物料参数
| Leading Technologies: | SOLID FLASH™ |
| Applications: | payment |
| Interfaces: | UART |
| Interfaces: | GPIO |
| Interfaces: | SPI master |
| Interfaces: | Power Source |
| Interfaces: | Contactless interface (RFI) |
| Interfaces: | ISO/IEC 7816 contact-based interface |
| Interfaces: | ISO/IEC 14443 Type A and B |
| Interfaces: | ISO/IEC 18092 (NFC passive mode) |
| Interfaces: | Optional NRG™ (ISO/IEC 14443-3 Type A with CRYPTO1) |
| NVM / 凌捷掩膜: | 800.0kByte |
| RAM: | 32.0kByte |
| CPU: | 32-bit |
| Symmetric Cryptography: | DES |
| Symmetric Cryptography: | 3-DES |
| Symmetric Cryptography: | AES up to 256-bit |
| Asymmetric Cryptography: | RSA up to 4096-bit |
| Asymmetric Cryptography: | ECC up to 521-bit |
| Ambient Temperature: | None°C |
| Ambient Temperature: | None°C |
| Certifications: | EMVCo |
| Certifications: | CC EAL6+ high |
| Delivery Forms: | X2QFN-24-1 |
| Delivery Forms: | Wafer sawn |
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