物料参数
| Configuration: | Sixpack |
| Features: | PinFin Base Plate |
| Features: | short Tabs |
| Housing: | HybridPACK™ Drive G2 |
| Qualification: | Automotive |
| Technology: | CoolSiC™ G2 |
| Currently planned availability until at least: | 2040 |
| Launch year: | 2024 |
| Family: | Silicon Carbide MOSFET Modules |
