FF300R08W2P2_B11A

制造商:

描述: EasyPACK™ 2B 750V, 300A half bridge automotive qualified IGBT module

物料参数

Configuration:Half-bridge module
Cooling Concept:Indirect cooling
Dimensions(length):51.0mm
Dimensions(width):42.5mm
Features:PressFIT
Housing:EasyPACK™ 2B
I[C(nom)] / I[F(nom)]:300.0A
Qualification:Automotive
Technology:IGBT EDT2
V[CE(sat)](Tvj=25°C typ):1.0V
V[CES](Tvj=25°C typ):750.0V
V[F]:1.43V
Voltage Class max:750.0V
Currently planned availability until at least:2038
Launch year:2021