物料参数
| Technology: | IGBT |
| Configuration: | Sixpack |
| I[C(nom)] / I[F(nom)]: | 520.0A |
| V[CES](Tvj=25°C typ): | 1200.0V |
| V[CE(sat)](Tvj=25°C typ): | 1.48V |
| Features: | PinFin Base Plate |
| Features: | long Tabs |
| Housing: | HybridPACK™ Drive G2 |
| Currently planned availability until at least: | 2038 |
| Launch year: | 2024 |
