INFINEON
Infineon 英飞凌专注于迎接现代社会的三大科技挑战： 高能效、 移动性和 安全性，为汽车和工业功率器件、芯片卡和安全应用提供半导体和系统解决方案。英飞凌的产品素以高可靠性、卓越质量和创新性著称，并在模拟和混合信号、射频、功率以及嵌入式控制装置领域掌握尖端技术。
Family: HS-T
Interface Frequency (SDR/DDR)(MHz): - / 200
Operating Temperature max: 105.0°C
Operating Voltage: 1.8V
Peak Reflow Temp: 260.0°C
Interface Bandwidth: 400.0MByte/s
Interfaces: HYPERBUS
Qualification: Automotive
Lead Ball Finish: Sn/Ag/Cu
Classification: ISO 26262-compliant
Density: 512.0MBit
Currently planned availability until at least: 2035
Qualification: Automotive
Family: HS-T
Publish in NPSG: N
Publish in PSG: N
Interface Bandwidth: 400.0MByte/s
Interfaces: HYPERBUS
Peak Reflow Temp: 260.0°C
Operating Temperature max: 125.0°C
Operating Voltage: 1.8V
Lead Ball Finish: Sn/Ag/Cu
Interface Frequency (SDR/DDR)(MHz): - / 200
Classification: ISO 26262-compliant
Density: 1.0GBit
Currently planned availability until at least: 2035
I[R]: 1.0nA
V[ESD] max: 20.0kV
R[dyn](reverse): 1.0Ω
C[L ]: 0.23pF
R[dyn](forward): 1.0Ω
V[cl typ. reverse](@16A): 29.0V
I[PP]: 3A
I[EFT ]: 40A
V[cl typ. reverse](TLP 30A): 38V
Protected Lines: 1
V[cl typ. reverse](TLP 16A): 29V
V[WM] max: 5.3V
Qualification: Automotive
Family: HS-T
Publish in NPSG: N
Publish in PSG: N
Interface Bandwidth: 400.0MByte/s
Interfaces: Octal
Peak Reflow Temp: 260.0°C
Operating Temperature max: 125.0°C
Operating Voltage: 1.8V
Lead Ball Finish: Sn/Ag/Cu
Interface Frequency (SDR/DDR)(MHz): 166 / 200
Classification: ISO 26262-compliant
Density: 1.0GBit
Currently planned availability until at least: 2035
Family: HS-T
Interface Frequency (SDR/DDR)(MHz): - / 200
Operating Temperature max: 85.0°C
Operating Voltage: 1.8V
Peak Reflow Temp: 260.0°C
Interface Bandwidth: 333.0MByte/s
Interfaces: HYPERBUS
Qualification: Automotive
Lead Ball Finish: Sn/Ag/Cu
Classification: ISO 26262-compliant
Density: 1.0GBit
Currently planned availability until at least: 2035
Operating Voltage: 1.8V
Operating Temperature max: 105.0°C
Family: HS-T
Peak Reflow Temp: 260.0°C
Interface Frequency (SDR/DDR)(MHz): - / 166
Interface Bandwidth: 333.0MByte/s
Interfaces: HYPERBUS
Qualification: Automotive
Lead Ball Finish: Sn/Ag/Cu
Classification: ISO 26262-compliant
Density: 1.0GBit
Currently planned availability until at least: 2035
Qualification: Automotive
Family: HS-T
Publish in NPSG: N
Publish in PSG: N
Interface Bandwidth: 400.0MByte/s
Interfaces: Octal
Peak Reflow Temp: 260.0°C
Operating Temperature max: 105.0°C
Operating Voltage: 1.8V
Lead Ball Finish: Sn/Ag/Cu
Interface Frequency (SDR/DDR)(MHz): 166 / 200
Classification: ISO 26262-compliant
Density: 1.0GBit
Currently planned availability until at least: 2035
Family: HS-T
Interface Frequency (SDR/DDR)(MHz): 166 / 166
Operating Temperature max: 105.0°C
Operating Voltage: 3.0V
Peak Reflow Temp: 260.0°C
Interfaces: Octal
Interface Bandwidth: 333.0MByte/s
Qualification: Industrial
Lead Ball Finish: Sn/Ag/Cu
Density: 512.0MBit
Currently planned availability until at least: 2035
S28HS512TGABHM010
分类: 微电路 / 半导体集成电路 / 数字集成电路 / 存储器 / 快闪存储器(Flash)数据:
简介: High-speed, ISO 26262-compliant 512Mbit HS-T memory with 400MByte/s interface bandwidth, ideal for automotive applications
Interface Frequency (SDR/DDR)(MHz): 200 / 200
Operating Temperature max: 125.0°C
Operating Voltage: 1.8V
Peak Reflow Temp: 260.0°C
Family: HS-T
Interface Bandwidth: 400.0MByte/s
Qualification: Automotive
Lead Ball Finish: Sn/Ag/Cu
Interfaces: Octal
Classification: ISO 26262-compliant
Density: 512.0MBit
Currently planned availability until at least: 2035
Qualification: Automotive
Family: HS-T
Publish in NPSG: N
Publish in PSG: N
Interface Bandwidth: 333.0MByte/s
Interfaces: HYPERBUS
Peak Reflow Temp: 260.0°C
Operating Temperature max: 105.0°C
Operating Voltage: 1.8V
Lead Ball Finish: Sn/Ag/Cu
Interface Frequency (SDR/DDR)(MHz): - / 166
Classification: ISO 26262-compliant
Density: 2.0GBit
Currently planned availability until at least: 2035