FS1150R08A8P3LMC
制造商:
描述: This HybridPACK™ Drive G2 module is a very compact six-pack power module with enhanced package optimized for hybrid and electric vehicles
物料参数
| Configuration: | Sixpack |
| Technology: | IGBT EDT3 |
| I[C(nom)] / I[F(nom)]: | 1150.0A |
| V[CES](Tvj=25°C typ): | 750.0V |
| V[CE(sat)](Tvj=25°C typ): | 1.08V |
| Features: | PinFin Base Plate |
| Features: | Long Tabs |
| Housing: | HybridPACK™ Drive G2 |
| Qualification: | Automotive |
| Currently planned availability until at least: | 2038 |
| Launch year: | 2024 |