactless security cryptocontroller
NVM / 凌捷掩膜: 300.0kByte
Asymmetric Cryptography: ECC up to 521-bit
Asymmetric Cryptography: RSA up to 4096-bit
CPU: 16-bit
Certifications: CC EAL6+ high
Certifications: EMVCo
RAM: 8.0kByte
Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
Leading Technologies: SOLID FLASH™
Ambient Temperature max: 85.0°C
Applications: payment
Delivery Forms: MFC6.6
Delivery Forms: MFC6.8
Delivery Forms: sawn wafer
Interfaces: ISO 7816
Product Description: contact-based security cryptocontroller
SLC36PDZXXX
分类: 微电路 / 半导体集成电路 / 专用集成电路(ASIC)
描述: 40nm SLC3x products enhance user experience for excellent performance and flexibility
Ambient Temperature max: 85.0°C
Applications: payment
Asymmetric Cryptography: ECC up to 521-bit
Asymmetric Cryptography: RSA up to 4096-bit
CPU: 32-bit Arm® SecurCore® SC300
Certifications: CC EAL6+ high targeted
Certifications: EMVCo (targeted)
Delivery Forms: sawn wafer
Delivery Forms: bumped wafer
Delivery Forms: 6/8 pin dual-interface modules and contactless modules
Interfaces: ISO 7816 / I2C
Interfaces: ISO 14443 A/B
Interfaces: ISO 18092 passive mode
Interfaces: optimized for small antenna sizes
Interfaces: optional NRG™ (ISO/IEC 14443-3 type A with CRYPTO1)
Leading Technologies: SOLID FLASH™
Leading Technologies: Coil on Module
NVM / 凌捷掩膜 max: 352.0kByte
RAM: 12.0kByte
Certifications: CUP (targeted)
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Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
SLC38BML800
分类: 微电路 / 半导体集成电路 / 专用集成电路(ASIC)
描述: Dual-interface security cryptocontroller with additional interfaces optimized for biometric card applications in combination with fingerprint sensors
Product Description: Dual-interface security cryptocontroller
Leading Technologies: SOLID FLASH™
Applications: payment
Interfaces: UART
Interfaces: GPIO
Interfaces: I2C slave
Interfaces: 2-wire SPI master functionality
Interfaces: ISO/IEC 7816
Interfaces: ISO/IEC 14443 A/B
Interfaces: ISO/IEC 18092 (NFC passive mode)
NVM / 凌捷掩膜: 800.0kByte
RAM: 24.0kByte
CPU: 32-bit
Symmetric Cryptography: DES
Symmetric Cryptography: 3-DES
Symmetric Cryptography: AES up to 256-bit
Asymmetric Cryptography: RSA up to 4096-bit
Asymmetric Cryptography: ECC up to 521-bit
Ambient Temperature max: 85.0°C
Certifications: EMVCo
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Certifications: CC EAL6+ high
Delivery Forms: Wafer sawn
Delivery Forms: X2QFN-24-1
Delivery Forms: Wafer sawn
SLC39BML1M0F7
分类: 微电路 / 半导体集成电路 / 专用集成电路(ASIC)
描述: Dual-interface security cryptocontroller with additional interfaces optimized for biometric card applications in combination with fingerprint sensors
Leading Technologies: SOLID FLASH™
Applications: payment
Interfaces: UART
Interfaces: GPIO
Interfaces: I2C slave
Interfaces: I2C master
Interfaces: SPI master
Interfaces: Power Source
Interfaces: Contactless interface (RFI)
Interfaces: ISO/IEC 7816 contact-based interface
Interfaces: ISO/IEC 14443 Type A and B
Interfaces: ISO/IEC 18092 (NFC passive mode)
Interfaces: Optional NRG™ (ISO/IEC 14443-3 Type A with CRYPTO1)
NVM / 凌捷掩膜: 1024.0kByte
RAM: 96.0kByte
CPU: 32-bit
Symmetric Cryptography: DES
Symmetric Cryptography: 3-DES
Symmetric Cryptography: AES up to 256-bit
