Family: HS-T Interface Frequency (SDR/DDR)(MHz): - / 200 Interface Bandwidth: 400.0MByte/s Interfaces: HYPERBUS Flash Density: 512.0MBit RAM Density: 64.0MBit Qualification: Automotive Lead Ball Finish: Sn/Ag/Cu Peak Reflow Temp: 260.0°C Operating Temperature: None°C Operating Voltage: 1.8V

Family: KS-S Interface Frequency (SDR/DDR)(MHz): - / 166 Operating Temperature: None°C Operating Voltage: 1.8V Peak Reflow Temp: 260.0°C Initial Access Time: 96.0ns Interface Bandwidth: 333.0MByte/s Interfaces: HYPERBUS Qualification: Industrial RAM Density: 64.0MBit Flash Density: 512.0MBit Lead Ball Finish: Sn/Ag/Cu Density: 512.0MBit

Family: KL-S Initial Access Time: 96.0ns Interface Frequency (SDR/DDR)(MHz): - / 100 Operating Temperature: None°C Peak Reflow Temp: 260.0°C Operating Voltage: 3.0V Interface Bandwidth: 200.0MByte/s Interfaces: HYPERBUS Qualification: Automotive RAM Density: 64.0MBit Flash Density: 256.0MBit Lead Ball Finish: Sn/Ag/Cu Density: 256.0MBit

Interface Frequency (SDR/DDR)(MHz): - / 100 Operating Temperature: None°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Bus Width: x8 Initial Access Time: 96.0ns Family: KL-S Technology: HYPERRAM + HYPERFLASH MCP Interface Bandwidth: 200.0MByte/s Interfaces: HYPERBUS Qualification: Automotive Flash Density: 512.0MBit RAM Density: 64.0MBit Lead Ball Finish: Sn/Ag/Cu Density: 512.0MBit

Family: KL-S Interface Frequency (SDR/DDR)(MHz): - / 100 Operating Temperature: None°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Initial Access Time: 96.0ns Interface Bandwidth: 200.0MByte/s Interfaces: HYPERBUS Qualification: Automotive Flash Density: 256.0MBit RAM Density: 64.0MBit Lead Ball Finish: Sn/Ag/Cu Density: 256.0MBit

Bus Width: x8 Family: KL-S Interface Frequency (SDR/DDR)(MHz): - / 100 Operating Temperature: None°C Operating Voltage: 3.0V Peak Reflow Temp: 260.0°C Initial Access Time: 96.0ns Technology: HYPERRAM + HYPERFLASH MCP Interface Bandwidth: 200.0MByte/s Interfaces: HYPERBUS Qualification: Automotive Flash Density: 512.0MBit RAM Density: 64.0MBit Lead Ball Finish: Sn/Ag/Cu Density: 512.0MBit

Pitch: 14.25mm Product Name: P-M4.8 Product Description: contact-based module Dimensions: 13 x 11.8mm Thickness: max. 600μm Contact Surface: NiAu ISO – Reference: ISO 7816-1 Delivery Forms: Tape on Reel Applications: payment Product Description: 8 contacts Product Description: epoxy tape Product Description: wire bond Product Description: mold Derivatives: Pd surface Applications: government identification ISO – Reference: ISO 7810 ISO – Reference: ISO 10373-1/-3 Derivatives: Au surface

Pitch: 9.5mm Product Name: S-MFC6.6 Product Description: contact-based module Dimensions: 11 x 8.3mm Thickness: max. 420µm Contact Surface: NiAu ISO – Reference: ISO 7816-1 Delivery Forms: Tape on Reel Applications: payment Derivatives: Pd surface Applications: government identification ISO – Reference: ISO 7810 ISO – Reference: ISO 10373-1/-3 Derivatives: Au surface Product Description: 6 contacts

Product Description: contact-based module Pitch: 14.25mm Dimensions: 13 x 11.8mm Contact Surface: NiAu ISO – Reference: ISO 7816-1 Derivatives: Pd surface Delivery Forms: Tape on Reel Thickness: max. 420µm Applications: government identification Applications: authentication Product Name: S-MID4.8 ISO – Reference: ISO 7810 ISO – Reference: ISO 10373-1/-3 Product Description: for high demanding applications Product Description: 10 years life time Derivatives: Au surface

Pitch: 9.5mm Product Name: P-MCS8-2-1 Product Description: thin contactless module Dimensions: 8.1 x 5.15mm Thickness: max. 250µm Contact Surface: Ag ISO – Reference: ISO 7816-1 Delivery Forms: Tape on Reel Applications: payment Product Description: mold Applications: government identification ISO – Reference: ISO 7810 ISO – Reference: ISO 10373-1/-3 ISO – Reference: ISO 14443