物料参数
| Configuration: | Half-bridge module |
| Cooling Concept: | Indirect cooling |
| Dimensions(length): | 51.0mm |
| Dimensions(width): | 42.5mm |
| Features: | PressFIT |
| Housing: | EasyPACK™ 2B |
| I[C(nom)] / I[F(nom)]: | 300.0A |
| Qualification: | Automotive |
| Technology: | IGBT EDT2 |
| V[CE(sat)](Tvj=25°C typ): | 1.0V |
| V[CES](Tvj=25°C typ): | 750.0V |
| V[F]: | 1.43V |
| Voltage Class max: | 750.0V |
| Currently planned availability until at least: | 2038 |
| Launch year: | 2021 |