Asymmetric Cryptography: RSA up to 4096-bit
更多
Asymmetric Cryptography: ECC up to 521-bit
Ambient Temperature max: 85.0°C
Certifications: EMVCo
Certifications: CC EAL6+ high
Delivery Forms: X2QFN-24-1
Delivery Forms: Wafer sawn
SLC39BIL800F3
分类: 微电路 / 半导体集成电路 / 专用集成电路(ASIC)
描述: Dual-interface security cryptocontroller with additional interfaces optimized for biometric card applications in combination with fingerprint sensors
Leading Technologies: SOLID FLASH™
Applications: payment
Interfaces: UART
Interfaces: GPIO
Interfaces: I2C master
Interfaces: Power Source
Interfaces: Contactless interface (RFI)
Interfaces: ISO/IEC 7816 contact-based interface
Interfaces: ISO/IEC 14443 Type A and B
Interfaces: ISO/IEC 18092 (NFC passive mode)
Interfaces: Optional NRG™ (ISO/IEC 14443-3 Type A with CRYPTO1)
NVM / 凌捷掩膜: 800.0kByte
RAM: 64.0kByte
CPU: 32-bit
Symmetric Cryptography: DES
Symmetric Cryptography: 3-DES
Symmetric Cryptography: AES up to 256-bit
Asymmetric Cryptography: RSA up to 4096-bit
Asymmetric Cryptography: ECC up to 521-bit
Ambient Temperature max: 85.0°C
更多
Certifications: EMVCo
Certifications: CC EAL6+ high
Delivery Forms: X2QFN-24-1
Delivery Forms: Wafer sawn
SLC3XGDAXXX
分类: 微电路 / 半导体集成电路 / 专用集成电路(ASIC)
描述: Dual-Interface security controllers with SOLID FLASH™ and 32-bit Arm® SecurCore® SC300 technology for government identification
Product Description: dual-interface security cryptocontroller
Leading Technologies: SOLID FLASH™
Leading Technologies: Very High Bit Rates (VHBR)
Leading Technologies: Coil on Module
Leading Technologies: Mega Memory
Applications: government identification
Interfaces: ISO 7816
Interfaces: ISO 14443 A/B
Interfaces: ISO 18092 passive mode
Interfaces: optional NRG™ (ISO/IEC 14443-3 type A with CRYPTO1)
NVM / 凌捷掩膜 max: 352.0kByte
NVM / 凌捷掩膜 max: 512.0kByte
NVM / 凌捷掩膜 max: 800.0kByte
RAM: 16.0kByte
RAM: 24.0kByte
CPU: 32-bit Arm® SecurCore® SC300
Symmetric Cryptography: AES up to 256-bit
Symmetric Cryptography: DES, 3DES
Asymmetric Cryptography: ECC up to 521-bit
Asymmetric Cryptography: RSA up to 4096-bit
更多
Delivery Forms: sawn wafer
Delivery Forms: bumped wafer
Delivery Forms: Coil on Module
Delivery Forms: dual-interface and contactless modules
Certifications: CC EAL6+ high
Certifications: EMVCo
Ambient Temperature max: 85.0°C
SLC39BSL800F2
分类: 微电路 / 半导体集成电路 / 专用集成电路(ASIC)
描述: Dual-interface security cryptocontroller with additional interfaces optimized for biometric card applications in combination with fingerprint sensors
Leading Technologies: SOLID FLASH™
Applications: payment
Interfaces: UART
Interfaces: GPIO
Interfaces: SPI master
Interfaces: Power Source
Interfaces: Contactless interface (RFI)
Interfaces: ISO/IEC 7816 contact-based interface
Interfaces: ISO/IEC 14443 Type A and B
Interfaces: ISO/IEC 18092 (NFC passive mode)
Interfaces: Optional NRG™ (ISO/IEC 14443-3 Type A with CRYPTO1)
NVM / 凌捷掩膜: 800.0kByte
RAM: 32.0kByte
CPU: 32-bit
Symmetric Cryptography: DES
Symmetric Cryptography: 3-DES
Symmetric Cryptography: AES up to 256-bit
Asymmetric Cryptography: RSA up to 4096-bit
Asymmetric Cryptography: ECC up to 521-bit
Ambient Temperature max: 85.0°C
更多
Certifications: EMVCo
Certifications: CC EAL6+ high
Delivery Forms: X2QFN-24-1
Delivery Forms: Wafer sawn