INFINEON
Infineon 英飞凌专注于迎接现代社会的三大科技挑战： 高能效、 移动性和 安全性，为汽车和工业功率器件、芯片卡和安全应用提供半导体和系统解决方案。英飞凌的产品素以高可靠性、卓越质量和创新性著称，并在模拟和混合信号、射频、功率以及嵌入式控制装置领域掌握尖端技术。
IR: NoneµA
VESD: NonekV
Rdyn(reverse): 0.09Ω
CL: NonepF
Rdyn(forward): 0.12Ω
VWM: 3.3V
Vcl typ. reverse(@16A): 5.8V
IPP: 20A
IEFT: 80A
Vcl typ. reverse(TLP 30A): 7.3
Protected Lines: 4
Vcl typ. reverse(TLP 16A): 5.8
Configuration: unidirectional
Family: HS-T
Interface Frequency (SDR/DDR)(MHz): 166 / 200
Interface Bandwidth: 400.0MByte/s
Interfaces: Octal
Qualification: Automotive
Classification: ISO 26262-compliant
Lead Ball Finish: Sn/Ag/Cu
Peak Reflow Temp: 260.0°C
Operating Temperature max: 105.0°C
Operating Voltage: 1.8V
Density: 256.0MBit
Currently planned availability until at least: 2035
Family: HS-T
Interface Frequency (SDR/DDR)(MHz): 166 / 200
Interface Bandwidth: 400.0MByte/s
Interfaces: Octal
Qualification: Automotive
Classification: ISO 26262-compliant
Lead Ball Finish: Sn/Ag/Cu
Peak Reflow Temp: 260.0°C
Operating Temperature max: 125.0°C
Operating Voltage: 1.8V
Density: 256.0MBit
Currently planned availability until at least: 2035
I[R] max: 50.0µA
V[ESD] max: 12.0kV
R[dyn](reverse): 1.3Ω
C[L ]: 0.1pF
R[dyn](forward): 1.3Ω
V[cl typ. reverse](@16A) max: 29.0V
Protected Lines: 1
V[cl typ. reverse](TLP 16A): 29
V[WM] max: 5.5V
V[WM] min: -5.5V
I[EFT ]: 30 A
I[PP]: 2 A
Family: HS-T
Interface Frequency (SDR/DDR)(MHz): 166 / 200
Interface Bandwidth: 400.0MByte/s
Interfaces: Octal
Qualification: Automotive
Classification: ISO 26262-compliant
Lead Ball Finish: Sn/Ag/Cu
Peak Reflow Temp: 260.0°C
Operating Temperature max: 125.0°C
Operating Voltage: 1.8V
Density: 256.0MBit
Currently planned availability until at least: 2035
Family: HS-T
Interface Frequency (SDR/DDR)(MHz): 166 / 200
Interface Bandwidth: 400.0MByte/s
Interfaces: Octal
Qualification: Automotive
Classification: ISO 26262-compliant
Lead Ball Finish: Sn/Ag/Cu
Peak Reflow Temp: 260.0°C
Operating Temperature max: 105.0°C
Operating Voltage: 1.8V
Density: 256.0MBit
Currently planned availability until at least: 2035
Family: HS-T
Interface Frequency (SDR/DDR)(MHz): 166 / 200
Interface Bandwidth: 400.0MByte/s
Interfaces: Octal
Qualification: Automotive
Classification: ISO 26262-compliant
Lead Ball Finish: Sn/Ag/Cu
Peak Reflow Temp: 260.0°C
Operating Temperature max: 125.0°C
Operating Voltage: 1.8V
Density: 256.0MBit
Currently planned availability until at least: 2035
Family: HS-T
Interface Frequency (SDR/DDR)(MHz): 166 / 200
Interface Bandwidth: 400.0MByte/s
Interfaces: Octal
Qualification: Automotive
Classification: ISO 26262-compliant
Lead Ball Finish: Sn/Ag/Cu
Peak Reflow Temp: 260.0°C
Operating Temperature max: 105.0°C
Operating Voltage: 1.8V
Density: 256.0MBit
Currently planned availability until at least: 2035
Family: HL-T
Interface Frequency (SDR/DDR)(MHz): 166/166
Interface Bandwidth: 333.0MByte/s
Interfaces: Octal
Qualification: Automotive
Classification: ISO 26262-compliant
Lead Ball Finish: Sn/Ag/Cu
Peak Reflow Temp: 260.0°C
Operating Temperature max: 105.0°C
Operating Voltage: 3.0V
Density: 256.0MBit
Currently planned availability until at least: 2035
I[R]: 1.0nA
V[ESD] max: 25.0kV
R[dyn](reverse): 0.38Ω
C[L ]: 0.3pF
R[dyn](forward): 0.38Ω
V[cl typ. reverse](@16A): 13.0V
I[PP]: 5A
I[EFT ]: 50A
V[cl typ. reverse](TLP 30A): 19V
Protected Lines: 1
V[cl typ. reverse](TLP 16A): 13V
V[WM] max: 5.5V